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Browse by Category: Main > Physics
Class Information
Number: 257/E23.062
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for conducting electric current to or from solid-state body in operation, e.g., leads, terminal arrangements (epo) > Consisting of soldered or bonded constructions (epo) > Leads, i.e., metallizations or lead frames on insulating substrates, e.g., chip carriers (epo) > Multilayer substrates (epo)
Description: This subclass is indented under subclass E23.06. This subclass is substantially the same in scope as ECLA classification H01L23/498D.










Patents under this class:
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Patent Number Title Of Patent Date Issued
8624382 Packaging substrate and method of fabricating the same Jan. 7, 2014
8592982 Semiconductor package having proximity communication signal input terminals and manufacturing methods thereof Nov. 26, 2013
8535546 Method of manufacturing multilayer wiring substrate Sep. 17, 2013
8481424 Multilayer printed wiring board Jul. 9, 2013
8470680 Substrate with embedded patterned capacitance Jun. 25, 2013
8455766 Substrate with low-elasticity layer and low-thermal-expansion layer Jun. 4, 2013
8441128 Semiconductor arrangement May. 14, 2013
8410536 Substrate with embedded patterned capacitance Apr. 2, 2013
8383461 Method for manufacturing semiconductor package having improved bump structures Feb. 26, 2013
8278733 Bonding pad structure and integrated circuit chip using such bonding pad structure Oct. 2, 2012
8247899 Power semiconductor module comprising a connection device with internal contact spring connection elements Aug. 21, 2012
8237270 Wiring board manufacturing method, semiconductor device manufacturing method and wiring board Aug. 7, 2012
8237260 Power semiconductor module with segmented base plate Aug. 7, 2012
8227925 Integrated circuit packaging system with interposer Jul. 24, 2012
8212363 Multilayer printed wiring board Jul. 3, 2012
8168471 Semiconductor device and manufacturing method of a semiconductor device May. 1, 2012
8148823 Low loss package for electronic device Apr. 3, 2012
8129727 Semiconductor light emitting device Mar. 6, 2012
8124451 Integrated circuit packaging system with interposer Feb. 28, 2012
8102042 Reducing plating stub reflections in a chip package using resistive coupling Jan. 24, 2012
8084861 Connection structure semiconductor chip and electronic component including the connection structure and methods for producing the connection structure Dec. 27, 2011
8053872 Integrated shield for a no-lead semiconductor device package Nov. 8, 2011
8035218 Microelectronic package and method of manufacturing same Oct. 11, 2011
8026566 Semiconductor device and method for manufacturing semiconductor device Sep. 27, 2011
8026134 Recessed drain and source areas in combination with advanced silicide formation in transistors Sep. 27, 2011
8018047 Power semiconductor module including a multilayer substrate Sep. 13, 2011
8003438 Circuit module and manufacturing method thereof Aug. 23, 2011
8004869 Memory circuit arrangement and method for the production thereof Aug. 23, 2011
7999387 Semiconductor element connected to printed circuit board Aug. 16, 2011
7968449 Method for manufacturing printed wiring board Jun. 28, 2011
7952197 Electrical component May. 31, 2011
7923828 Structure and method of making interconnect element, and multilayer wiring board including the interconnect element Apr. 12, 2011
7915088 Wiring board manufacturing method, semiconductor device manufacturing method and wiring board Mar. 29, 2011
7911037 Method and structure for creating embedded metal features Mar. 22, 2011
7911047 Semiconductor device and method of fabricating the semiconductor device Mar. 22, 2011
7906842 Wafer level system in package and fabrication method thereof Mar. 15, 2011
7902663 Semiconductor package having stepwise depression in substrate Mar. 8, 2011
7880265 Packaged integrated circuit Feb. 1, 2011
7868459 Semiconductor package having non-aligned active vias Jan. 11, 2011
7855429 Electronic circuit device having silicon substrate Dec. 21, 2010
7851900 Stacked semiconductor package Dec. 14, 2010
7834273 Multilayer printed wiring board Nov. 16, 2010
7816790 Semiconductor device having low dielectric insulating film and manufacturing method of the same Oct. 19, 2010
7781852 Membrane die attach circuit element package and method therefor Aug. 24, 2010
7772109 Manufacturing method of multilayer wiring substrate Aug. 10, 2010
7764530 Memory circuit arrangement and method for the production thereof Jul. 27, 2010
7745926 Composite multi-layer substrate and module using the substrate Jun. 29, 2010
7732913 Semiconductor package substrate Jun. 8, 2010
7727816 Integrated circuit package system with offset stacked die Jun. 1, 2010
7723728 Fan-out wire structure for a display panel May. 25, 2010

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