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Class Information
Number: 257/E23.06
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for conducting electric current to or from solid-state body in operation, e.g., leads, terminal arrangements (epo) > Consisting of soldered or bonded constructions (epo) > Leads, i.e., metallizations or lead frames on insulating substrates, e.g., chip carriers (epo)
Description: This subclass is indented under subclass E23.023. This subclass is substantially the same in scope as ECLA classification H01L23/498.

Sub-classes under this class:

Class Number Class Name Patents
257/E23.068 Additional leads joined to metallizations on insulating substrate, e.g., pins, bumps, wires, flat leads (epo) 863
257/E23.072 Characterized by materials (epo) 227
257/E23.063 Chip support structure consisting of plurality of insulating substrates (epo) 313
257/E23.065 Flexible insulating substrates (epo) 758
257/E23.064 For flat cards, e.g., credit cards (epo) 229
257/E23.07 Geometry or layout (epo) 879
257/E23.066 Lead frames fixed on or encapsulated in insulating substrates (epo) 356
257/E23.061 Leads being also applied on sidewalls or bottom of substrate, e.g., leadless packages for surface mounting (epo) 371
257/E23.062 Multilayer substrates (epo) 622
257/E23.067 Via connections through substrates, e.g., pins going through substrate, coaxial cables (epo) 1,370

Patents under this class:
1 2 3 4 5 6

Patent Number Title Of Patent Date Issued
8692367 Wafer-level packaged device having self-assembled resilient leads Apr. 8, 2014
8692377 Integrated circuit packaging system with plated leads and method of manufacture thereof Apr. 8, 2014
8674488 Light emitting diode (LED) packages Mar. 18, 2014
8633581 Semiconductor device Jan. 21, 2014
8629053 Plasma treatment for semiconductor devices Jan. 14, 2014
8624365 Interposer based capacitors for semiconductor packaging Jan. 7, 2014
8598691 Semiconductor devices and methods of manufacturing and packaging thereof Dec. 3, 2013
8591756 Method of manufacturing a metallized ceramic substrate Nov. 26, 2013
8592912 Semiconductor device and method of fabricating the same Nov. 26, 2013
8587124 Semiconductor device having low dielectric insulating film and manufacturing method of the same Nov. 19, 2013
8581402 Molded chip interposer structure and methods Nov. 12, 2013
8575756 Power package module with low and high power chips and method for fabricating the same Nov. 5, 2013
8552540 Wafer level package with thermal pad for higher power dissipation Oct. 8, 2013
8531033 Contact plug structure, semiconductor device, and method for forming contact plug Sep. 10, 2013
8524607 Anisotropically conductive member and method of manufacture Sep. 3, 2013
8513806 Laminated high melting point soldering layer formed by TLP bonding and fabrication method for the same, and semiconductor device Aug. 20, 2013
8482121 Semiconductor device, method of manufacturing thereof, circuit board and electronic apparatus Jul. 9, 2013
8450852 Wiring substrate May. 28, 2013
8446006 Structures and methods to reduce maximum current density in a solder ball May. 21, 2013
8441127 Bump-on-trace structures with wide and narrow portions May. 14, 2013
8415780 Package carrier and manufacturing method thereof Apr. 9, 2013
8399967 Package structure Mar. 19, 2013
8402406 Controlling plating stub reflections in a chip package Mar. 19, 2013
8384229 Semiconductor device and method for manufacturing the same Feb. 26, 2013
8378467 Semiconductor device and method of manufacturing the same Feb. 19, 2013
8378468 Semiconductor device and method of manufacturing the same Feb. 19, 2013
8368188 Drop-mold conformable material as an encapsulation for an integrated circuit package system and method for manufacturing thereof Feb. 5, 2013
8314479 Leadframe package with recessed cavity for LED Nov. 20, 2012
8304922 Semiconductor package system with thermal die bonding Nov. 6, 2012
8304884 Semiconductor device including spacer element Nov. 6, 2012
8283737 MEMS package and method of manufacturing the MEMS package Oct. 9, 2012
8283759 Lead frame having outer leads coated with a four layer plating Oct. 9, 2012
8283790 Electronic device Oct. 9, 2012
8278748 Wafer-level packaged device having self-assembled resilient leads Oct. 2, 2012
8258521 Radiation-emitting semiconductor body with carrier substrate and method for the production thereof Sep. 4, 2012
8247899 Power semiconductor module comprising a connection device with internal contact spring connection elements Aug. 21, 2012
8242608 Universal bump array structure Aug. 14, 2012
8237273 Metal post chip connecting device and method free to use soldering material Aug. 7, 2012
8232639 Semiconductor-device mounted board and method of manufacturing the same Jul. 31, 2012
8222738 Semiconductor device, and manufacturing method therefor Jul. 17, 2012
8217507 Edge mount semiconductor package Jul. 10, 2012
8217509 Semiconductor device Jul. 10, 2012
8187922 Low cost flexible substrate May. 29, 2012
8148804 Wiring device for semiconductor device, composite wiring device for semiconductor device, and resin-sealed semiconductor device Apr. 3, 2012
8138595 Integrated circuit packaging system with an intermediate pad and method of manufacture thereof Mar. 20, 2012
8129219 Semiconductor module, method for manufacturing the semiconductor module and portable device carrying the same Mar. 6, 2012
8125085 Semiconductor device having wiring with oxide layer of impurity from the wiring Feb. 28, 2012
8110440 Semiconductor device and method of forming overlapping semiconductor die with coplanar vertical interconnect structure Feb. 7, 2012
8093706 Mounting structure of semiconductor device and electronic apparatus using same Jan. 10, 2012
8089148 Circuit board and semiconductor device having the same Jan. 3, 2012

1 2 3 4 5 6

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