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Class Information
Number: 257/E23.072
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for conducting electric current to or from solid-state body in operation, e.g., leads, terminal arrangements (epo) > Consisting of soldered or bonded constructions (epo) > Leads, i.e., metallizations or lead frames on insulating substrates, e.g., chip carriers (epo) > Characterized by materials (epo)
Description: This subclass is indented under subclass E23.06. This subclass is substantially the same in scope as ECLA classification H01L23/498M.

Sub-classes under this class:

Class Number Class Name Patents
257/E23.074 Carbon, e.g., fullerenes (epo) 23
257/E23.075 Conductive materials containing organic materials or pastes, e.g., for thick films (epo) 332
257/E23.073 Conductive materials containing semiconductor material (epo) 17
257/E23.076 Conductive materials containing superconducting material (epo) 32
257/E23.077 Materials of insulating layers or coatings (epo) 429

Patents under this class:
1 2 3 4 5

Patent Number Title Of Patent Date Issued
8637983 Face-to-face (F2F) hybrid structure for an integrated circuit Jan. 28, 2014
8575625 Semiconductor element mounting member, method of producing the same, and semiconductor device Nov. 5, 2013
8399996 Chip carrier Mar. 19, 2013
8395265 Metal silicide nanowires and methods of their production Mar. 12, 2013
8294269 Electronic structures including conductive layers comprising copper and having a thickness of at least 0.5 micrometers Oct. 23, 2012
8288868 Substrate bonding method and semiconductor device Oct. 16, 2012
8212349 Semiconductor package having chip using copper process Jul. 3, 2012
8154129 Electrode structure and semiconductor device Apr. 10, 2012
8072068 Semiconductor device and a method for manufacturing the same Dec. 6, 2011
7928575 Electronic device, method of manufacture of the same, and sputtering target Apr. 19, 2011
7902056 Plasma treated metal silicide layer formation Mar. 8, 2011
7893532 External contact material for external contacts of a semiconductor device and method of making the same Feb. 22, 2011
7888254 Semiconductor device having a refractory metal containing film and method for manufacturing the same Feb. 15, 2011
7804172 Electrical connections made with dissimilar metals Sep. 28, 2010
7786578 Eliminating metal-rich silicides using an amorphous Ni alloy silicide structure Aug. 31, 2010
7772697 Semiconductor device and method for producing the same Aug. 10, 2010
7553754 Electronic device, method of manufacture of the same, and sputtering target Jun. 30, 2009
7476615 Deposition process for iodine-doped ruthenium barrier layers Jan. 13, 2009
7271486 Retarding agglomeration of Ni monosilicide using Ni alloys Sep. 18, 2007
7049836 Anisotropic conductivity connector, conductive paste composition, probe member, and wafer inspection device, and wafer inspecting method May. 23, 2006
7012019 Circuit barrier structure of semiconductor packaging substrate and method for fabricating the same Mar. 14, 2006
7011862 Method for producing wiring substrate Mar. 14, 2006
6972152 Use of direct gold surface finish on a copper wire-bond substrate, methods of making same, and methods of testing same Dec. 6, 2005
6943435 Lead pin with Au-Ge based brazing material Sep. 13, 2005
6864579 Carrier with a metal area and at least one chip configured on the metal area Mar. 8, 2005
6840777 Solderless electronics packaging Jan. 11, 2005
6841885 Wiring substrate Jan. 11, 2005
6833623 Enhanced barrier liner formation for via Dec. 21, 2004
6828233 Enhanced barrier liner formation for vias Dec. 7, 2004
6822323 Semiconductor package having more reliable electrical conductive patterns Nov. 23, 2004
6791182 Semiconductor device Sep. 14, 2004
6791188 Thin film aluminum alloy and sputtering target to form the same Sep. 14, 2004
6772511 Method for producing a semiconductor device Aug. 10, 2004
6759599 Circuit board, method for manufacturing same, and high-output module Jul. 6, 2004
6717264 High density integrated circuit package Apr. 6, 2004
6708398 Substrate for use in package of semiconductor device, semiconductor package using the substrate, and methods for manufacturing the substrate and the semiconductor package Mar. 23, 2004
6707152 Semiconductor device, electrical conductor system, and method of making Mar. 16, 2004
6707158 Semiconductor device and method for producing the same, and anisotropic conductive circuit board Mar. 16, 2004
6614110 Module with bumps for connection and support Sep. 2, 2003
6555762 Electronic package having substrate with electrically conductive through holes filled with polymer and conductive composition Apr. 29, 2003
6538325 Multi-layer conductor system with intermediate buffer layer for improved adhesion to dielectrics Mar. 25, 2003
6528769 Connection of a junction to an electrical conductor track on a plate Mar. 4, 2003
6518649 Tape carrier type semiconductor device with gold/gold bonding of leads to bumps Feb. 11, 2003
6468905 Methods of restricting silicon migration Oct. 22, 2002
6424046 Substrate for manufacturing a semiconductor device with three element alloy Jul. 23, 2002
6404063 Die-to-insert permanent connection and method of forming Jun. 11, 2002
6399475 Process for producing electrical connections on the surface of a semiconductor package with electrical-connection drops Jun. 4, 2002
6387714 Die-to-insert permanent connection and method of forming May. 14, 2002
6352925 Method of making electrical conductor system for semiconductor device Mar. 5, 2002
6331347 Method for forming a gold plating electrode a substrate based on the electrode forming method, and a wire bonding method utilizing this electrode forming method Dec. 18, 2001

1 2 3 4 5

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