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Class Information
Number: 257/E23.07
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for conducting electric current to or from solid-state body in operation, e.g., leads, terminal arrangements (epo) > Consisting of soldered or bonded constructions (epo) > Leads, i.e., metallizations or lead frames on insulating substrates, e.g., chip carriers (epo) > Geometry or layout (epo)
Description: This subclass is indented under subclass E23.06. This subclass is substantially the same in scope as ECLA classification H01L23/498G.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7414308 |
Integrated circuit with offset pins |
Aug. 19, 2008 |
| 7402904 |
Semiconductor device having wires that vary in wiring pitch |
Jul. 22, 2008 |
| 7394152 |
Wafer level chip size packaged chip device with an N-shape junction inside and method of fabricating the same |
Jul. 1, 2008 |
| 7385284 |
Transponder incorporated into an electronic device |
Jun. 10, 2008 |
| 7382050 |
Semiconductor device and method for producing the same |
Jun. 3, 2008 |
| 7375421 |
High density multilayer circuit module |
May. 20, 2008 |
| 7371687 |
Electronic circuit device |
May. 13, 2008 |
| 7372139 |
Semiconductor chip package |
May. 13, 2008 |
| 7339260 |
Wiring board providing impedance matching |
Mar. 4, 2008 |
| 7332818 |
Multi-chip electronic package with reduced line skew and circuitized substrate for use therein |
Feb. 19, 2008 |
| 7319272 |
Ball assignment system |
Jan. 15, 2008 |
| 7298036 |
Scaling of functional assignments in packages |
Nov. 20, 2007 |
| 7298040 |
Wire bonding method and apparatus for integrated circuit |
Nov. 20, 2007 |
| 7294853 |
Substrate for mounting a semiconductor |
Nov. 13, 2007 |
| 7288832 |
Chip-mounted film package |
Oct. 30, 2007 |
| 7285850 |
Support elements for semiconductor devices with peripherally located bond pads |
Oct. 23, 2007 |
| 7282805 |
Bond pad rerouting element and stacked semiconductor device assemblies including the rerouting element |
Oct. 16, 2007 |
| 7274109 |
Modular bonding pad structure and method |
Sep. 25, 2007 |
| 7262496 |
Wiring base with wiring extending inside and outside of a mounting region |
Aug. 28, 2007 |
| 7239024 |
Semiconductor package with recess for die |
Jul. 3, 2007 |
| 7235879 |
Semiconductor device and method of manufacturing the same, electronic device and method of manufacturing the same, and electronic instrument |
Jun. 26, 2007 |
| 7199477 |
Multi-tiered lead package for an integrated circuit |
Apr. 3, 2007 |
| 7157789 |
Semiconductor device and method for manufacturing the same |
Jan. 2, 2007 |
| 7144758 |
Manufacturing method of semiconductor device, including differently spaced bump electrode arrays |
Dec. 5, 2006 |
| 7132746 |
Electronic assembly with solder-bonded heat sink |
Nov. 7, 2006 |
| 7122906 |
Die-wafer package and method of fabricating same |
Oct. 17, 2006 |
| 7087943 |
Direct alignment scheme between multiple lithography layers |
Aug. 8, 2006 |
| 7075017 |
Wiring circuit board |
Jul. 11, 2006 |
| 7075179 |
System for implementing a configurable integrated circuit |
Jul. 11, 2006 |
| 7065869 |
Method for plating of printed circuit board strip |
Jun. 27, 2006 |
| 7067741 |
Semiconductor device and method of manufacture thereof, circuit board, and electronic instrument |
Jun. 27, 2006 |
| 7064421 |
Wire bonding package |
Jun. 20, 2006 |
| 7064431 |
Electronic assembly having select spacing of rows and columns of contacts to allow for routing of traces to the contacts |
Jun. 20, 2006 |
| 7064412 |
Electronic package with integrated capacitor |
Jun. 20, 2006 |
| 7061116 |
Arrangement of vias in a substrate to support a ball grid array |
Jun. 13, 2006 |
| 7061120 |
Stackable semiconductor package having semiconductor chip within central through hole of substrate |
Jun. 13, 2006 |
| 7062742 |
Routing structure for transceiver core |
Jun. 13, 2006 |
| 7061097 |
Semiconductor device and manufacturing method for the same |
Jun. 13, 2006 |
| 7057267 |
Semiconductor device and method of fabrication thereof, electronic module, and electronic instrument |
Jun. 6, 2006 |
| 7057284 |
Fine pitch low-cost flip chip substrate |
Jun. 6, 2006 |
| 7057292 |
Solder bar for high power flip chips |
Jun. 6, 2006 |
| 7053492 |
Circuit device and method of manufacturing the same |
May. 30, 2006 |
| 7053496 |
Hybrid package with non-insertable and insertable conductive features, complementary receptacle, and methods of fabrication, assembly, and operation therefor |
May. 30, 2006 |
| 7051434 |
Designing a ball assignment for a ball grid array package |
May. 30, 2006 |
| 7049694 |
Semiconductor package with crossing conductor assembly and method of manufacture |
May. 23, 2006 |
| 7043828 |
Tile-based routing method of a multi-layer circuit board |
May. 16, 2006 |
| 7042069 |
Semiconductor device and method of manufacturing same, wiring board, electronic module, and electronic instrument |
May. 9, 2006 |
| 7042098 |
Bonding pad for a packaged integrated circuit |
May. 9, 2006 |
| 7038144 |
Electronic component and method and structure for mounting semiconductor device |
May. 2, 2006 |
| 7034391 |
Flip chip interconnection pad layout |
Apr. 25, 2006 |
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