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Class Information
Number: 257/E23.069
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for conducting electric current to or from solid-state body in operation, e.g., leads, terminal arrangements (epo) > Consisting of soldered or bonded constructions (epo) > Leads, i.e., metallizations or lead frames on insulating substrates, e.g., chip carriers (epo) > Additional leads joined to metallizations on insulating substrate, e.g., pins, bumps, wires, flat leads (epo) > Spherical bumps on substrate for external connection, e.g., ball grid arrays (bga) (epo)
Description: This subclass is indented under subclass E23.068. This subclass is substantially the same in scope as ECLA classification H01L23/498C4.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7612457 |
Semiconductor device including a stress buffer |
Nov. 3, 2009 |
| 7612450 |
Semiconductor package including dummy board and method of fabricating the same |
Nov. 3, 2009 |
| 7612439 |
Semiconductor package having improved thermal performance |
Nov. 3, 2009 |
| 7608479 |
Method of manufacturing semiconductor device and method of treating electrical connection section |
Oct. 27, 2009 |
| 7605464 |
Semiconductor device |
Oct. 20, 2009 |
| 7598621 |
Device package, a printed wiring board, and an electronic apparatus with efficiently spaced bottom electrodes including intervals between bottom electrodes of different lengths |
Oct. 6, 2009 |
| 7592702 |
Via heat sink material |
Sep. 22, 2009 |
| 7589426 |
Semiconductor assemblies including redistribution layers and packages and assemblies formed therefrom |
Sep. 15, 2009 |
| 7586188 |
Chip package and coreless package substrate thereof |
Sep. 8, 2009 |
| 7586186 |
Ball grid array |
Sep. 8, 2009 |
| 7586184 |
Electronic package |
Sep. 8, 2009 |
| 7582968 |
Wiring board with a protective film greater in heights than bumps |
Sep. 1, 2009 |
| 7579693 |
Mounting structure of ball grid array |
Aug. 25, 2009 |
| 7579692 |
Method for forming a bump, semiconductor device and method of fabricating same, semiconductor chip, circuit board, and electronic instrument |
Aug. 25, 2009 |
| 7572725 |
Methods for wafer-level packaging of microelectronic devices and microelectronic devices formed by such methods |
Aug. 11, 2009 |
| 7569939 |
Self alignment features for an electronic assembly |
Aug. 4, 2009 |
| 7566969 |
Semiconductor device with improved arrangement of a through-hole in a wiring substrate |
Jul. 28, 2009 |
| 7564131 |
Semiconductor package and method of making a semiconductor package |
Jul. 21, 2009 |
| 7560308 |
Method for manufacturing bonded substrates and substrates for use in the bonded substrates |
Jul. 14, 2009 |
| 7554206 |
Microelectronic packages and methods therefor |
Jun. 30, 2009 |
| 7554198 |
Flexible joint methodology to attach a die on an organic substrate |
Jun. 30, 2009 |
| 7554197 |
High frequency IC package and method for fabricating the same |
Jun. 30, 2009 |
| 7550856 |
Grooved substrates for uniform underfilling solder ball assembled electronic devices |
Jun. 23, 2009 |
| 7550830 |
Stacked semiconductor package having fan-out structure through wire bonding |
Jun. 23, 2009 |
| 7547965 |
Package and package module of the package |
Jun. 16, 2009 |
| 7538429 |
Method of enabling solder deposition on a substrate and electronic package formed thereby |
May. 26, 2009 |
| 7538417 |
Semiconductor device with signal line having decreased characteristic impedance |
May. 26, 2009 |
| 7531906 |
Flip chip packaging using recessed interposer terminals |
May. 12, 2009 |
| 7531387 |
Flip chip mounting method and bump forming method |
May. 12, 2009 |
| 7528487 |
Semiconductor device having insulating material dispersed with conductive particles which establish electrical connection by penetrating to both copper conductive layer and land of wiring boar |
May. 5, 2009 |
| 7528482 |
Embedded chip package with improved heat dissipation performance and method of making the same |
May. 5, 2009 |
| 7528474 |
Stacked semiconductor package assembly having hollowed substrate |
May. 5, 2009 |
| 7528467 |
IC substrate with over voltage protection function |
May. 5, 2009 |
| 7525179 |
Lead frame structure with aperture or groove for flip chip in a leaded molded package |
Apr. 28, 2009 |
| 7518241 |
Wafer structure with a multi-layer barrier in an UBM layer network device with power supply |
Apr. 14, 2009 |
| 7518239 |
Semiconductor device with substrate having penetrating hole having a protrusion |
Apr. 14, 2009 |
| 7518224 |
Offset integrated circuit package-on-package stacking system |
Apr. 14, 2009 |
| 7511365 |
Thermal enhanced low profile package structure |
Mar. 31, 2009 |
| 7511362 |
Electronic component and semiconductor device, method of making the same and method of mounting the same, circuit board, and electronic instrument |
Mar. 31, 2009 |
| 7485960 |
Semiconductor device and manufacturing method thereof |
Feb. 3, 2009 |
| 7485959 |
Structure for joining a semiconductor package to a substrate using a solder column |
Feb. 3, 2009 |
| 7485562 |
Method of making multichip wafer level packages and computing systems incorporating same |
Feb. 3, 2009 |
| 7476982 |
Fabricated adhesive microstructures for making an electrical connection |
Jan. 13, 2009 |
| 7474006 |
Package board and semiconductor device |
Jan. 6, 2009 |
| 7473580 |
Temporary chip attach using injection molded solder |
Jan. 6, 2009 |
| 7470979 |
Electronic component and semiconductor device, method of making the same and method of mounting the same, circuit board, and electronic instrument |
Dec. 30, 2008 |
| 7466021 |
Memory packages having stair step interconnection layers |
Dec. 16, 2008 |
| 7462940 |
Semiconductor component comprising flip chip contacts with polymer cores and method of producing the same |
Dec. 9, 2008 |
| 7462558 |
Method for fabricating a circuit component |
Dec. 9, 2008 |
| 7459785 |
Electrical interconnection structure formation |
Dec. 2, 2008 |
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