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Class Information
Number: 257/E23.069
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for conducting electric current to or from solid-state body in operation, e.g., leads, terminal arrangements (epo) > Consisting of soldered or bonded constructions (epo) > Leads, i.e., metallizations or lead frames on insulating substrates, e.g., chip carriers (epo) > Additional leads joined to metallizations on insulating substrate, e.g., pins, bumps, wires, flat leads (epo) > Spherical bumps on substrate for external connection, e.g., ball grid arrays (bga) (epo)
Description: This subclass is indented under subclass E23.068. This subclass is substantially the same in scope as ECLA classification H01L23/498C4.

Patents under this class:

Patent Number Title Of Patent Date Issued
8710657 Semiconductor assembly and semiconductor package including a solder channel Apr. 29, 2014
8710656 Redistribution layer (RDL) with variable offset bumps Apr. 29, 2014
8709935 Semiconductor device and method of forming interconnect structure with conductive pads having expanded interconnect surface area for enhanced interconnection properties Apr. 29, 2014
8704366 Ultra thin bumped wafer with under-film Apr. 22, 2014
8703599 Microelectronic devices having intermediate contacts for connection to interposer substrates, and associated methods of packaging microelectronic devices with intermediate contacts Apr. 22, 2014
8703508 Method for wafer-level testing diced multi-chip stacked packages Apr. 22, 2014
8686560 Wafer-level chip-scale package device having bump assemblies configured to mitigate failures due to stress Apr. 1, 2014
8671560 In system reflow of low temperature eutectic bond balls Mar. 18, 2014
8664775 Semiconductor device Mar. 4, 2014
8664760 Connector design for packaging integrated circuits Mar. 4, 2014
8659123 Metal pad structures in dies Feb. 25, 2014
8653661 Package having MEMS element and fabrication method thereof Feb. 18, 2014
8653658 Planarized bumps for underfill control Feb. 18, 2014
8653640 Semiconductor package apparatus Feb. 18, 2014
8643168 Integrated circuit package with input capacitance compensation Feb. 4, 2014
8642387 Method of fabricating stacked packages using laser direct structuring Feb. 4, 2014
8637997 Semiconductor device and method of manufacturing the same Jan. 28, 2014
8637391 Flip chip semiconductor assembly with variable volume solder bumps Jan. 28, 2014
8629556 Semiconductor device Jan. 14, 2014
8624393 Methods and designs for localized wafer thinning Jan. 7, 2014
8623754 Repairing anomalous stiff pillar bumps Jan. 7, 2014
8618676 Method of assembly of a semiconductor package for the improvement of the electrical testing yield on the packages so obtained Dec. 31, 2013
8610273 Wafer level chip scale package without an encapsulated via Dec. 17, 2013
8610266 Semiconductor device for radio frequency applications and method for making the same Dec. 17, 2013
8604603 Apparatus having thermal-enhanced and cost-effective 3D IC integration structure with through silicon via interposers Dec. 10, 2013
8604601 Semiconductor device having wiring layers with power-supply plane and ground plane Dec. 10, 2013
8586467 Method of mounting electronic component and mounting substrate Nov. 19, 2013
8580673 Underfill flow guide structures and method of using same Nov. 12, 2013
8580609 Semiconductor device with embedded interconnect pad Nov. 12, 2013
8575755 Semiconductor device having mode of operation defined by inner bump assembly connection Nov. 5, 2013
8569898 Semiconductor device Oct. 29, 2013
8564115 Package structure having micro-electromechanical element Oct. 22, 2013
8546954 Stacked semiconductor package having electrical connections or varying heights between substrates, and semiconductor device including the stacked semiconductor package Oct. 1, 2013
8546943 Ball grid array substrate with insulating layer and semiconductor chip package Oct. 1, 2013
8546927 RFIC chip mounting structure Oct. 1, 2013
8546925 Synchronous buck converter having coplanar array of contact bumps of equal volume Oct. 1, 2013
8536716 Supply voltage or ground connections for integrated circuit device Sep. 17, 2013
8525333 Electronic device and manufacturing method therefor Sep. 3, 2013
8525331 Chip design having integrated fuse and method for the production thereof Sep. 3, 2013
8518752 Integrated circuit packaging system with stackable package and method of manufacture thereof Aug. 27, 2013
8513816 Film for flip chip type semiconductor back surface containing thermoconductive filler Aug. 20, 2013
8513813 Stub minimization using duplicate sets of terminals for wirebond assemblies without windows Aug. 20, 2013
8508045 Package 3D interconnection and method of making same Aug. 13, 2013
8492894 Bump, method for forming the bump, and method for mounting substrate having the bump thereon Jul. 23, 2013
8492893 Semiconductor device capable of preventing dielectric layer from cracking Jul. 23, 2013
8487435 Sheet-molded chip-scale package Jul. 16, 2013
8487424 Routable array metal integrated circuit package fabricated using partial etching process Jul. 16, 2013
8482134 Stackable package and method Jul. 9, 2013
8482122 Conductive pad structure, chip package structure and device substrate Jul. 9, 2013
8471383 Semiconductor package and fabrication method thereof Jun. 25, 2013

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