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Class Information
Number: 257/E23.057
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for conducting electric current to or from solid-state body in operation, e.g., leads, terminal arrangements (epo) > Consisting of soldered or bonded constructions (epo) > Lead frames or other flat leads (epo) > Capacitor integral with or on lead frame (epo)
Description: This subclass is indented under subclass E23.031. This subclass is substantially the same in scope as ECLA classification H01L23/495Q.










Patents under this class:
1 2 3

Patent Number Title Of Patent Date Issued
8669648 Power semiconductor module Mar. 11, 2014
8558345 Integrated decoupling capacitor employing conductive through-substrate vias Oct. 15, 2013
8502360 Resin sealing type semiconductor device and method of manufacturing the same, and resin sealing type electronic device Aug. 6, 2013
8304854 Semiconductor integrated circuit chip, multilayer chip capacitor and semiconductor integrated circuit chip package Nov. 6, 2012
8269331 Power semiconductor module Sep. 18, 2012
8242587 Electronic device and pressure sensor Aug. 14, 2012
8115285 Advanced quad flat no lead chip package having a protective layer to enhance surface mounting and manufacturing methods thereof Feb. 14, 2012
8067824 Integrated circuit module package and assembly method thereof Nov. 29, 2011
7993968 Assembling substrates that can form 3-D structures Aug. 9, 2011
7968901 Light emitting unit Jun. 28, 2011
7960773 Capacitor device and method for manufacturing the same Jun. 14, 2011
7936059 Lead frame packaging technique with reduced noise and cross-talk May. 3, 2011
7728427 Assembling stacked substrates that can form cylindrical inductors and adjustable transformers Jun. 1, 2010
7719085 Semiconductor device and method of manufacturing the same May. 18, 2010
7605450 High frequency arrangement Oct. 20, 2009
7495336 Array capacitors for broadband decoupling applications Feb. 24, 2009
7453144 Thin film capacitors and methods of making the same Nov. 18, 2008
7439199 Capacitive element, method of manufacture of the same, and semiconductor device Oct. 21, 2008
7365428 Array capacitor with resistive structure Apr. 29, 2008
7348661 Array capacitor apparatuses to filter input/output signal Mar. 25, 2008
7319268 Semiconductor device having capacitors for reducing power source noise Jan. 15, 2008
7190083 High frequency integrated circuit using capacitive bonding Mar. 13, 2007
7135758 Surface mount solder method and apparatus for decoupling capacitance and process of making Nov. 14, 2006
7122888 Semiconductor device, electrical inspection method thereof, and electronic apparatus including the semiconductor device Oct. 17, 2006
7091588 Semiconductor device including primary and secondary side circuits on first and second substrates with capacitive insulation Aug. 15, 2006
7071542 Lead frame decoupling capacitor, semiconductor device packages including the same and methods Jul. 4, 2006
7005325 Semiconductor package with passive device integration Feb. 28, 2006
6903447 Apparatus, methods and articles of manufacture for packaging an integrated circuit with internal matching Jun. 7, 2005
6833607 Resin-molded semiconductor device that includes at least one additional electronic part Dec. 21, 2004
6828658 Package for integrated circuit with internal matching Dec. 7, 2004
6828662 Semiconductor device Dec. 7, 2004
6806564 Semiconductor apparatus with decoupling capacitor Oct. 19, 2004
6781219 Semiconductor die assembly having leadframe decoupling characters Aug. 24, 2004
6730994 Interdigitated capacitor design for integrated circuit lead frames and methods May. 4, 2004
6717257 Lead frame decoupling capacitor, semiconductor device packages including the same and methods Apr. 6, 2004
6713317 Semiconductor device and laminated leadframe package Mar. 30, 2004
6713836 Packaging structure integrating passive devices Mar. 30, 2004
6707136 Multi-layer lead frame for a semiconductor device Mar. 16, 2004
6707146 Semiconductor apparatus with decoupling capacitor Mar. 16, 2004
6661091 Semiconductor device Dec. 9, 2003
6643418 Electric or opto-electric component with a packaging of plastic and a method for varying the impedance of a terminal lead of the component by attaching a dielectric plate to at least one termi Nov. 4, 2003
6608375 Semiconductor apparatus with decoupling capacitor Aug. 19, 2003
6538313 IC package with integral substrate capacitor Mar. 25, 2003
6531765 Interdigitated capacitor design for integrated circuit lead frames and method Mar. 11, 2003
6515359 Lead frame decoupling capacitor semiconductor device packages including the same and methods Feb. 4, 2003
6515353 Multi-layer lead frame for a semiconductor device Feb. 4, 2003
6504236 Semiconductor die assembly having leadframe decoupling characters and method Jan. 7, 2003
6486535 Electronic package with surface-mountable device built therein Nov. 26, 2002
6472737 Lead frame decoupling capacitor, semiconductor device packages including the same and methods Oct. 29, 2002
6396134 Interdigitated capacitor design for integrated circuit lead frames May. 28, 2002

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