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Class Information
Number: 257/E23.068
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for conducting electric current to or from solid-state body in operation, e.g., leads, terminal arrangements (epo) > Consisting of soldered or bonded constructions (epo) > Leads, i.e., metallizations or lead frames on insulating substrates, e.g., chip carriers (epo) > Additional leads joined to metallizations on insulating substrate, e.g., pins, bumps, wires, flat leads (epo)
Description: This subclass is indented under subclass E23.06. This subclass is substantially the same in scope as ECLA classification H01L23/498C.










Sub-classes under this class:

Class Number Class Name Patents
257/E23.069 Spherical bumps on substrate for external connection, e.g., ball grid arrays (bga) (epo) 1,601


Patents under this class:
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18

Patent Number Title Of Patent Date Issued
8710652 Embedded package and method for manufacturing the same Apr. 29, 2014
8710653 Chip on chip semiconductor device including an underfill layer having a resin containing an amine-based curing agent Apr. 29, 2014
8710666 Semiconductor device and method for fabricating the same Apr. 29, 2014
8704352 Semiconductor device having a liquid cooling module Apr. 22, 2014
8703543 Vertical sensor assembly method Apr. 22, 2014
8704367 Semiconductor device and manufacturing method of semiconductor device Apr. 22, 2014
8704371 Semiconductor device having multiple bump heights and multiple bump diameters Apr. 22, 2014
8686550 Method and apparatus for high pressure sensor device Apr. 1, 2014
8686572 Apparatus for stacking integrated circuits Apr. 1, 2014
8679887 Method for manufacturing a micro-electro-mechanical device, in particular an optical microswitch, and micro-electro-mechanical device thus obtained Mar. 25, 2014
8664760 Connector design for packaging integrated circuits Mar. 4, 2014
8659155 Mechanisms for forming copper pillar bumps Feb. 25, 2014
8653657 Semiconductor chip, method of manufacturing semiconductor chip, and semiconductor device Feb. 18, 2014
8648463 Assembly of multi-chip modules with proximity connectors using reflowable features Feb. 11, 2014
8637983 Face-to-face (F2F) hybrid structure for an integrated circuit Jan. 28, 2014
8633587 Package structure Jan. 21, 2014
8633582 Chip package and fabrication method thereof Jan. 21, 2014
8624362 IC wafer having electromagnetic shielding effects and method for making the same Jan. 7, 2014
8618657 Semiconductor device with multilayer wiring structure formed within and method of manufacturing the same Dec. 31, 2013
8610261 Power semiconductor device Dec. 17, 2013
8610273 Wafer level chip scale package without an encapsulated via Dec. 17, 2013
8610285 3D IC packaging structures and methods with a metal pillar Dec. 17, 2013
8604613 Electronic assembly having a multilayer adhesive structure Dec. 10, 2013
8604610 Flexible power module semiconductor packages Dec. 10, 2013
8598698 Package substrate with an embedded stiffener Dec. 3, 2013
8592994 Semiconductor package, core layer material, buildup layer material, and sealing resin composition Nov. 26, 2013
8586420 Power semiconductor arrangement and method for producing a power semiconductor arrangement Nov. 19, 2013
8580682 Cost-effective TSV formation Nov. 12, 2013
8575760 Semiconductor devices having electrodes Nov. 5, 2013
8563358 Method of producing a chip package, and chip package Oct. 22, 2013
8564106 Wafer level packaging Oct. 22, 2013
8564128 Semiconductor device and manufacturing method of the same Oct. 22, 2013
8558380 Stack package and method for manufacturing the same Oct. 15, 2013
8558360 Flip chip package and method of manufacturing the same Oct. 15, 2013
8558400 Semiconductor packages and methods of fabricating the same Oct. 15, 2013
8546940 Manufacturing method of lead frame substrate and semiconductor apparatus Oct. 1, 2013
8546924 Package structures for integrating thermoelectric components with stacking chips Oct. 1, 2013
8536716 Supply voltage or ground connections for integrated circuit device Sep. 17, 2013
8525332 Semiconductor device having semiconductor substrate, and method of manufacturing the same Sep. 3, 2013
8513109 Method of manufacturing an interconnect structure for a semiconductor device Aug. 20, 2013
8508043 Metal pad structure for thickness enhancement of polymer used in electrical interconnection of semiconductor die to semiconductor chip package substrate with solder bump Aug. 13, 2013
8508045 Package 3D interconnection and method of making same Aug. 13, 2013
8502380 Chip package and fabrication method thereof Aug. 6, 2013
8492202 Semiconductor device and method of manufacturing the same Jul. 23, 2013
8487435 Sheet-molded chip-scale package Jul. 16, 2013
8487433 Semiconductor device Jul. 16, 2013
8482122 Conductive pad structure, chip package structure and device substrate Jul. 9, 2013
8456004 Template wafer and process for small pitch flip-chip interconnect hybridization Jun. 4, 2013
8456023 Semiconductor wafer processing Jun. 4, 2013
8450847 Optoelectronic semiconductor chip fitted with a carrier May. 28, 2013

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