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Class Information
Number: 257/E23.054
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for conducting electric current to or from solid-state body in operation, e.g., leads, terminal arrangements (epo) > Consisting of soldered or bonded constructions (epo) > Lead frames or other flat leads (epo) > Characterized by materials of lead frames or layers thereon (epo) > Metallic layers on lead frames (epo)
Description: This subclass is indented under subclass E23.053. This subclass is substantially the same in scope as ECLA classification H01L23/495M1.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7608930 |
Semiconductor device and method of manufacturing semiconductor device |
Oct. 27, 2009 |
| 7595553 |
Packaging board and manufacturing method therefor, semiconductor module and mobile apparatus |
Sep. 29, 2009 |
| 7518238 |
Mounting flexible circuits onto integrated circuit substrates |
Apr. 14, 2009 |
| 7507605 |
Low cost lead-free preplated leadframe having improved adhesion and solderability |
Mar. 24, 2009 |
| 7501692 |
Semiconductor lead frame, semiconductor package having the same, and method of plating the same |
Mar. 10, 2009 |
| 7462926 |
Leadframe comprising tin plating or an intermetallic layer formed therefrom |
Dec. 9, 2008 |
| 7384807 |
Method of fabricating vertical structure compound semiconductor devices |
Jun. 10, 2008 |
| 7368807 |
Low cost method to produce high volume lead frames |
May. 6, 2008 |
| 7368326 |
Methods and apparatus to reduce growth formations on plated conductive leads |
May. 6, 2008 |
| 7361531 |
Methods and apparatus for Flip-Chip-On-Lead semiconductor package |
Apr. 22, 2008 |
| 7348664 |
Semiconductor apparatus having a cooling apparatus that compressively engages a semiconductor device |
Mar. 25, 2008 |
| 7332375 |
Method of making an integrated circuit package |
Feb. 19, 2008 |
| 7329944 |
Leadframe for semiconductor device |
Feb. 12, 2008 |
| 7285845 |
Lead frame for semiconductor package |
Oct. 23, 2007 |
| 7278202 |
Method for making overlay surface mount resistor |
Oct. 9, 2007 |
| 7268415 |
Semiconductor device having post-mold nickel/palladium/gold plated leads |
Sep. 11, 2007 |
| 7262440 |
Light emitting diode package and fabrication method thereof |
Aug. 28, 2007 |
| 7256481 |
Leadframes for improved moisture reliability and enhanced solderability of semiconductor devices |
Aug. 14, 2007 |
| 7192809 |
Low cost method to produce high volume lead frames |
Mar. 20, 2007 |
| 7176582 |
Semiconductor device and method of manufacturing same |
Feb. 13, 2007 |
| 7138707 |
Semiconductor package including leads and conductive posts for providing increased functionality |
Nov. 21, 2006 |
| 7119420 |
Chip packaging structure adapted to reduce electromagnetic interference |
Oct. 10, 2006 |
| 7064008 |
Semiconductor leadframes plated with thick nickel, minimum palladium, and pure tin |
Jun. 20, 2006 |
| 7063896 |
Metallic surface of a body, method for producing a structured metallic surface of a body and the use thereof |
Jun. 20, 2006 |
| 7060534 |
Housing for semiconductor devices, semiconductor device pin, and method for the manufacturing of pins |
Jun. 13, 2006 |
| 7053492 |
Circuit device and method of manufacturing the same |
May. 30, 2006 |
| 7038306 |
Semiconductor integrated circuit device and method of manufacturing the same |
May. 2, 2006 |
| 7005731 |
Plastic lead frames for semiconductor devices and packages including same |
Feb. 28, 2006 |
| 6995042 |
Method for fabricating preplated nickel/palladium and tin leadframes |
Feb. 7, 2006 |
| 6981585 |
Surface package type semiconductor package and method of producing semiconductor memory |
Jan. 3, 2006 |
| 6979889 |
Plastic lead frames for semiconductor devices |
Dec. 27, 2005 |
| 6960823 |
Semiconductor device and method of manufacturing the same |
Nov. 1, 2005 |
| 6953986 |
Leadframes for high adhesion semiconductor devices and method of fabrication |
Oct. 11, 2005 |
| 6949412 |
Clad plate for forming interposer for semiconductor device, interposer for semiconductor device, and method of manufacturing them |
Sep. 27, 2005 |
| 6943434 |
Method for maintaining solder thickness in flipchip attach packaging processes |
Sep. 13, 2005 |
| 6933177 |
Aluminum leadframes for semiconductor devices and method of fabrication |
Aug. 23, 2005 |
| 6924548 |
Semiconductor device and its manufacturing method with leads that have an inverted trapezoid-like section |
Aug. 2, 2005 |
| 6917098 |
Three-level leadframe for no-lead packages |
Jul. 12, 2005 |
| 6889428 |
Method of manufacturing sheet material and method of manufacturing circuit device using the same |
May. 10, 2005 |
| 6891253 |
Semiconductor integrated circuit device and method of manufacturing the same |
May. 10, 2005 |
| 6884708 |
Method of partially plating substrate for electronic devices |
Apr. 26, 2005 |
| 6882048 |
Lead frame and semiconductor package having a groove formed in the respective terminals for limiting a plating area |
Apr. 19, 2005 |
| 6872600 |
Plastic lead frames for semiconductor devices, packages including same, and methods of fabrication |
Mar. 29, 2005 |
| 6864579 |
Carrier with a metal area and at least one chip configured on the metal area |
Mar. 8, 2005 |
| 6861295 |
Low-pin-count chip package and manufacturing method thereof |
Mar. 1, 2005 |
| 6841422 |
Plastic lead frames for semiconductor devices, packages including same, and methods of fabrication |
Jan. 11, 2005 |
| 6838318 |
Clad plate for forming interposer for semiconductor device, interposer for semiconductor device, and method of manufacturing them |
Jan. 4, 2005 |
| 6837252 |
Apparatus for treating a workpiece with steam and ozone |
Jan. 4, 2005 |
| 6837980 |
Bond enhancement antitarnish coatings |
Jan. 4, 2005 |
| 6838757 |
Preplating of semiconductor small outline no-lead leadframes |
Jan. 4, 2005 |
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