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Class Information
Number: 257/E23.06
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for conducting electric current to or from solid-state body in operation, e.g., leads, terminal arrangements (epo) > Consisting of soldered or bonded constructions (epo) > Leads, i.e., metallizations or lead frames on insulating substrates, e.g., chip carriers (epo)
Description: This subclass is indented under subclass E23.023. This subclass is substantially the same in scope as ECLA classification H01L23/498.
Sub-classes under this class:
| Class Number |
Class Name |
Patents |
| 257/E23.068 |
Additional leads joined to metallizations on insulating substrate, e.g., pins, bumps, wires, flat leads (epo) |
710 |
| 257/E23.072 |
Characterized by materials (epo) |
211 |
| 257/E23.063 |
Chip support structure consisting of plurality of insulating substrates (epo) |
283 |
| 257/E23.065 |
Flexible insulating substrates (epo) |
714 |
| 257/E23.064 |
For flat cards, e.g., credit cards (epo) |
200 |
| 257/E23.07 |
Geometry or layout (epo) |
784 |
| 257/E23.066 |
Lead frames fixed on or encapsulated in insulating substrates (epo) |
315 |
| 257/E23.061 |
Leads being also applied on sidewalls or bottom of substrate, e.g., leadless packages for surface mounting (epo) |
308 |
| 257/E23.062 |
Multilayer substrates (epo) |
563 |
| 257/E23.067 |
Via connections through substrates, e.g., pins going through substrate, coaxial cables (epo) |
1,173 |
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7595553 |
Packaging board and manufacturing method therefor, semiconductor module and mobile apparatus |
Sep. 29, 2009 |
| 7576424 |
Semiconductor device |
Aug. 18, 2009 |
| 7545036 |
Semiconductor device that suppresses variations in high frequency characteristics of circuit elements |
Jun. 9, 2009 |
| 7521781 |
Integrated circuit package system with mold clamp line critical area having widened conductive traces |
Apr. 21, 2009 |
| 7485970 |
Semiconductor package substrate having contact pad protective layer formed thereon |
Feb. 3, 2009 |
| 7473996 |
Signal transfer film, display apparatus having the same and method of manufacturing the same |
Jan. 6, 2009 |
| 7432601 |
Semiconductor package and fabrication process thereof |
Oct. 7, 2008 |
| 7429797 |
Electronic device and carrier substrate |
Sep. 30, 2008 |
| 7394152 |
Wafer level chip size packaged chip device with an N-shape junction inside and method of fabricating the same |
Jul. 1, 2008 |
| 7372130 |
Semiconductor device including a semiconductor chip formed on an insulating element such as a tape, and including an improved insulating arrangement |
May. 13, 2008 |
| 7368818 |
Methods of making microelectronic assemblies including compliant interfaces |
May. 6, 2008 |
| 7332799 |
Packaged chip having features for improved signal transmission on the package |
Feb. 19, 2008 |
| 7323787 |
Off-grid decoupling of ball grid array (BGA) devices and method |
Jan. 29, 2008 |
| 7321165 |
Semiconductor device and its manufacturing method |
Jan. 22, 2008 |
| 7318962 |
Magnetically directed self-assembly of molecular electronic junctions comprising conductively coated ferromagnetic microparticles |
Jan. 15, 2008 |
| 7288832 |
Chip-mounted film package |
Oct. 30, 2007 |
| 7279794 |
Semiconductor device and electronic device, and methods for manufacturing thereof |
Oct. 9, 2007 |
| 7259452 |
Leaded package integrated circuit stacking |
Aug. 21, 2007 |
| 7256490 |
Test carrier for semiconductor components having conductors defined by grooves |
Aug. 14, 2007 |
| 7253516 |
Electronic device and carrier substrate for same |
Aug. 7, 2007 |
| 7253504 |
Integrated circuit package and method |
Aug. 7, 2007 |
| 7247938 |
Carrier, method of manufacturing a carrier and an electronic device |
Jul. 24, 2007 |
| 7242084 |
Apparatuses and associated methods for improved solder joint reliability |
Jul. 10, 2007 |
| 7180196 |
Semiconductor device mounting method, semiconductor device mounting structure, electro-optical device, electro-optical device manufacturing method and electronic device |
Feb. 20, 2007 |
| 7157794 |
Semiconductor device that suppresses variations in high frequency characteristics of circuit elements |
Jan. 2, 2007 |
| 7122895 |
Stud-cone bump for probe tips used in known good die carriers |
Oct. 17, 2006 |
| 7119423 |
Semiconductor device and method of manufacturing the same, electronic module, and electronic instrument |
Oct. 10, 2006 |
| 7071026 |
Production method for making film carrier tape for mounting electronic devices thereon |
Jul. 4, 2006 |
| 7067918 |
Wiring board |
Jun. 27, 2006 |
| 7053492 |
Circuit device and method of manufacturing the same |
May. 30, 2006 |
| 7033865 |
Thermally conductive substrate, thermally conductive substrate manufacturing method and power module |
Apr. 25, 2006 |
| 7030500 |
Package substrate manufactured using electrolytic leadless plating process, and method for manufacturing the same |
Apr. 18, 2006 |
| 7002075 |
Intermediate substrate |
Feb. 21, 2006 |
| 6998705 |
Semiconductor device, method for mounting the same, and method for repairing the same |
Feb. 14, 2006 |
| 6989297 |
Variable thickness pads on a substrate surface |
Jan. 24, 2006 |
| 6977190 |
Semiconductor device and method for production thereof |
Dec. 20, 2005 |
| 6972495 |
Compliant package with conductive elastomeric posts |
Dec. 6, 2005 |
| 6927480 |
Multi-chip package with electrical interconnection |
Aug. 9, 2005 |
| 6905954 |
Method for producing a semiconductor device and corresponding semiconductor device |
Jun. 14, 2005 |
| 6900545 |
Variable thickness pads on a substrate surface |
May. 31, 2005 |
| 6891198 |
Film carrier tape for mounting an electronic part |
May. 10, 2005 |
| 6890849 |
Interconnect, interconnect forming method, thin film transistor, and display device |
May. 10, 2005 |
| 6891387 |
System for probing, testing, burn-in, repairing and programming of integrated circuits |
May. 10, 2005 |
| 6867066 |
Method for production of a semiconductor device with package that includes an insulator frame on a metal member |
Mar. 15, 2005 |
| 6867471 |
Universal package for an electronic component with a semiconductor chip and method for producing the universal package |
Mar. 15, 2005 |
| 6853060 |
Semiconductor package using a printed circuit board and a method of manufacturing the same |
Feb. 8, 2005 |
| 6852625 |
Package substrate manufactured using electrolytic leadless plating process, and method for manufacturing the same |
Feb. 8, 2005 |
| 6848178 |
Enhancement of current-carrying capacity of a multilayer circuit board |
Feb. 1, 2005 |
| 6847107 |
Image forming apparatus with improved transfer efficiency |
Jan. 25, 2005 |
| 6847101 |
Microelectronic package having a compliant layer with bumped protrusions |
Jan. 25, 2005 |
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