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Class Information
Number: 257/E23.065
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for conducting electric current to or from solid-state body in operation, e.g., leads, terminal arrangements (epo) > Consisting of soldered or bonded constructions (epo) > Leads, i.e., metallizations or lead frames on insulating substrates, e.g., chip carriers (epo) > Flexible insulating substrates (epo)
Description: This subclass is indented under subclass E23.06. This subclass is substantially the same in scope as ECLA classification H01L23/498J.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 6864119 |
COF semiconductor device and a manufacturing method for the same |
Mar. 8, 2005 |
| 6864577 |
Via plug adapter |
Mar. 8, 2005 |
| 6856013 |
Integrated circuit packages, ball-grid array integrated circuit packages and methods of packaging an integrated circuit |
Feb. 15, 2005 |
| 6848176 |
Process for manufacturing flexible wiring boards |
Feb. 1, 2005 |
| 6841462 |
Method of manufacturing semiconductor chip having supporting member |
Jan. 11, 2005 |
| 6838316 |
Semiconductor device manufacturing method using ultrasonic flip chip bonding technique |
Jan. 4, 2005 |
| 6835896 |
Packaging structure of a driving circuit for a liquid crystal display device and packaging method of a driving circuit for a liquid crystal display device |
Dec. 28, 2004 |
| 6833609 |
Integrated circuit device packages and substrates for making the packages |
Dec. 21, 2004 |
| 6825549 |
Electronic component with external flat conductors and a method for producing the electronic component |
Nov. 30, 2004 |
| 6822320 |
Microelectronic connection components utilizing conductive cores and polymeric coatings |
Nov. 23, 2004 |
| 6818542 |
Tape circuit board and semiconductor chip package including the same |
Nov. 16, 2004 |
| 6816385 |
Compliant laminate connector |
Nov. 9, 2004 |
| 6800947 |
Flexible tape electronics packaging |
Oct. 5, 2004 |
| 6798048 |
2-Metal layer TAB tape and both-sided CSP.cndot.BGA tape |
Sep. 28, 2004 |
| 6798058 |
Semiconductor device, mounting and method of manufacturing mounting substrate, circuit board, and electronic instrument |
Sep. 28, 2004 |
| 6794750 |
Semiconductor device |
Sep. 21, 2004 |
| 6791169 |
Compliant semiconductor package with anisotropic conductive material interconnects and methods therefor |
Sep. 14, 2004 |
| 6787093 |
Semiconductor resin molding method |
Sep. 7, 2004 |
| 6782610 |
Method for fabricating a wiring substrate by electroplating a wiring film on a metal base |
Aug. 31, 2004 |
| 6781248 |
Method for encapsulating intermediate conductive elements connecting a semiconductor die to a substrate and semiconductor devices so packaged |
Aug. 24, 2004 |
| 6774467 |
Semiconductor device and process of production of same |
Aug. 10, 2004 |
| 6770981 |
Composite interposer for BGA packages |
Aug. 3, 2004 |
| 6768211 |
Five layer adhesive/insulator/metal/insulator/adhesive tape for semiconductor die packaging |
Jul. 27, 2004 |
| 6759732 |
Semiconductor device with circuit cell array and arrangement on a semiconductor chip |
Jul. 6, 2004 |
| 6749711 |
Apparatus and methods for coverlay removal and adhesive application |
Jun. 15, 2004 |
| 6746897 |
Fabrication process of semiconductor package and semiconductor package |
Jun. 8, 2004 |
| 6746899 |
Tape stiffener, semiconductor device component assemblies including same, and stereolithographic methods for fabricating same |
Jun. 8, 2004 |
| 6744131 |
Flip chip integrated circuit packages accommodating exposed chip capacitors while providing structural rigidity |
Jun. 1, 2004 |
| 6743658 |
Methods of packaging an integrated circuit |
Jun. 1, 2004 |
| 6744125 |
Super thin/super thermal ball grid array package |
Jun. 1, 2004 |
| 6740960 |
Semiconductor package including flex circuit, interconnects and dense array external contacts |
May. 25, 2004 |
| 6740962 |
Tape stiffener, semiconductor device component assemblies including same, and stereolithographic methods for fabricating same |
May. 25, 2004 |
| 6737590 |
Tape circuit board and semiconductor chip package including the same |
May. 18, 2004 |
| 6738123 |
Drive circuit connection structure including a substrate, circuit board, and semiconductor device, and display apparatus including the connection structure |
May. 18, 2004 |
| 6730855 |
Electronic element |
May. 4, 2004 |
| 6727577 |
Tape carrier package |
Apr. 27, 2004 |
| 6723584 |
Methods of making microelectronic assemblies including compliant interfaces |
Apr. 20, 2004 |
| 6724076 |
Package for a semiconductor chip |
Apr. 20, 2004 |
| 6720645 |
Semiconductor device |
Apr. 13, 2004 |
| 6717819 |
Solderable flexible adhesive interposer as for an electronic package, and method for making same |
Apr. 6, 2004 |
| 6711815 |
Fabricating method of semiconductor devices |
Mar. 30, 2004 |
| 6710456 |
Composite interposer for BGA packages |
Mar. 23, 2004 |
| 6703567 |
Conductor track layer structure and prestage thereof |
Mar. 9, 2004 |
| 6699737 |
Method of manufacturing a semiconductor device |
Mar. 2, 2004 |
| 6686015 |
Transferable resilient element for packaging of a semiconductor chip and method therefor |
Feb. 3, 2004 |
| 6683369 |
Semiconductor chip having a supporting member, tape substrate, semiconductor package having the semiconductor chip and the tape substrate |
Jan. 27, 2004 |
| 6677055 |
Tape structure and manufacturing method |
Jan. 13, 2004 |
| 6674155 |
Chip carrier film, method of manufacturing the chip carrier film and liquid crystal display using the chip carrier film |
Jan. 6, 2004 |
| 6670215 |
Semiconductor device and manufacturing method thereof |
Dec. 30, 2003 |
| 6670696 |
Tape-carrier-package semiconductor device and a liquid crystal panel display using such a device as well as a method for testing the disconnection thereof |
Dec. 30, 2003 |
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