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Class Information
Number: 257/E23.066
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for conducting electric current to or from solid-state body in operation, e.g., leads, terminal arrangements (epo) > Consisting of soldered or bonded constructions (epo) > Leads, i.e., metallizations or lead frames on insulating substrates, e.g., chip carriers (epo) > Lead frames fixed on or encapsulated in insulating substrates (epo)
Description: This subclass is indented under subclass E23.06. This subclass is substantially the same in scope as ECLA classification H01L23/498L.

Patents under this class:
1 2 3 4 5 6 7 8

Patent Number Title Of Patent Date Issued
8653647 Plastic package and method of fabricating the same Feb. 18, 2014
8624271 Light emitting devices Jan. 7, 2014
8614451 Light emitting diode device Dec. 24, 2013
8604610 Flexible power module semiconductor packages Dec. 10, 2013
8575734 Lead frame Nov. 5, 2013
8530250 Light emitting device, resin package, resin-molded body, and methods for manufacturing light emitting device, resin package and resin-molded body Sep. 10, 2013
8497522 Solid state lighting device Jul. 30, 2013
8492786 Light emitting device package and lighting system Jul. 23, 2013
8487322 Luminous body with LED dies and production thereof Jul. 16, 2013
8471271 Light emitting diode package and method of manufacturing the same Jun. 25, 2013
8338234 Hybrid integrated circuit device and manufacturing method thereof Dec. 25, 2012
8283758 Microelectronic packages with enhanced heat dissipation and methods of manufacturing Oct. 9, 2012
8207604 Microelectronic package comprising offset conductive posts on compliant layer Jun. 26, 2012
8198134 Dual side cooling integrated power device module and methods of manufacture Jun. 12, 2012
8153478 Method for manufacturing integrated circuit package system with under paddle leadfingers Apr. 10, 2012
8143711 Integrated circuit package system with offset stacking and anti-flash structure Mar. 27, 2012
8138549 System for displaying images Mar. 20, 2012
8115214 Light emitting diode package and method of manufacturing the same Feb. 14, 2012
8084778 Light emitting diode package Dec. 27, 2011
8053875 Method of manufacturing a semiconductor device Nov. 8, 2011
8030743 Semiconductor package with an embedded printed circuit board and stacked die Oct. 4, 2011
7989931 Integrated circuit package system with under paddle leadfingers Aug. 2, 2011
7952198 BGA package with leads on chip May. 31, 2011
7935982 Side view type LED package May. 3, 2011
7906794 Light emitting device package with frame and optically transmissive element Mar. 15, 2011
7880283 High reliability power module Feb. 1, 2011
7863102 Integrated circuit package system with external interconnects within a die platform Jan. 4, 2011
7859004 Semiconductor device Dec. 28, 2010
7838980 TO263 device package having low moisture sensitivity Nov. 23, 2010
7808096 Semiconductor package and production method thereof, and semiconductor device Oct. 5, 2010
7795710 Lead frame routed chip pads for semiconductor packages Sep. 14, 2010
7782628 Circuit device Aug. 24, 2010
7777315 Dual side cooling integrated power device module and methods of manufacture Aug. 17, 2010
7745930 Semiconductor device packages with substrates for redistributing semiconductor device electrodes Jun. 29, 2010
7723846 Power semiconductor module and method of manufacturing the same May. 25, 2010
7713790 Method and system of tape automated bonding May. 11, 2010
7692283 Device including a housing for a semiconductor chip including leads extending into the housing Apr. 6, 2010
7682878 Encapsulation circuitry on a substrate Mar. 23, 2010
7671382 Semiconductor device with thermoplastic resin to reduce warpage Mar. 2, 2010
7671453 Semiconductor device and method for producing the same Mar. 2, 2010
7629676 Semiconductor component having a semiconductor die and a leadframe Dec. 8, 2009
7598123 Semiconductor component and method of manufacture Oct. 6, 2009
7595549 Surface mount semiconductor device Sep. 29, 2009
7582958 Semiconductor package Sep. 1, 2009
7582963 Vertically integrated system-in-a-package Sep. 1, 2009
7579680 Packaging system for semiconductor devices Aug. 25, 2009
7511371 Multiple die integrated circuit package Mar. 31, 2009
7466016 Bent lead transistor Dec. 16, 2008
7414319 Semiconductor chip assembly with metal containment wall and solder terminal Aug. 19, 2008
7372130 Semiconductor device including a semiconductor chip formed on an insulating element such as a tape, and including an improved insulating arrangement May. 13, 2008

1 2 3 4 5 6 7 8

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