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Class Information
Number: 257/E23.071
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for conducting electric current to or from solid-state body in operation, e.g., leads, terminal arrangements (epo) > Consisting of soldered or bonded constructions (epo) > Leads, i.e., metallizations or lead frames on insulating substrates, e.g., chip carriers (epo) > Geometry or layout (epo) > For devices adapted for rectifying, amplifying, oscillating, or switching, capacitors, or resistors with at least one potential-jump barrier or surface barrier (epo)
Description: This subclass is indented under subclass E23.07. This subclass is substantially the same in scope as ECLA classification H01L23/498G8.

Patents under this class:

Patent Number Title Of Patent Date Issued
8432030 Power electronic package having two substrates with multiple semiconductor chips and electronic components Apr. 30, 2013
7999369 Power electronic package having two substrates with multiple semiconductor chips and electronic components Aug. 16, 2011
7989935 Semiconductor device Aug. 2, 2011
7989918 Implementing tamper evident and resistant detection through modulation of capacitance Aug. 2, 2011
7960211 Semiconductor system-in-package and method for making the same Jun. 14, 2011
7944035 Double sided semiconduction device with edge contact and package therefor May. 17, 2011
7692293 Semiconductor switching module Apr. 6, 2010
7679182 Power module and motor integrated control unit Mar. 16, 2010
7612439 Semiconductor package having improved thermal performance Nov. 3, 2009
7569920 Electronic component having at least one vertical semiconductor power transistor Aug. 4, 2009
7466012 Power semiconductor package Dec. 16, 2008
7217597 Die stacking scheme May. 15, 2007
7038917 Low loss, high density array interconnection May. 2, 2006
7023075 Teardrop shaped lead frames Apr. 4, 2006
6989559 Discrete circuit component having fabrication stage clogged through-holes and process of making the same Jan. 24, 2006
6913950 Semiconductor device with chamfered substrate and method of making the same Jul. 5, 2005
6833608 Semiconductor device and packaging system therefore Dec. 21, 2004
6822338 Wiring structure of semiconductor device Nov. 23, 2004
6818969 Semiconductor device Nov. 16, 2004
6809423 Electronic module Oct. 26, 2004
6798060 Power device and direct aluminum bonded substrate thereof Sep. 28, 2004
6706967 Lead-less semiconductor device with improved electrode pattern structure Mar. 16, 2004
6670216 Method for manufacturing a power semiconductor device and direct bonded substrate thereof Dec. 30, 2003
6611049 Semiconductor device with chamfered substrate and method of making the same Aug. 26, 2003
6455925 Power transistor package with integrated flange for surface mount heat removal Sep. 24, 2002
5637922 Wireless radio frequency power semiconductor devices using high density interconnect Jun. 10, 1997
5338974 RF power transistor package Aug. 16, 1994
5324570 Microelectronics package Jun. 28, 1994
5198886 Semiconductor device having a clamping support Mar. 30, 1993
5148264 High current hermetic package Sep. 15, 1992
5023703 Semiconductor device Jun. 11, 1991
4908694 Semiconductor device Mar. 13, 1990
4891686 Semiconductor packaging with ground plane conductor arrangement Jan. 2, 1990
4710795 Semiconductor power module Dec. 1, 1987
4702003 Method of fabricating a freestanding semiconductor connection Oct. 27, 1987
4527010 Electronic part mounting construction and method for manufacturing the same Jul. 2, 1985
4297722 Ceramic package for semiconductor devices having metalized lead patterns formed like a floating island Oct. 27, 1981
4246697 Method of manufacturing RF power semiconductor package Jan. 27, 1981
4067041 Semiconductor device package and method of making same Jan. 3, 1978
4009485 Semiconductor pellet assembly mounted on ceramic substrate Feb. 22, 1977
3950843 Continuous film transistor fabrication process Apr. 20, 1976

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