Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Browse by Category: Main > Physics
Class Information
Number: 257/E23.054
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for conducting electric current to or from solid-state body in operation, e.g., leads, terminal arrangements (epo) > Consisting of soldered or bonded constructions (epo) > Lead frames or other flat leads (epo) > Characterized by materials of lead frames or layers thereon (epo) > Metallic layers on lead frames (epo)
Description: This subclass is indented under subclass E23.053. This subclass is substantially the same in scope as ECLA classification H01L23/495M1.










Patents under this class:
1 2 3 4 5 6 7

Patent Number Title Of Patent Date Issued
8703544 Electronic component employing a layered frame Apr. 22, 2014
8669652 Lead component and method for manufacturing the same, and semiconductor package Mar. 11, 2014
8643144 Metal-on-passivation resistor for current sensing in a chip-scale package Feb. 4, 2014
8569112 Integrated circuit packaging system with encapsulation and leadframe etching and method of manufacture thereof Oct. 29, 2013
8541871 Multilayered lead frame for a semiconductor light-emitting device Sep. 24, 2013
8531004 Metal-on passivation resistor for current sensing in a chip-scale package Sep. 10, 2013
8513811 Electronic device and method for connecting a die to a connection terminal Aug. 20, 2013
8399303 Method for manufacturing modularized integrated circuit Mar. 19, 2013
8309400 Leadframe package structure and manufacturing method thereof Nov. 13, 2012
8198711 Lead frame Jun. 12, 2012
8163604 Integrated circuit package system using etched leadframe Apr. 24, 2012
8159055 Semiconductor device, lead-frame product used for the same and method for manufacturing the same Apr. 17, 2012
8129229 Method of manufacturing semiconductor package containing flip-chip arrangement Mar. 6, 2012
8110905 Integrated circuit packaging system with leadframe interposer and method of manufacture thereof Feb. 7, 2012
8105932 Mixed wire semiconductor lead frame package Jan. 31, 2012
8089147 IMS formed as can for semiconductor housing Jan. 3, 2012
8072054 Lead frame Dec. 6, 2011
7994616 Multilayered lead frame for a semiconductor light-emitting device Aug. 9, 2011
7872336 Low cost lead-free preplated leadframe having improved adhesion and solderability Jan. 18, 2011
7868431 Compact power semiconductor package and method with stacked inductor and integrated circuit die Jan. 11, 2011
7838972 Lead frame and method of manufacturing the same, and semiconductor device Nov. 23, 2010
7829984 Integrated circuit package system stackable devices Nov. 9, 2010
7808087 Leadframe IC packages having top and bottom integrated heat spreaders Oct. 5, 2010
7732899 Etch singulated semiconductor package Jun. 8, 2010
7701043 Lead frame Apr. 20, 2010
7692277 Multilayered lead frame for a semiconductor light-emitting device Apr. 6, 2010
7626255 Device, system and electric element Dec. 1, 2009
7608930 Semiconductor device and method of manufacturing semiconductor device Oct. 27, 2009
7595553 Packaging board and manufacturing method therefor, semiconductor module and mobile apparatus Sep. 29, 2009
7518238 Mounting flexible circuits onto integrated circuit substrates Apr. 14, 2009
7507605 Low cost lead-free preplated leadframe having improved adhesion and solderability Mar. 24, 2009
7501692 Semiconductor lead frame, semiconductor package having the same, and method of plating the same Mar. 10, 2009
7462926 Leadframe comprising tin plating or an intermetallic layer formed therefrom Dec. 9, 2008
7384807 Method of fabricating vertical structure compound semiconductor devices Jun. 10, 2008
7368326 Methods and apparatus to reduce growth formations on plated conductive leads May. 6, 2008
7368807 Low cost method to produce high volume lead frames May. 6, 2008
7361531 Methods and apparatus for Flip-Chip-On-Lead semiconductor package Apr. 22, 2008
7348664 Semiconductor apparatus having a cooling apparatus that compressively engages a semiconductor device Mar. 25, 2008
7332375 Method of making an integrated circuit package Feb. 19, 2008
7329944 Leadframe for semiconductor device Feb. 12, 2008
7285845 Lead frame for semiconductor package Oct. 23, 2007
7278202 Method for making overlay surface mount resistor Oct. 9, 2007
7268415 Semiconductor device having post-mold nickel/palladium/gold plated leads Sep. 11, 2007
7262440 Light emitting diode package and fabrication method thereof Aug. 28, 2007
7256481 Leadframes for improved moisture reliability and enhanced solderability of semiconductor devices Aug. 14, 2007
7192809 Low cost method to produce high volume lead frames Mar. 20, 2007
7176582 Semiconductor device and method of manufacturing same Feb. 13, 2007
7138707 Semiconductor package including leads and conductive posts for providing increased functionality Nov. 21, 2006
7119420 Chip packaging structure adapted to reduce electromagnetic interference Oct. 10, 2006
7064008 Semiconductor leadframes plated with thick nickel, minimum palladium, and pure tin Jun. 20, 2006

1 2 3 4 5 6 7










 
 
  Recently Added Patents
Systems and methods for vehicle cruise control
Compositions and methods for concentrating and depleting microorganisms
Linked area parameter adjustment for spinal cord stimulation and associated systems and methods
Quaternary chalcogenide wafers
Data center with free-space optical communications
Defect inspection method and device therefor
Method of providing tailor-made software for hospital departments
  Randomly Featured Patents
Method for inhibiting 15-lipoxygenase with fermented Glycine max (L.) extract
Method and apparatus for the positioning of textile surface configurations
Apparatus for treating tail yarn in textile spindle assembly
Reticular discrimination network for specifying real-time conditions
Power unit
System and method for process scheduling
Composite spacer with Inconel grid and Zircaloy band
Apparatus and methods for cleaning and priming droplet dispensing devices
Advertising novelty
Medical device for toilet training young children