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Class Information
Number: 257/E23.066
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for conducting electric current to or from solid-state body in operation, e.g., leads, terminal arrangements (epo) > Consisting of soldered or bonded constructions (epo) > Leads, i.e., metallizations or lead frames on insulating substrates, e.g., chip carriers (epo) > Lead frames fixed on or encapsulated in insulating substrates (epo)
Description: This subclass is indented under subclass E23.06. This subclass is substantially the same in scope as ECLA classification H01L23/498L.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7414319 |
Semiconductor chip assembly with metal containment wall and solder terminal |
Aug. 19, 2008 |
| 7372130 |
Semiconductor device including a semiconductor chip formed on an insulating element such as a tape, and including an improved insulating arrangement |
May. 13, 2008 |
| 7361937 |
White-light emitting device and the use thereof |
Apr. 22, 2008 |
| 7336491 |
Heat sink |
Feb. 26, 2008 |
| 7323769 |
High performance chip scale leadframe package with thermal dissipating structure and annular element and method of manufacturing package |
Jan. 29, 2008 |
| 7288847 |
Assembly including a circuit and an encapsulation frame, and method of making the same |
Oct. 30, 2007 |
| 7268439 |
Semiconductor device having resin-sealed area on circuit board thereof |
Sep. 11, 2007 |
| 7247937 |
Mounting pad structure for wire-bonding type lead frame packages |
Jul. 24, 2007 |
| 7241645 |
Method for assembling a ball grid array package with multiple interposers |
Jul. 10, 2007 |
| 7230320 |
Electronic circuit device with reduced breaking and cracking |
Jun. 12, 2007 |
| 7227198 |
Half-bridge package |
Jun. 5, 2007 |
| 7211451 |
Process for producing a component module |
May. 1, 2007 |
| 7190069 |
Method and system of tape automated bonding |
Mar. 13, 2007 |
| 7176506 |
High frequency chip packages with connecting elements |
Feb. 13, 2007 |
| 7148564 |
Dual-sided substrate integrated circuit package including a leadframe having leads with increased thickness |
Dec. 12, 2006 |
| 7119423 |
Semiconductor device and method of manufacturing the same, electronic module, and electronic instrument |
Oct. 10, 2006 |
| 7090482 |
Semiconductor device package manufacturing method and semiconductor device package manufactured by the method |
Aug. 15, 2006 |
| 7071571 |
Semiconductor component having a plastic housing and methods for its production |
Jul. 4, 2006 |
| 7069653 |
Method for electrically connecting a semiconductor component to an electrical subassembly |
Jul. 4, 2006 |
| 7061077 |
Substrate based unmolded package including lead frame structure and semiconductor die |
Jun. 13, 2006 |
| 7059042 |
Method of manufacturing a thermal conductive circuit board with grounding pattern connected to a heat sink |
Jun. 13, 2006 |
| 7053299 |
Flange for integrated circuit package |
May. 30, 2006 |
| 7045905 |
Molded package and semiconductor device using molded package |
May. 16, 2006 |
| 7023078 |
Packages for communication devices |
Apr. 4, 2006 |
| 7004325 |
Resin-molded package with cavity structure |
Feb. 28, 2006 |
| 6991967 |
Apparatus and method for die attachment |
Jan. 31, 2006 |
| 6983537 |
Method of making a plastic package with an air cavity |
Jan. 10, 2006 |
| 6982479 |
Semiconductor package with leadframe inductors |
Jan. 3, 2006 |
| 6977432 |
Prefabricated semiconductor chip carrier |
Dec. 20, 2005 |
| 6972479 |
Package with stacked substrates |
Dec. 6, 2005 |
| 6951980 |
Package for an electrical device |
Oct. 4, 2005 |
| 6949412 |
Clad plate for forming interposer for semiconductor device, interposer for semiconductor device, and method of manufacturing them |
Sep. 27, 2005 |
| 6940183 |
Compound filled in lead IC packaging product |
Sep. 6, 2005 |
| 6933593 |
Power module having a heat sink |
Aug. 23, 2005 |
| 6930333 |
Semiconductor device wiring structure |
Aug. 16, 2005 |
| 6921969 |
Semiconductor module and method of producing a semiconductor module |
Jul. 26, 2005 |
| 6907659 |
Method for manufacturing and packaging integrated circuit |
Jun. 21, 2005 |
| 6884663 |
Method for reconstructing an integrated circuit package using lapping |
Apr. 26, 2005 |
| 6879034 |
Semiconductor package including low temperature co-fired ceramic substrate |
Apr. 12, 2005 |
| 6870244 |
Lead frame and production process thereof and production process of thermally conductive substrate |
Mar. 22, 2005 |
| 6867367 |
Package for integrated circuit die |
Mar. 15, 2005 |
| 6863962 |
Sheet for a thermal conductive substrate, a method for manufacturing the same, a thermal conductive substrate using the sheet and a method for manufacturing the same |
Mar. 8, 2005 |
| 6864564 |
Flash-preventing semiconductor package |
Mar. 8, 2005 |
| 6860004 |
Method of manufacturing a thermally conductive circuit board with a ground pattern connected to a heat sink |
Mar. 1, 2005 |
| 6858807 |
Substrate for receiving a circuit configuration and method for producing the substrate |
Feb. 22, 2005 |
| 6858474 |
Wire bond package and packaging method |
Feb. 22, 2005 |
| 6852927 |
Thin metal package and manufacturing method thereof |
Feb. 8, 2005 |
| 6847115 |
Packaged semiconductor device for radio frequency shielding |
Jan. 25, 2005 |
| 6841869 |
Electronic package assembly |
Jan. 11, 2005 |
| 6838318 |
Clad plate for forming interposer for semiconductor device, interposer for semiconductor device, and method of manufacturing them |
Jan. 4, 2005 |
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