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Class Information
Number: 257/E23.059
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for conducting electric current to or from solid-state body in operation, e.g., leads, terminal arrangements (epo) > Consisting of soldered or bonded constructions (epo) > Lead frames or other flat leads (epo) > Oscillators in combination with lead frame (epo)
Description: This subclass is indented under subclass E23.031. This subclass is substantially the same in scope as ECLA classification H01L23/495S.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7592639 |
Light-emitting semiconductor device, light-emitting system and method for fabricating light-emitting semiconductor device |
Sep. 22, 2009 |
| 7589424 |
Thin silicon based substrate |
Sep. 15, 2009 |
| 7479691 |
Power semiconductor module having surface-mountable flat external contacts and method for producing the same |
Jan. 20, 2009 |
| 7443013 |
Flexible substrate for package of die |
Oct. 28, 2008 |
| 7402462 |
Folded frame carrier for MOSFET BGA |
Jul. 22, 2008 |
| 7394109 |
LED lighting device |
Jul. 1, 2008 |
| 7245009 |
Hermetic cavity package |
Jul. 17, 2007 |
| 6081164 |
PLL oscillator package and production method thereof |
Jun. 27, 2000 |
| 5577319 |
Method of encapsulating a crystal oscillator |
Nov. 26, 1996 |
| 5327104 |
Piezoelectric oscillator formed in resin package containing, IC chip and piezoelectric oscillator element |
Jul. 5, 1994 |
| 5325574 |
Method of forming a quartz oscillator temperature sensor |
Jul. 5, 1994 |
| 5267379 |
Method of fabricating surface mountable clock oscillator module |
Dec. 7, 1993 |
| 5265316 |
Method of manufacturing a pressure seal type piezoelectric oscillator |
Nov. 30, 1993 |
| 5229640 |
Surface mountable clock oscillator module |
Jul. 20, 1993 |
| 4916413 |
Package for piezo-oscillator |
Apr. 10, 1990 |
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