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Class Information
Number: 257/E23.055
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for conducting electric current to or from solid-state body in operation, e.g., leads, terminal arrangements (epo) > Consisting of soldered or bonded constructions (epo) > Lead frames or other flat leads (epo) > Consisting of thin flexible metallic tape with or without film carrier (epo)
Description: This subclass is indented under subclass E23.031. This subclass is substantially the same in scope as ECLA classification H01L23 /495J.

Patents under this class:
1 2 3 4 5 6 7 8 9 10 11

Patent Number Title Of Patent Date Issued
8686574 Semiconductor device Apr. 1, 2014
8541809 Light-emitting surface element and method for producing a light-emitting surface element Sep. 24, 2013
8525305 Lead carrier with print-formed package components Sep. 3, 2013
8450753 Board module and method of manufacturing same May. 28, 2013
8431438 Forming in-situ micro-feature structures with coreless packages Apr. 30, 2013
8384230 Semiconductor device Feb. 26, 2013
8269322 Tape wiring substrate and tape package using the same Sep. 18, 2012
8120161 Semiconductor module including semiconductor chips coupled to external contact elements Feb. 21, 2012
8058713 COF package and tape substrate used in same Nov. 15, 2011
7968900 High performance LED package Jun. 28, 2011
7969026 Flexible carrier for high volume electronic package fabrication Jun. 28, 2011
7939917 Tape structures, and methods and apparatuses for separating a wafer using the same May. 10, 2011
7928543 Tape wiring substrate and tape package using the same Apr. 19, 2011
7902647 TAB package connecting host device element Mar. 8, 2011
7898074 Electronic devices including flexible electrical circuits and related methods Mar. 1, 2011
7880286 Tape wiring substrate and chip-on-film package using the same Feb. 1, 2011
7851927 Semiconductor component comprising a semiconductor chip and semiconductor component carrier with external connection strips Dec. 14, 2010
7847380 Tape substrate and semiconductor module for smart card, method of fabricating the same, and smart card Dec. 7, 2010
7816778 Packaged IC device comprising an embedded flex circuit on leadframe, and methods of making same Oct. 19, 2010
7763986 Semiconductor chip, film substrate, and related semiconductor chip package Jul. 27, 2010
7704793 Electronic part and method for manufacturing the same Apr. 27, 2010
7701071 Method for fabricating flip-attached and underfilled semiconductor devices Apr. 20, 2010
7663208 Punch type substrate strip Feb. 16, 2010
7649246 Tab package connecting host device element Jan. 19, 2010
7626255 Device, system and electric element Dec. 1, 2009
7575957 Leadless semiconductor package and method for manufacturing the same Aug. 18, 2009
7561434 Wired circuit board and method for manufacturing wired circuit board and mounting electronic component thereon Jul. 14, 2009
7556986 Tape supported memory card leadframe structure Jul. 7, 2009
7541665 Lead frame for a magnetic sensor Jun. 2, 2009
7525181 Tape wiring substrate and tape package using the same Apr. 28, 2009
7518238 Mounting flexible circuits onto integrated circuit substrates Apr. 14, 2009
7452754 Method for manufacturing flexible printed circuit boards Nov. 18, 2008
7449367 Adhesive film for semiconductor, metal sheet with such adhesive film, wiring substrate with adhesive film, semiconductor device, and method for manufacturing semiconductor device Nov. 11, 2008
7417292 Arrangement for connecting the terminal contacts of an optoelectronic component to a printed circuit board Aug. 26, 2008
7372130 Semiconductor device including a semiconductor chip formed on an insulating element such as a tape, and including an improved insulating arrangement May. 13, 2008
7335975 Integrated circuit stacking system and method Feb. 26, 2008
7316939 Semiconductor device manufacturing method and manufacturing apparatus Jan. 8, 2008
7279778 Semiconductor package having a high-speed signal input/output terminal Oct. 9, 2007
7256496 Semiconductor device having adhesion increasing film to prevent peeling Aug. 14, 2007
7247951 Chip carrier with oxidation protection layer Jul. 24, 2007
7224062 Chip package with embedded panel-shaped component May. 29, 2007
7154171 Stacking structure for semiconductor devices using a folded over flexible substrate and method therefor Dec. 26, 2006
7109575 Low-cost flexible film package module and method of manufacturing the same Sep. 19, 2006
7105916 Inlet for an electronic tag Sep. 12, 2006
7091595 Semiconductor device with semiconductor chip and rewiring layer and method for producing the same Aug. 15, 2006
7061078 Semiconductor package Jun. 13, 2006
7049687 Tape carrier package having stacked semiconductor elements, and short and long leads May. 23, 2006
7038325 Wiring tape for semiconductor device including a buffer layer having interconnected foams May. 2, 2006
6987313 Semiconductor device Jan. 17, 2006
6982484 Semiconductor joining substrate utilizing a tape with adhesive and copper-clad laminate sheet Jan. 3, 2006

1 2 3 4 5 6 7 8 9 10 11

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