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Class Information
Number: 257/E23.061
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for conducting electric current to or from solid-state body in operation, e.g., leads, terminal arrangements (epo) > Consisting of soldered or bonded constructions (epo) > Leads, i.e., metallizations or lead frames on insulating substrates, e.g., chip carriers (epo) > Leads being also applied on sidewalls or bottom of substrate, e.g., leadless packages for surface mounting (epo)
Description: This subclass is indented under subclass E23.06. This subclass is substantially the same in scope as ECLA classification H01L23/498A.

Patents under this class:
1 2 3 4 5 6 7 8

Patent Number Title Of Patent Date Issued
8709873 Leadless integrated circuit packaging system and method of manufacture thereof Apr. 29, 2014
8680662 Wafer level edge stacking Mar. 25, 2014
8643158 Semiconductor package and lead frame therefor Feb. 4, 2014
8637974 Integrated circuit packaging system with tiebar-less design and method of manufacture thereof Jan. 28, 2014
8629537 Padless die support integrated circuit package system Jan. 14, 2014
8598696 Multi-surface IC packaging structures Dec. 3, 2013
8592993 Method and structure of integrated micro electro-mechanical systems and electronic devices using edge bond pads Nov. 26, 2013
8587101 Multi-chip module (MCM) power quad flat no-lead (PQFN) semiconductor package utilizing a leadframe for electrical interconnections Nov. 19, 2013
8558368 Bi-directional, reverse blocking battery switch Oct. 15, 2013
8461657 Methods for forming a micro electro-mechanical device Jun. 11, 2013
8415780 Package carrier and manufacturing method thereof Apr. 9, 2013
8390133 Semiconductor device and manufacturing method thereof Mar. 5, 2013
8378498 Chip assembly with a coreless substrate employing a patterned adhesive layer Feb. 19, 2013
8367481 Four MOSFET full bridge module Feb. 5, 2013
8367522 Method and structure of integrated micro electro-mechanical systems and electronic devices using edge bond pads Feb. 5, 2013
8344499 Chip-exposed semiconductor device Jan. 1, 2013
8330239 Shielding for a micro electro-mechanical device and method therefor Dec. 11, 2012
8319319 Semiconductor package and mounting method thereof Nov. 27, 2012
8314489 Semiconductor module and method for production thereof Nov. 20, 2012
8299594 Stacked ball grid array package module utilizing one or more interposer layers Oct. 30, 2012
8283790 Electronic device Oct. 9, 2012
8222078 Chip scale surface mounted semiconductor device package and process of manufacture Jul. 17, 2012
8164174 Microstructure component Apr. 24, 2012
8110915 Open cavity leadless surface mountable package for high power RF applications Feb. 7, 2012
8110930 Die backside metallization and surface activated bonding for stacked die packages Feb. 7, 2012
8106508 Electronic component for surface mounting Jan. 31, 2012
8097898 Light-emitting diode Jan. 17, 2012
8097945 Bi-directional, reverse blocking battery switch Jan. 17, 2012
8071987 Housing for an optoelectronic component, optoelectronic component, and method for producing a housing for an optoelectronic component Dec. 6, 2011
8063470 Method and apparatus for no lead semiconductor package Nov. 22, 2011
8058099 Method of fabricating a two-sided die in a four-sided leadframe based package Nov. 15, 2011
8007686 Nitride red phosphors and white light emitting diode using rare-earth-co-doped nitride red phosphors Aug. 30, 2011
8004091 Semiconductor package, method of fabricating the same, and semiconductor package mold Aug. 23, 2011
7994629 Leadless integrated circuit packaging system and method of manufacture thereof Aug. 9, 2011
7990025 Silicon package with embedded oscillator Aug. 2, 2011
7982300 Stackable layer containing ball grid array package Jul. 19, 2011
7955893 Wafer level chip scale package and process of manufacture Jun. 7, 2011
7952186 Semiconductor package land grid array substrate and plurality of first and second electrodes May. 31, 2011
7911048 Wiring substrate Mar. 22, 2011
7911043 Wafer level device package with sealing line having electroconductive pattern and method of packaging the same Mar. 22, 2011
7879653 Leadless semiconductor package with electroplated layer embedded in encapsulant and the method for manufacturing the same Feb. 1, 2011
7880313 Semiconductor flip chip package having substantially non-collapsible spacer Feb. 1, 2011
7863737 Integrated circuit package system with wire bond pattern Jan. 4, 2011
7843049 Semiconductor device and manufacturing method thereof Nov. 30, 2010
7825505 Semiconductor package and method therefor Nov. 2, 2010
7825524 QFN housing having optimized connecting surface geometry Nov. 2, 2010
7808103 Leadless package Oct. 5, 2010
7795710 Lead frame routed chip pads for semiconductor packages Sep. 14, 2010
7790594 Electronic part and method of producing the same Sep. 7, 2010
7781888 Surface mounting electronic component and manufacturing method thereof Aug. 24, 2010

1 2 3 4 5 6 7 8

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