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Class Information
Number: 257/E23.057
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for conducting electric current to or from solid-state body in operation, e.g., leads, terminal arrangements (epo) > Consisting of soldered or bonded constructions (epo) > Lead frames or other flat leads (epo) > Capacitor integral with or on lead frame (epo)
Description: This subclass is indented under subclass E23.031. This subclass is substantially the same in scope as ECLA classification H01L23/495Q.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7605450 |
High frequency arrangement |
Oct. 20, 2009 |
| 7495336 |
Array capacitors for broadband decoupling applications |
Feb. 24, 2009 |
| 7453144 |
Thin film capacitors and methods of making the same |
Nov. 18, 2008 |
| 7439199 |
Capacitive element, method of manufacture of the same, and semiconductor device |
Oct. 21, 2008 |
| 7365428 |
Array capacitor with resistive structure |
Apr. 29, 2008 |
| 7348661 |
Array capacitor apparatuses to filter input/output signal |
Mar. 25, 2008 |
| 7319268 |
Semiconductor device having capacitors for reducing power source noise |
Jan. 15, 2008 |
| 7190083 |
High frequency integrated circuit using capacitive bonding |
Mar. 13, 2007 |
| 7135758 |
Surface mount solder method and apparatus for decoupling capacitance and process of making |
Nov. 14, 2006 |
| 7122888 |
Semiconductor device, electrical inspection method thereof, and electronic apparatus including the semiconductor device |
Oct. 17, 2006 |
| 7091588 |
Semiconductor device including primary and secondary side circuits on first and second substrates with capacitive insulation |
Aug. 15, 2006 |
| 7071542 |
Lead frame decoupling capacitor, semiconductor device packages including the same and methods |
Jul. 4, 2006 |
| 7005325 |
Semiconductor package with passive device integration |
Feb. 28, 2006 |
| 6903447 |
Apparatus, methods and articles of manufacture for packaging an integrated circuit with internal matching |
Jun. 7, 2005 |
| 6833607 |
Resin-molded semiconductor device that includes at least one additional electronic part |
Dec. 21, 2004 |
| 6828658 |
Package for integrated circuit with internal matching |
Dec. 7, 2004 |
| 6828662 |
Semiconductor device |
Dec. 7, 2004 |
| 6806564 |
Semiconductor apparatus with decoupling capacitor |
Oct. 19, 2004 |
| 6781219 |
Semiconductor die assembly having leadframe decoupling characters |
Aug. 24, 2004 |
| 6730994 |
Interdigitated capacitor design for integrated circuit lead frames and methods |
May. 4, 2004 |
| 6717257 |
Lead frame decoupling capacitor, semiconductor device packages including the same and methods |
Apr. 6, 2004 |
| 6713317 |
Semiconductor device and laminated leadframe package |
Mar. 30, 2004 |
| 6713836 |
Packaging structure integrating passive devices |
Mar. 30, 2004 |
| 6707136 |
Multi-layer lead frame for a semiconductor device |
Mar. 16, 2004 |
| 6707146 |
Semiconductor apparatus with decoupling capacitor |
Mar. 16, 2004 |
| 6661091 |
Semiconductor device |
Dec. 9, 2003 |
| 6643418 |
Electric or opto-electric component with a packaging of plastic and a method for varying the impedance of a terminal lead of the component by attaching a dielectric plate to at least one termi |
Nov. 4, 2003 |
| 6608375 |
Semiconductor apparatus with decoupling capacitor |
Aug. 19, 2003 |
| 6538313 |
IC package with integral substrate capacitor |
Mar. 25, 2003 |
| 6531765 |
Interdigitated capacitor design for integrated circuit lead frames and method |
Mar. 11, 2003 |
| 6515359 |
Lead frame decoupling capacitor semiconductor device packages including the same and methods |
Feb. 4, 2003 |
| 6515353 |
Multi-layer lead frame for a semiconductor device |
Feb. 4, 2003 |
| 6504236 |
Semiconductor die assembly having leadframe decoupling characters and method |
Jan. 7, 2003 |
| 6486535 |
Electronic package with surface-mountable device built therein |
Nov. 26, 2002 |
| 6472737 |
Lead frame decoupling capacitor, semiconductor device packages including the same and methods |
Oct. 29, 2002 |
| 6396134 |
Interdigitated capacitor design for integrated circuit lead frames |
May. 28, 2002 |
| 6373127 |
Integrated capacitor on the back of a chip |
Apr. 16, 2002 |
| 6310388 |
Semiconductor die assembly having leadframe decoupling characters |
Oct. 30, 2001 |
| 6307256 |
Semiconductor package with a stacked chip on a leadframe |
Oct. 23, 2001 |
| 6307255 |
Multi-layer lead frame for a semiconductor device |
Oct. 23, 2001 |
| 6265764 |
Interdigitated capacitor design for integrated circuit lead frames |
Jul. 24, 2001 |
| 6238950 |
Integrated circuit with tightly coupled passive components |
May. 29, 2001 |
| 6184574 |
Multi-capacitance lead frame decoupling device |
Feb. 6, 2001 |
| 6185124 |
Storage circuit apparatus |
Feb. 6, 2001 |
| 6124630 |
Multi-layer lead frame for a semiconductor device |
Sep. 26, 2000 |
| 6114756 |
Interdigitated capacitor design for integrated circuit leadframes |
Sep. 5, 2000 |
| 6093957 |
Multilayer lead frame structure that reduces cross-talk and semiconductor package using same and fabrication method thereof |
Jul. 25, 2000 |
| 6091144 |
Semiconductor package |
Jul. 18, 2000 |
| 6054764 |
Integrated circuit with tightly coupled passive components |
Apr. 25, 2000 |
| 6054754 |
Multi-capacitance lead frame decoupling device |
Apr. 25, 2000 |
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