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Class Information
Number: 257/E23.056
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for conducting electric current to or from solid-state body in operation, e.g., leads, terminal arrangements (epo) > Consisting of soldered or bonded constructions (epo) > Lead frames or other flat leads (epo) > Insulating layers on lead frames (epo)
Description: This subclass is indented under subclass E23.031. This subclass is substantially the same in scope as ECLA classification H01L23/495M8.










Patents under this class:
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Patent Number Title Of Patent Date Issued
8703598 Manufacturing method of lead frame substrate Apr. 22, 2014
8659129 Semiconductor device and method of manufacturing same Feb. 25, 2014
8648458 Leadframe circuit and method therefor Feb. 11, 2014
8597988 System for flash-free overmolding of led array substrates Dec. 3, 2013
8581378 Semiconductor device and method of manufacturing the same Nov. 12, 2013
8338839 Solid state light sheet for general illumination having substrates for creating series connection of dies Dec. 25, 2012
8247890 Wiring circuit structure and manufacturing method for semiconductor device using the structure Aug. 21, 2012
8217505 Packaged IC device comprising an embedded flex circuit on leadframe, and methods of making same Jul. 10, 2012
7928543 Tape wiring substrate and tape package using the same Apr. 19, 2011
7871863 Integrated circuit package system with multiple molding Jan. 18, 2011
7838895 Light-emitting diode chip package body and packaging method thereof Nov. 23, 2010
7791178 Lead frame unit, semiconductor package having a lead frame unit, stacked semiconductor package having a semiconductor package and methods of manufacturing the same Sep. 7, 2010
7683477 Semiconductor device including semiconductor chips having contact elements Mar. 23, 2010
7671453 Semiconductor device and method for producing the same Mar. 2, 2010
7671382 Semiconductor device with thermoplastic resin to reduce warpage Mar. 2, 2010
7605465 Semiconductor device for high frequency power amplification Oct. 20, 2009
7414319 Semiconductor chip assembly with metal containment wall and solder terminal Aug. 19, 2008
7361533 Stacked embedded leadframe Apr. 22, 2008
7301226 Conductor substrate, semiconductor device and production method thereof Nov. 27, 2007
7022551 Quad flat flip chip packaging process and leadframe therefor Apr. 4, 2006
6943434 Method for maintaining solder thickness in flipchip attach packaging processes Sep. 13, 2005
6919622 Semiconductor device Jul. 19, 2005
6853056 Semiconductor device having a base metal lead frame Feb. 8, 2005
6845004 Protecting resin-encapsulated components Jan. 18, 2005
6833607 Resin-molded semiconductor device that includes at least one additional electronic part Dec. 21, 2004
6831372 Electronic devices with semiconductor chips and a leadframe with device positions and methods for producing the same Dec. 14, 2004
6798645 Protecting resin-encapsulated components Sep. 28, 2004
6756670 Electronic device and its manufacturing method Jun. 29, 2004
6720208 Semiconductor device Apr. 13, 2004
6664136 Semiconductor device and manufacturing method thereof Dec. 16, 2003
6593545 Laser defined pads for flip chip on leadframe package fabrication method Jul. 15, 2003
6531760 Semiconductor device Mar. 11, 2003
6510976 Method for forming a flip chip semiconductor package Jan. 28, 2003
6465885 Positioning of soldering pads in semiconductor diode package Oct. 15, 2002
6204552 Semiconductor device Mar. 20, 2001
6191492 Electronic device including a densified region Feb. 20, 2001
6124642 Lead structure for a semiconductor device with an isolating protective layer and method of fabricating the same Sep. 26, 2000
6087713 Plastic package, semiconductor device, and method of manufacturing plastic package Jul. 11, 2000
6087715 Semiconductor device, and manufacturing method of the same Jul. 11, 2000
6081035 Microelectronic bond ribbon design Jun. 27, 2000
6081023 Semiconductor device Jun. 27, 2000
6072231 Semiconductor device Jun. 6, 2000
6069029 Semiconductor device chip on lead and lead on chip manufacturing May. 30, 2000
6046075 Oxide wire bond insulation in semiconductor assemblies Apr. 4, 2000
6040633 Oxide wire bond insulation in semiconductor assemblies Mar. 21, 2000
6018191 Semiconductor device Jan. 25, 2000
5981315 Semiconductor device Nov. 9, 1999
5937279 Semiconductor device, and manufacturing method of the same Aug. 10, 1999
5914530 Semiconductor device Jun. 22, 1999
5863817 Semiconductor device Jan. 26, 1999

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