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Class Information
Number: 257/E23.058
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for conducting electric current to or from solid-state body in operation, e.g., leads, terminal arrangements (epo) > Consisting of soldered or bonded constructions (epo) > Lead frames or other flat leads (epo) > Battery in combination with lead frame (epo)
Description: This subclass is indented under subclass E23.031. This subclass is substantially the same in scope as ECLA classification H01L23/495R.










Patents under this class:

Patent Number Title Of Patent Date Issued
8648469 Semiconductor package and method of mounting semiconductor die to opposite sides of TSV substrate Feb. 11, 2014
8344519 Stacked-die package for battery power management Jan. 1, 2013
8237185 Semiconductor light emitting device with integrated ESD protection Aug. 7, 2012
8049315 Use of discrete conductive layer in semiconductor device to re-route bonding wires for semiconductor device package Nov. 1, 2011
8044508 Method and apparatus for integrated-circuit battery devices Oct. 25, 2011
7898092 Stacked-die package for battery power management Mar. 1, 2011
7683470 LED package Mar. 23, 2010
5864182 Battery mounted integrated circuit device Jan. 26, 1999
5451715 Molded package integrated circuit with electrochemical cell Sep. 19, 1995
5403782 Surface mountable integrated circuit package with integrated battery mount Apr. 4, 1995
5323150 Method for reducing conductive and convective heat loss from the battery in an RFID tag or other battery-powered devices Jun. 21, 1994
5294829 IC package having direct attach backup battery Mar. 15, 1994
5289034 IC package having replaceable backup battery Feb. 22, 1994
5276354 Integrated circuit package with battery housing Jan. 4, 1994
5196374 Integrated circuit package with molded cell Mar. 23, 1993
5187564 Application of laminated interconnect media between a laminated power source and semiconductor devices Feb. 16, 1993
5161304 Method for packaging an electronic circuit device Nov. 10, 1992
5153710 Integrated circuit package with laminated backup cell Oct. 6, 1992
5124782 Integrated circuit package with molded cell Jun. 23, 1992
5119269 Semiconductor with a battery unit Jun. 2, 1992
5089877 Zero power IC module Feb. 18, 1992
5055704 Integrated circuit package with battery housing Oct. 8, 1991
5008776 Zero power IC module Apr. 16, 1991
4998888 Integrated circuit package with battery housing Mar. 12, 1991
4992987 Battery package for integrated circuits Feb. 12, 1991
4539660 Semiconductor integrated circuit Sep. 3, 1985











 
 
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