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Class Information
Number: 257/E23.056
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for conducting electric current to or from solid-state body in operation, e.g., leads, terminal arrangements (epo) > Consisting of soldered or bonded constructions (epo) > Lead frames or other flat leads (epo) > Insulating layers on lead frames (epo)
Description: This subclass is indented under subclass E23.031. This subclass is substantially the same in scope as ECLA classification H01L23/495M8.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7605465 |
Semiconductor device for high frequency power amplification |
Oct. 20, 2009 |
| 7414319 |
Semiconductor chip assembly with metal containment wall and solder terminal |
Aug. 19, 2008 |
| 7361533 |
Stacked embedded leadframe |
Apr. 22, 2008 |
| 7301226 |
Conductor substrate, semiconductor device and production method thereof |
Nov. 27, 2007 |
| 7022551 |
Quad flat flip chip packaging process and leadframe therefor |
Apr. 4, 2006 |
| 6943434 |
Method for maintaining solder thickness in flipchip attach packaging processes |
Sep. 13, 2005 |
| 6919622 |
Semiconductor device |
Jul. 19, 2005 |
| 6853056 |
Semiconductor device having a base metal lead frame |
Feb. 8, 2005 |
| 6845004 |
Protecting resin-encapsulated components |
Jan. 18, 2005 |
| 6833607 |
Resin-molded semiconductor device that includes at least one additional electronic part |
Dec. 21, 2004 |
| 6831372 |
Electronic devices with semiconductor chips and a leadframe with device positions and methods for producing the same |
Dec. 14, 2004 |
| 6798645 |
Protecting resin-encapsulated components |
Sep. 28, 2004 |
| 6756670 |
Electronic device and its manufacturing method |
Jun. 29, 2004 |
| 6720208 |
Semiconductor device |
Apr. 13, 2004 |
| 6664136 |
Semiconductor device and manufacturing method thereof |
Dec. 16, 2003 |
| 6593545 |
Laser defined pads for flip chip on leadframe package fabrication method |
Jul. 15, 2003 |
| 6531760 |
Semiconductor device |
Mar. 11, 2003 |
| 6510976 |
Method for forming a flip chip semiconductor package |
Jan. 28, 2003 |
| 6465885 |
Positioning of soldering pads in semiconductor diode package |
Oct. 15, 2002 |
| 6204552 |
Semiconductor device |
Mar. 20, 2001 |
| 6191492 |
Electronic device including a densified region |
Feb. 20, 2001 |
| 6124642 |
Lead structure for a semiconductor device with an isolating protective layer and method of fabricating the same |
Sep. 26, 2000 |
| 6087713 |
Plastic package, semiconductor device, and method of manufacturing plastic package |
Jul. 11, 2000 |
| 6087715 |
Semiconductor device, and manufacturing method of the same |
Jul. 11, 2000 |
| 6081023 |
Semiconductor device |
Jun. 27, 2000 |
| 6081035 |
Microelectronic bond ribbon design |
Jun. 27, 2000 |
| 6072231 |
Semiconductor device |
Jun. 6, 2000 |
| 6069029 |
Semiconductor device chip on lead and lead on chip manufacturing |
May. 30, 2000 |
| 6046075 |
Oxide wire bond insulation in semiconductor assemblies |
Apr. 4, 2000 |
| 6040633 |
Oxide wire bond insulation in semiconductor assemblies |
Mar. 21, 2000 |
| 6018191 |
Semiconductor device |
Jan. 25, 2000 |
| 5981315 |
Semiconductor device |
Nov. 9, 1999 |
| 5937279 |
Semiconductor device, and manufacturing method of the same |
Aug. 10, 1999 |
| 5914530 |
Semiconductor device |
Jun. 22, 1999 |
| 5863817 |
Semiconductor device |
Jan. 26, 1999 |
| 5821606 |
Semiconductor device |
Oct. 13, 1998 |
| 5817544 |
Enhanced wire-bondable leadframe |
Oct. 6, 1998 |
| 5677571 |
Semiconductor package having reinforced lead pins |
Oct. 14, 1997 |
| 5643834 |
Process for manufacturing a semiconductor substrate comprising laminated copper, silicon oxide and silicon nitride layers |
Jul. 1, 1997 |
| 5622896 |
Method of manufacturing a thin silicon-oxide layer |
Apr. 22, 1997 |
| 5612569 |
Semiconductor device |
Mar. 18, 1997 |
| 5585667 |
Lead frame for handling crossing bonding wires |
Dec. 17, 1996 |
| 5530286 |
Semiconductor device |
Jun. 25, 1996 |
| 5459103 |
Method of forming lead frame with strengthened encapsulation adhesion |
Oct. 17, 1995 |
| 5455453 |
Plastic package type semiconductor device having a rolled metal substrate |
Oct. 3, 1995 |
| 5446315 |
Resin-sealed semiconductor device containing porous fluorocarbon resin |
Aug. 29, 1995 |
| 5358904 |
Semiconductor device |
Oct. 25, 1994 |
| 5359224 |
Insulated lead frame for integrated circuits and method of manufacture thereof |
Oct. 25, 1994 |
| 5319241 |
Lead frame without power buses for lead on chip package, and a semiconductor device with conductive tape power distribution |
Jun. 7, 1994 |
| 5315152 |
Lead frame with improved adhesiveness property against plastic and plastic sealing type semiconductor packaging using said lead frame |
May. 24, 1994 |
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