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Class Information
Number: 257/E23.053
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for conducting electric current to or from solid-state body in operation, e.g., leads, terminal arrangements (epo) > Consisting of soldered or bonded constructions (epo) > Lead frames or other flat leads (epo) > Characterized by materials of lead frames or layers thereon (epo)
Description: This subclass is indented under subclass E21.031. This subclass is substantially the same in scope as ECLA classification H01L23/495M.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7547581 |
Manufacturing method of a semiconductor device to suppress generation of whiskers |
Jun. 16, 2009 |
| 7524702 |
Conductor substrate, semiconductor device and production method thereof |
Apr. 28, 2009 |
| 7462926 |
Leadframe comprising tin plating or an intermetallic layer formed therefrom |
Dec. 9, 2008 |
| 7432584 |
Leadframe for use in a semiconductor package |
Oct. 7, 2008 |
| 7368326 |
Methods and apparatus to reduce growth formations on plated conductive leads |
May. 6, 2008 |
| 7329944 |
Leadframe for semiconductor device |
Feb. 12, 2008 |
| 7262440 |
Light emitting diode package and fabrication method thereof |
Aug. 28, 2007 |
| 7256481 |
Leadframes for improved moisture reliability and enhanced solderability of semiconductor devices |
Aug. 14, 2007 |
| 7202113 |
Wafer level bumpless method of making a flip chip mounted semiconductor device package |
Apr. 10, 2007 |
| 7172958 |
High-frequency wiring structure and method for producing the same |
Feb. 6, 2007 |
| 7005731 |
Plastic lead frames for semiconductor devices and packages including same |
Feb. 28, 2006 |
| 6979889 |
Plastic lead frames for semiconductor devices |
Dec. 27, 2005 |
| 6872600 |
Plastic lead frames for semiconductor devices, packages including same, and methods of fabrication |
Mar. 29, 2005 |
| 6841422 |
Plastic lead frames for semiconductor devices, packages including same, and methods of fabrication |
Jan. 11, 2005 |
| 6787399 |
Plastic lead frames for semiconductor devices, packages including same, and methods of fabrication |
Sep. 7, 2004 |
| 6762485 |
Plastic lead frames for semiconductor devices |
Jul. 13, 2004 |
| 6724073 |
Plastic lead frames for semiconductor devices and packages including same |
Apr. 20, 2004 |
| 6692992 |
Hardened Fe-Ni alloy for the manufacture of integrated circuit leaderframes and manufacturing process |
Feb. 17, 2004 |
| 6592810 |
FE-NI ALLOY HAVING HIGH STRENGTH AND LOW THERMAL EXPANSION, A SHADOW MASK MADE OF THE ALLOY, A BRAUN TUBE WITH THE SHADOW MASK, A LEAD FRAME MADE OF THE ALLOY AND A SEMICONDUCTOR ELEMENT WITH |
Jul. 15, 2003 |
| 6544820 |
Plastic lead frames for semiconductor devices, packages including same, and methods of fabrication |
Apr. 8, 2003 |
| 6376905 |
Semiconductor package |
Apr. 23, 2002 |
| 6323543 |
Plastic lead frames for semiconductor devices, packages including same, and methods of fabrication |
Nov. 27, 2001 |
| 6316824 |
Plastic leads frames for semiconductor devices |
Nov. 13, 2001 |
| 6294410 |
Plastic lead frames for semiconductor devices, packages including same, and methods of fabrication |
Sep. 25, 2001 |
| 6215185 |
Power semiconductor module |
Apr. 10, 2001 |
| 6215166 |
Radio frequency electronic device and method for regulating an amount of power delivered to a radio frequency electronic device |
Apr. 10, 2001 |
| 6215191 |
Compliant lead structures for microelectronic devices |
Apr. 10, 2001 |
| 6153031 |
Lean, high conductivity, relaxation-resistant beryllium-nickel-copper alloys |
Nov. 28, 2000 |
| 6149741 |
Copper-based alloy having a high electrical conductivity and a high softening temperature for application in electronics |
Nov. 21, 2000 |
| 6139977 |
Palladium surface coating suitable for wirebonding and process for forming palladium surface coatings |
Oct. 31, 2000 |
| 6132529 |
Leadframe made of a high-strength, high-electroconductivity copper alloy |
Oct. 17, 2000 |
| 6124151 |
Plastic lead frames for semiconductor devices, packages including same, and methods of fabrication |
Sep. 26, 2000 |
| 6117566 |
Lead frame material |
Sep. 12, 2000 |
| 6091136 |
Plastic lead frames for semiconductor devices |
Jul. 18, 2000 |
| 6001196 |
Lean, high conductivity, relaxation-resistant beryllium-nickel-copper alloys |
Dec. 14, 1999 |
| 5993574 |
Lean, high conductivity, relaxation-resistant beryllium-nickel-copper alloys |
Nov. 30, 1999 |
| 5976915 |
Low mutual inductance lead frame device |
Nov. 2, 1999 |
| 5966592 |
Structure and method for making a compliant lead for a microelectronic device |
Oct. 12, 1999 |
| 5945732 |
Apparatus and method of manufacturing a warp resistant thermally conductive integrated circuit package |
Aug. 31, 1999 |
| 5888848 |
Connection leads for an electronic component |
Mar. 30, 1999 |
| 5879965 |
Plastic lead frames for semiconductor devices, packages including same, and methods of fabrication |
Mar. 9, 1999 |
| 5880520 |
Low mutual inductance lead frame device |
Mar. 9, 1999 |
| 5814168 |
Process for producing high-strength, high-electroconductivity copper-base alloys |
Sep. 29, 1998 |
| 5792286 |
High-strength thin plate of iron-nickel-cobalt alloy excellent in corrosion resisitance, repeated bending behavior and etchability, and production thereof |
Aug. 11, 1998 |
| 5744868 |
Encapsulated electronic component having a plurality of connection leads of martensitic structural-hardening conductive alloy |
Apr. 28, 1998 |
| 5728599 |
Printable superconductive leadframes for semiconductor device assembly |
Mar. 17, 1998 |
| 5593918 |
Techniques for forming superconductive lines |
Jan. 14, 1997 |
| 5585195 |
Metal insert and rough-surface treatment method thereof |
Dec. 17, 1996 |
| 5563442 |
Leadframe having exposed, solderable outer lead ends |
Oct. 8, 1996 |
| 5540378 |
Method for the assembly of an electronic package |
Jul. 30, 1996 |
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