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Class Information
Number: 257/E23.054
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for conducting electric current to or from solid-state body in operation, e.g., leads, terminal arrangements (epo) > Consisting of soldered or bonded constructions (epo) > Lead frames or other flat leads (epo) > Characterized by materials of lead frames or layers thereon (epo) > Metallic layers on lead frames (epo)
Description: This subclass is indented under subclass E23.053. This subclass is substantially the same in scope as ECLA classification H01L23/495M1.

Patents under this class:
1 2 3 4 5 6 7

Patent Number Title Of Patent Date Issued
5403466 Silver plating process for lead frames Apr. 4, 1995
5383094 Connection lead stucture for surface mountable printed circuit board components Jan. 17, 1995
5367124 Compliant lead for surface mounting a chip package to a substrate Nov. 22, 1994
5367191 Leadframe and resin-sealed semiconductor device Nov. 22, 1994
5360991 Integrated circuit devices with solderable lead frame Nov. 1, 1994
5355017 Lead frame having a die pad with metal foil layers attached to the surfaces Oct. 11, 1994
5343073 Lead frames having a chromium and zinc alloy coating Aug. 30, 1994
5338704 Semiconductor device and method of manufacturing the same Aug. 16, 1994
5329158 Surface mountable semiconductor device having self loaded solder joints Jul. 12, 1994
5326990 Composite lead frame with connected inner and outer leads Jul. 5, 1994
5305179 Surface-mounting type semiconductor package having an improved efficiency for heat dissipation Apr. 19, 1994
5300158 Protective coating having adhesion improving characteristics Apr. 5, 1994
5295297 Method of producing semiconductor memory Mar. 22, 1994
5274914 Method of producing surface package type semiconductor package Jan. 4, 1994
5274911 Electronic components with leads partly solder coated Jan. 4, 1994
5260234 Method for bonding a lead to a die pad using an electroless plating solution Nov. 9, 1993
5223746 Packaging structure for a solid-state imaging device with selectively aluminium coated leads Jun. 29, 1993
5221859 Lead frame for semiconductor device Jun. 22, 1993
5167794 Method for producing lead frame material Dec. 1, 1992
5153706 Lead frames for use in plastic mold type semiconductor devices Oct. 6, 1992
5153704 Semiconductor device using annealed bonding wire Oct. 6, 1992
5138431 Lead and socket structures with reduced self-inductance Aug. 11, 1992
5134459 Lead frame for semiconductor device Jul. 28, 1992
5095626 Method of producing semiconductor memory packages Mar. 17, 1992
5087590 Method of manufacturing semiconductor devices Feb. 11, 1992
5075258 Method for plating tab leads in an assembled semiconductor package Dec. 24, 1991
5057905 Container package for semiconductor element Oct. 15, 1991
5041901 Lead frame and semiconductor device using the same Aug. 20, 1991
5026669 Method of eliminating burrs on a lead frame with a thin metal coating Jun. 25, 1991
5015803 Thermal performance package for integrated circuit chip May. 14, 1991
5010388 Connection structure between components for semiconductor apparatus Apr. 23, 1991
5001546 Clad metal lead frame substrates Mar. 19, 1991
4971196 Surface package type semiconductor package Nov. 20, 1990
4959278 Tin whisker-free tin or tin alloy plated article and coating technique thereof Sep. 25, 1990
4942455 Lead frame for a semiconductor device and a method for manufacturing a semiconductor device using the lead frame Jul. 17, 1990
4923100 Process for producing clad sheets May. 8, 1990
4920074 Surface mount plastic package semiconductor integrated circuit, manufacturing method thereof, as well as mounting method and mounted structure thereof Apr. 24, 1990
4894752 Lead frame for a semiconductor device Jan. 16, 1990
4826736 Clad sheets May. 2, 1989
4805009 Hermetically sealed semiconductor package Feb. 14, 1989
4791031 Lead frame for IC having a wire bonding part composed of multi-layer structure of iron containing alloy, refractory metal and aluminum Dec. 13, 1988
4768077 Lead frame having non-conductive tie-bar for use in integrated circuit packages Aug. 30, 1988
4765528 Plating process for an electronic part Aug. 23, 1988
4736236 Tape bonding material and structure for electronic circuit fabrication Apr. 5, 1988
4707724 Semiconductor device and method of manufacturing thereof Nov. 17, 1987
4625228 Multi-layer electrical support substrate Nov. 25, 1986
4605533 Lead frame coated with aluminum as a packaging material in integrated circuits Aug. 12, 1986
4590672 Package for electronic device and method for producing same May. 27, 1986
4529667 Silver-coated electric composite materials Jul. 16, 1985
4441118 Composite copper nickel alloys with improved solderability shelf life Apr. 3, 1984

1 2 3 4 5 6 7

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