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Class Information
Number: 257/E23.055
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for conducting electric current to or from solid-state body in operation, e.g., leads, terminal arrangements (epo) > Consisting of soldered or bonded constructions (epo) > Lead frames or other flat leads (epo) > Consisting of thin flexible metallic tape with or without film carrier (epo)
Description: This subclass is indented under subclass E23.031. This subclass is substantially the same in scope as ECLA classification H01L23 /495J.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7575957 |
Leadless semiconductor package and method for manufacturing the same |
Aug. 18, 2009 |
| 7561434 |
Wired circuit board and method for manufacturing wired circuit board and mounting electronic component thereon |
Jul. 14, 2009 |
| 7556986 |
Tape supported memory card leadframe structure |
Jul. 7, 2009 |
| 7541665 |
Lead frame for a magnetic sensor |
Jun. 2, 2009 |
| 7525181 |
Tape wiring substrate and tape package using the same |
Apr. 28, 2009 |
| 7518238 |
Mounting flexible circuits onto integrated circuit substrates |
Apr. 14, 2009 |
| 7452754 |
Method for manufacturing flexible printed circuit boards |
Nov. 18, 2008 |
| 7449367 |
Adhesive film for semiconductor, metal sheet with such adhesive film, wiring substrate with adhesive film, semiconductor device, and method for manufacturing semiconductor device |
Nov. 11, 2008 |
| 7417292 |
Arrangement for connecting the terminal contacts of an optoelectronic component to a printed circuit board |
Aug. 26, 2008 |
| 7372130 |
Semiconductor device including a semiconductor chip formed on an insulating element such as a tape, and including an improved insulating arrangement |
May. 13, 2008 |
| 7335975 |
Integrated circuit stacking system and method |
Feb. 26, 2008 |
| 7316939 |
Semiconductor device manufacturing method and manufacturing apparatus |
Jan. 8, 2008 |
| 7279778 |
Semiconductor package having a high-speed signal input/output terminal |
Oct. 9, 2007 |
| 7256496 |
Semiconductor device having adhesion increasing film to prevent peeling |
Aug. 14, 2007 |
| 7247951 |
Chip carrier with oxidation protection layer |
Jul. 24, 2007 |
| 7224062 |
Chip package with embedded panel-shaped component |
May. 29, 2007 |
| 7154171 |
Stacking structure for semiconductor devices using a folded over flexible substrate and method therefor |
Dec. 26, 2006 |
| 7109575 |
Low-cost flexible film package module and method of manufacturing the same |
Sep. 19, 2006 |
| 7105916 |
Inlet for an electronic tag |
Sep. 12, 2006 |
| 7091595 |
Semiconductor device with semiconductor chip and rewiring layer and method for producing the same |
Aug. 15, 2006 |
| 7061078 |
Semiconductor package |
Jun. 13, 2006 |
| 7049687 |
Tape carrier package having stacked semiconductor elements, and short and long leads |
May. 23, 2006 |
| 7038325 |
Wiring tape for semiconductor device including a buffer layer having interconnected foams |
May. 2, 2006 |
| 6987313 |
Semiconductor device |
Jan. 17, 2006 |
| 6982484 |
Semiconductor joining substrate utilizing a tape with adhesive and copper-clad laminate sheet |
Jan. 3, 2006 |
| 6975021 |
Carrier for substrate film |
Dec. 13, 2005 |
| 6953711 |
Flip chip on lead frame |
Oct. 11, 2005 |
| 6953989 |
Film carrier tape for mounting electronic devices thereon and final defect marking method using the same |
Oct. 11, 2005 |
| 6939745 |
Method of producing tab tape carrier |
Sep. 6, 2005 |
| 6940161 |
Semiconductor device and process for producing the same |
Sep. 6, 2005 |
| 6919513 |
Film carrier tape for semiconductor package and manufacturing method thereof |
Jul. 19, 2005 |
| 6900074 |
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE HAVING PLURAL SEMICONDUCTOR CHIPS, WHEREIN ELECTRODES OF THE SEMICONDUCTOR CHIPS ARE ELECTRICALLY CONNECTED TOGETHER VIA WIRING SUBSTRATES OF THE |
May. 31, 2005 |
| 6897092 |
Method of supporting a substrate film |
May. 24, 2005 |
| 6888229 |
Connection components with frangible leads and bus |
May. 3, 2005 |
| 6881611 |
Method and mold for manufacturing semiconductor device, semiconductor device and method for mounting the device |
Apr. 19, 2005 |
| 6875630 |
Lead frame, method of manufacturing the same, and method of manufacturing a semiconductor device using the same |
Apr. 5, 2005 |
| 6870274 |
Flash-preventing window ball grid array semiconductor package, method for fabricating the same, and chip carrier used in the semiconductor package |
Mar. 22, 2005 |
| 6867068 |
Semiconductor device, method of making the same, circuit board, and film carrier tape |
Mar. 15, 2005 |
| 6844219 |
Semiconductor device and lead frame therefor |
Jan. 18, 2005 |
| 6809406 |
COF tape carrier, semiconductor element, COF semiconductor device, and method for manufacturing of COF semiconductor device |
Oct. 26, 2004 |
| 6805541 |
Resin encapsulating apparatus used in a manufacture of a semiconductor device |
Oct. 19, 2004 |
| 6787915 |
Rearrangement sheet, semiconductor device and method of manufacturing thereof |
Sep. 7, 2004 |
| 6783828 |
Resin composition, adhesive film for semiconductor device, and laminated film with metallic foil and semiconductor device using the same |
Aug. 31, 2004 |
| 6780747 |
Methods for providing void-free layers for semiconductor assemblies |
Aug. 24, 2004 |
| 6759316 |
Method of manufacturing a semiconductor chip |
Jul. 6, 2004 |
| 6744120 |
Flexible interconnect substrate of a tape-shaped semiconductor device, semiconductor device and circuit board |
Jun. 1, 2004 |
| 6744123 |
Film carrier tape for mounting electronic devices thereon and method of manufacturing the same |
Jun. 1, 2004 |
| 6734372 |
Gate area relief strip for a molded I/C package |
May. 11, 2004 |
| 6720645 |
Semiconductor device |
Apr. 13, 2004 |
| 6716529 |
Adhesive sheet for semiconductor connecting substrate, adhesive-backed tape for TAB, adhesive-backed tape for wire bonding connection, semiconductor connecting substrate and semiconductor devi |
Apr. 6, 2004 |
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