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Class Information
Number: 257/E23.068
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for conducting electric current to or from solid-state body in operation, e.g., leads, terminal arrangements (epo) > Consisting of soldered or bonded constructions (epo) > Leads, i.e., metallizations or lead frames on insulating substrates, e.g., chip carriers (epo) > Additional leads joined to metallizations on insulating substrate, e.g., pins, bumps, wires, flat leads (epo)
Description: This subclass is indented under subclass E23.06. This subclass is substantially the same in scope as ECLA classification H01L23/498C.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7605464 |
Semiconductor device |
Oct. 20, 2009 |
| 7592693 |
Interconnecting electrical devices |
Sep. 22, 2009 |
| 7589410 |
Molded reconfigured wafer, stack package using the same, and method for manufacturing the stack package |
Sep. 15, 2009 |
| 7586187 |
Interconnect structure with stress buffering ability and the manufacturing method thereof |
Sep. 8, 2009 |
| 7569939 |
Self alignment features for an electronic assembly |
Aug. 4, 2009 |
| 7566575 |
Mounting circuit and method for producing semiconductor-chip-mounting circuit |
Jul. 28, 2009 |
| 7566960 |
Interposing structure |
Jul. 28, 2009 |
| 7566969 |
Semiconductor device with improved arrangement of a through-hole in a wiring substrate |
Jul. 28, 2009 |
| 7554198 |
Flexible joint methodology to attach a die on an organic substrate |
Jun. 30, 2009 |
| 7538438 |
Substrate warpage control and continuous electrical enhancement |
May. 26, 2009 |
| 7494844 |
Method for manufacturing substrate with cavity |
Feb. 24, 2009 |
| 7462939 |
Interposer for compliant interfacial coupling |
Dec. 9, 2008 |
| 7456502 |
Wiring board with connection electrode formed in opening and semiconductor device using the same |
Nov. 25, 2008 |
| 7394028 |
Flexible circuit substrate for flip-chip-on-flex applications |
Jul. 1, 2008 |
| 7385297 |
Under-bond pad structures for integrated circuit devices |
Jun. 10, 2008 |
| 7385298 |
Reduced-dimension microelectronic component assemblies with wire bonds and methods of making same |
Jun. 10, 2008 |
| 7368375 |
Electronic component with compliant elevations having electrical contact areas and method for producing it |
May. 6, 2008 |
| 7368810 |
Invertible microfeature device packages |
May. 6, 2008 |
| 7336491 |
Heat sink |
Feb. 26, 2008 |
| 7307293 |
Direct-connect integrated circuit signaling system for bypassing intra-substrate printed circuit signal paths |
Dec. 11, 2007 |
| 7298042 |
Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument |
Nov. 20, 2007 |
| 7274098 |
Chip packaging structure without leadframe |
Sep. 25, 2007 |
| 7268438 |
Semiconductor element including a wet prevention film |
Sep. 11, 2007 |
| 7262498 |
Assembly with a ring and bonding pads formed of a same material on a substrate |
Aug. 28, 2007 |
| 7262510 |
Chip package structure |
Aug. 28, 2007 |
| 7230332 |
Chip package with embedded component |
Jun. 12, 2007 |
| 7227249 |
Three-dimensional stacked semiconductor package with chips on opposite sides of lead |
Jun. 5, 2007 |
| 7190080 |
Semiconductor chip assembly with embedded metal pillar |
Mar. 13, 2007 |
| 7180170 |
Lead-free integrated circuit package structure |
Feb. 20, 2007 |
| 7141869 |
Electronic package for image sensor, and the packaging method thereof |
Nov. 28, 2006 |
| 7132742 |
Semiconductor device, method of manufacturing the same, circuit board, and electronic instrument |
Nov. 7, 2006 |
| 7075177 |
Semiconductor chip package |
Jul. 11, 2006 |
| 7068520 |
Circuit board made of resin with pin |
Jun. 27, 2006 |
| 7067924 |
Nickel bonding cap over copper metalized bondpads |
Jun. 27, 2006 |
| 7066740 |
Area array package with low inductance connecting device |
Jun. 27, 2006 |
| 7064566 |
Probe card assembly and kit |
Jun. 20, 2006 |
| 7063541 |
Composite microelectronic spring structure and method for making same |
Jun. 20, 2006 |
| 7061257 |
Probe card assembly |
Jun. 13, 2006 |
| 7057295 |
IC module assembly |
Jun. 6, 2006 |
| 7053496 |
Hybrid package with non-insertable and insertable conductive features, complementary receptacle, and methods of fabrication, assembly, and operation therefor |
May. 30, 2006 |
| 7053489 |
Arrangement with a semiconductor chip and support therefore and method for a bonded wire connection |
May. 30, 2006 |
| 7053494 |
Semiconductor device and production method therefor |
May. 30, 2006 |
| 7049693 |
Electrical contact array for substrate assemblies |
May. 23, 2006 |
| 7040902 |
Electrical contact |
May. 9, 2006 |
| 7042080 |
Semiconductor interconnect having compliant conductive contacts |
May. 9, 2006 |
| 7032311 |
Stabilized wire bonded electrical connections and method of making same |
Apr. 25, 2006 |
| 7034390 |
Semiconductor package having multi-signal bus bars |
Apr. 25, 2006 |
| 7030479 |
Integrated circuit die and/or package having a variable pitch contact array for maximization of number of signal lines per routing layer |
Apr. 18, 2006 |
| 7029289 |
Interconnection device and system |
Apr. 18, 2006 |
| 7029288 |
Electrical contact and connector and method of manufacture |
Apr. 18, 2006 |
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