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Class Information
Number: 257/E23.065
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for conducting electric current to or from solid-state body in operation, e.g., leads, terminal arrangements (epo) > Consisting of soldered or bonded constructions (epo) > Leads, i.e., metallizations or lead frames on insulating substrates, e.g., chip carriers (epo) > Flexible insulating substrates (epo)
Description: This subclass is indented under subclass E23.06. This subclass is substantially the same in scope as ECLA classification H01L23/498J.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7622367 |
Methods and devices for fabricating and assembling printable semiconductor elements |
Nov. 24, 2009 |
| 7622800 |
Stacked semiconductor packages and method therefor |
Nov. 24, 2009 |
| 7615860 |
Rigid-flex printed circuit board with weakening structure |
Nov. 10, 2009 |
| 7608920 |
Memory card and method for devising |
Oct. 27, 2009 |
| 7605454 |
Memory card and method for devising |
Oct. 20, 2009 |
| 7582959 |
Driver module structure with flexible circuit board |
Sep. 1, 2009 |
| 7582976 |
Semiconductor device tape carrier, manufacturing method for semiconductor device, semiconductor device, and semiconductor module device |
Sep. 1, 2009 |
| 7579687 |
Circuit module turbulence enhancement systems and methods |
Aug. 25, 2009 |
| 7554198 |
Flexible joint methodology to attach a die on an organic substrate |
Jun. 30, 2009 |
| 7518238 |
Mounting flexible circuits onto integrated circuit substrates |
Apr. 14, 2009 |
| 7482698 |
Semiconducting device with folded interposer |
Jan. 27, 2009 |
| 7466021 |
Memory packages having stair step interconnection layers |
Dec. 16, 2008 |
| 7453157 |
Microelectronic packages and methods therefor |
Nov. 18, 2008 |
| 7420270 |
Tape wiring substrate and chip-on-film package using the same |
Sep. 2, 2008 |
| 7408253 |
Chip-embedded support-frame board wrapped by folded flexible circuit for multiplying packing density |
Aug. 5, 2008 |
| 7405475 |
Method and system of tape automated bonding |
Jul. 29, 2008 |
| 7393718 |
Unmolded package for a semiconductor device |
Jul. 1, 2008 |
| 7372130 |
Semiconductor device including a semiconductor chip formed on an insulating element such as a tape, and including an improved insulating arrangement |
May. 13, 2008 |
| 7372139 |
Semiconductor chip package |
May. 13, 2008 |
| 7368805 |
Semiconductor device, flexible substrate, tape carrier, and electronic device including the semiconductor device |
May. 6, 2008 |
| 7353595 |
Method for manufacturing a printed circuit board that mounts an integrated circuit device thereon |
Apr. 8, 2008 |
| 7342311 |
Electronic unit integrated into a flexible polymer body |
Mar. 11, 2008 |
| 7339262 |
Tape circuit substrate and semiconductor apparatus employing the same |
Mar. 4, 2008 |
| 7335975 |
Integrated circuit stacking system and method |
Feb. 26, 2008 |
| 7335973 |
Adhesive of folder package |
Feb. 26, 2008 |
| 7279778 |
Semiconductor package having a high-speed signal input/output terminal |
Oct. 9, 2007 |
| 7256496 |
Semiconductor device having adhesion increasing film to prevent peeling |
Aug. 14, 2007 |
| 7239024 |
Semiconductor package with recess for die |
Jul. 3, 2007 |
| 7217990 |
Tape package having test pad on reverse surface and method for testing the same |
May. 15, 2007 |
| 7190080 |
Semiconductor chip assembly with embedded metal pillar |
Mar. 13, 2007 |
| 7186584 |
Integrated circuit chip, electronic device and method of manufacturing the same, and electronic instrument |
Mar. 6, 2007 |
| 7176072 |
Strained silicon devices transfer to glass for display applications |
Feb. 13, 2007 |
| 7170145 |
Method of manufacturing semiconductor device, flexible substrate, and semiconductor device |
Jan. 30, 2007 |
| 7154171 |
Stacking structure for semiconductor devices using a folded over flexible substrate and method therefor |
Dec. 26, 2006 |
| 7144758 |
Manufacturing method of semiconductor device, including differently spaced bump electrode arrays |
Dec. 5, 2006 |
| 7145249 |
Semiconducting device with folded interposer |
Dec. 5, 2006 |
| 7132746 |
Electronic assembly with solder-bonded heat sink |
Nov. 7, 2006 |
| 7115980 |
Mounting structure, electro-optical device, and electronic apparatus |
Oct. 3, 2006 |
| 7109575 |
Low-cost flexible film package module and method of manufacturing the same |
Sep. 19, 2006 |
| 7071026 |
Production method for making film carrier tape for mounting electronic devices thereon |
Jul. 4, 2006 |
| 7071030 |
Method of making a flexible substrate with a filler material |
Jul. 4, 2006 |
| 7067334 |
Tape carrier package and method of fabricating the same |
Jun. 27, 2006 |
| 7064751 |
Display device |
Jun. 20, 2006 |
| 7061085 |
Semiconductor component and system having stiffener and circuit decal |
Jun. 13, 2006 |
| 7057267 |
Semiconductor device and method of fabrication thereof, electronic module, and electronic instrument |
Jun. 6, 2006 |
| 7057297 |
Tape substrates with mold gate support structures that are coplanar with conductive traces thereof and associated methods |
Jun. 6, 2006 |
| 7053478 |
Pitch change and chip scale stacking system |
May. 30, 2006 |
| 7053312 |
Flexible wiring boards |
May. 30, 2006 |
| 7053494 |
Semiconductor device and production method therefor |
May. 30, 2006 |
| 7053485 |
Microelectronic packages with self-aligning features |
May. 30, 2006 |
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