Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Browse by Category: Main > Physics
Class Information
Number: 257/E23.063
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for conducting electric current to or from solid-state body in operation, e.g., leads, terminal arrangements (epo) > Consisting of soldered or bonded constructions (epo) > Leads, i.e., metallizations or lead frames on insulating substrates, e.g., chip carriers (epo) > Chip support structure consisting of plurality of insulating substrates (epo)
Description: This subclass is indented under subclass E23.06. This subclass is substantially the same in scope as ECLA classification H01L23/498F.










Patents under this class:
1 2 3 4 5 6 7

Patent Number Title Of Patent Date Issued
8633591 Electronic device Jan. 21, 2014
8633108 Dual damascene process Jan. 21, 2014
8508028 Chip package and method for forming the same Aug. 13, 2013
8508037 Bumpless build-up layer and laminated core hybrid structures and methods of assembling same Aug. 13, 2013
8492889 Semiconductor package Jul. 23, 2013
8421213 Package structure Apr. 16, 2013
8390114 Semiconductor package Mar. 5, 2013
8358002 Window ball grid array (BGA) semiconductor packages Jan. 22, 2013
8354301 Packaged microdevices and methods for manufacturing packaged microdevices Jan. 15, 2013
8354340 Electronic device and method of manufacturing the same Jan. 15, 2013
8093706 Mounting structure of semiconductor device and electronic apparatus using same Jan. 10, 2012
8035217 Semiconductor device and method for manufacturing same Oct. 11, 2011
7944035 Double sided semiconduction device with edge contact and package therefor May. 17, 2011
7932589 Semiconductor device and method for manufacturing the same Apr. 26, 2011
7919851 Laminate substrate and semiconductor package utilizing the substrate Apr. 5, 2011
7911037 Method and structure for creating embedded metal features Mar. 22, 2011
7906842 Wafer level system in package and fabrication method thereof Mar. 15, 2011
7902676 Stacked semiconductor device and fabricating method thereof Mar. 8, 2011
7880308 Semiconductor device Feb. 1, 2011
7875974 Laminated mounting structure and memory card Jan. 25, 2011
7863728 Semiconductor module including components in plastic casing Jan. 4, 2011
7799604 Semiconductor device having multilayer printed wiring board and manufacturing method of the same Sep. 21, 2010
7786591 Die down ball grid array package Aug. 31, 2010
7777348 Semiconductor device Aug. 17, 2010
7750449 Packaged semiconductor components having substantially rigid support members and methods of packaging semiconductor components Jul. 6, 2010
7714446 Single mask via method and device May. 11, 2010
7701045 Point-to-point connection topology for stacked devices Apr. 20, 2010
7659623 Semiconductor device having improved wiring Feb. 9, 2010
7638875 Packaging structure Dec. 29, 2009
7629686 Bumped die and wire bonded board-on-chip package Dec. 8, 2009
7595553 Packaging board and manufacturing method therefor, semiconductor module and mobile apparatus Sep. 29, 2009
7589398 Embedded metal features structure Sep. 15, 2009
7589424 Thin silicon based substrate Sep. 15, 2009
7586182 Packaged semiconductor die and manufacturing method thereof Sep. 8, 2009
7569920 Electronic component having at least one vertical semiconductor power transistor Aug. 4, 2009
7557439 Layered chip package that implements memory device Jul. 7, 2009
7518238 Mounting flexible circuits onto integrated circuit substrates Apr. 14, 2009
7514796 Semiconductor chip capable of being laminated and a semiconductor device including the lamination of a plurality of semiconductor chips Apr. 7, 2009
7514775 Stacked structures and methods of fabricating stacked structures Apr. 7, 2009
7504715 Packaging of a microchip device Mar. 17, 2009
7443030 Thin silicon based substrate Oct. 28, 2008
7400035 Semiconductor device having multilayer printed wiring board Jul. 15, 2008
7385283 Three dimensional integrated circuit and method of making the same Jun. 10, 2008
7385281 Semiconductor integrated circuit device Jun. 10, 2008
7375421 High density multilayer circuit module May. 20, 2008
7339260 Wiring board providing impedance matching Mar. 4, 2008
7274093 Semiconductor device connector, semiconductor device carrier, semiconductor device socket using the same and probe card Sep. 25, 2007
7227258 Mounting structure in integrated circuit module Jun. 5, 2007
7224062 Chip package with embedded panel-shaped component May. 29, 2007
7196426 Multilayered substrate for semiconductor device Mar. 27, 2007

1 2 3 4 5 6 7










 
 
  Recently Added Patents
Structure of pixel electrode
Concentration measuring apparatus for hydrogen sulfide in gas flow, and method for determining sulfide ion
Relative pose estimation of non-overlapping cameras using the motion of subjects in the camera fields of view
Data latch circuit and electronic device
Expandable mobile device
Digital camera dock having movable guide pins
Social community generated answer system with collaboration constraints
  Randomly Featured Patents
Method and device for driving a metal halide lamp
Radio information communication system using multi-carrier spread spectrum transmission system
Oligomerisation of olefins
Method of cleaning and passivating a metal surface with acidic system and ethoxylated tertiary dodecyl mercaptan
Wireless reader tags (WRTs) with sensor components in asset monitoring and tracking systems
Hand held dispenser for mixing and dispensing two viscous components
Method and system for managing bandwidth on a master-slave bus
Optical path length scanner using moving prisms
Parallel precise time transfer to multiple GPS units
Apparatus for use in impregnating electrical cables