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Class Information
Number: 257/E23.053
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for conducting electric current to or from solid-state body in operation, e.g., leads, terminal arrangements (epo) > Consisting of soldered or bonded constructions (epo) > Lead frames or other flat leads (epo) > Characterized by materials of lead frames or layers thereon (epo)
Description: This subclass is indented under subclass E21.031. This subclass is substantially the same in scope as ECLA classification H01L23/495M.










Sub-classes under this class:

Class Number Class Name Patents
257/E23.054 Metallic layers on lead frames (epo) 309


Patents under this class:
1 2 3

Patent Number Title Of Patent Date Issued
8674488 Light emitting diode (LED) packages Mar. 18, 2014
8669652 Lead component and method for manufacturing the same, and semiconductor package Mar. 11, 2014
8664745 Integrated inductor Mar. 4, 2014
8314479 Leadframe package with recessed cavity for LED Nov. 20, 2012
8283759 Lead frame having outer leads coated with a four layer plating Oct. 9, 2012
8129227 Semiconductor device having grooved leads to confine solder wicking Mar. 6, 2012
8120161 Semiconductor module including semiconductor chips coupled to external contact elements Feb. 21, 2012
8022514 Integrated circuit package system with leadfinger support Sep. 20, 2011
7969002 Integrated circuit packages incorporating an inductor and methods Jun. 28, 2011
7932130 Method for forming an etched recess package on package system Apr. 26, 2011
7855391 Lead frame and light emitting device package using the same Dec. 21, 2010
7838972 Lead frame and method of manufacturing the same, and semiconductor device Nov. 23, 2010
7791178 Lead frame unit, semiconductor package having a lead frame unit, stacked semiconductor package having a semiconductor package and methods of manufacturing the same Sep. 7, 2010
7671453 Semiconductor device and method for producing the same Mar. 2, 2010
7547581 Manufacturing method of a semiconductor device to suppress generation of whiskers Jun. 16, 2009
7524702 Conductor substrate, semiconductor device and production method thereof Apr. 28, 2009
7462926 Leadframe comprising tin plating or an intermetallic layer formed therefrom Dec. 9, 2008
7432584 Leadframe for use in a semiconductor package Oct. 7, 2008
7368326 Methods and apparatus to reduce growth formations on plated conductive leads May. 6, 2008
7329944 Leadframe for semiconductor device Feb. 12, 2008
7262440 Light emitting diode package and fabrication method thereof Aug. 28, 2007
7256481 Leadframes for improved moisture reliability and enhanced solderability of semiconductor devices Aug. 14, 2007
7202113 Wafer level bumpless method of making a flip chip mounted semiconductor device package Apr. 10, 2007
7172958 High-frequency wiring structure and method for producing the same Feb. 6, 2007
7005731 Plastic lead frames for semiconductor devices and packages including same Feb. 28, 2006
6979889 Plastic lead frames for semiconductor devices Dec. 27, 2005
6872600 Plastic lead frames for semiconductor devices, packages including same, and methods of fabrication Mar. 29, 2005
6841422 Plastic lead frames for semiconductor devices, packages including same, and methods of fabrication Jan. 11, 2005
6787399 Plastic lead frames for semiconductor devices, packages including same, and methods of fabrication Sep. 7, 2004
6762485 Plastic lead frames for semiconductor devices Jul. 13, 2004
6724073 Plastic lead frames for semiconductor devices and packages including same Apr. 20, 2004
6692992 Hardened Fe-Ni alloy for the manufacture of integrated circuit leaderframes and manufacturing process Feb. 17, 2004
6592810 FE-NI ALLOY HAVING HIGH STRENGTH AND LOW THERMAL EXPANSION, A SHADOW MASK MADE OF THE ALLOY, A BRAUN TUBE WITH THE SHADOW MASK, A LEAD FRAME MADE OF THE ALLOY AND A SEMICONDUCTOR ELEMENT WITH Jul. 15, 2003
6544820 Plastic lead frames for semiconductor devices, packages including same, and methods of fabrication Apr. 8, 2003
6376905 Semiconductor package Apr. 23, 2002
6323543 Plastic lead frames for semiconductor devices, packages including same, and methods of fabrication Nov. 27, 2001
6316824 Plastic leads frames for semiconductor devices Nov. 13, 2001
6294410 Plastic lead frames for semiconductor devices, packages including same, and methods of fabrication Sep. 25, 2001
6215166 Radio frequency electronic device and method for regulating an amount of power delivered to a radio frequency electronic device Apr. 10, 2001
6215191 Compliant lead structures for microelectronic devices Apr. 10, 2001
6215185 Power semiconductor module Apr. 10, 2001
6153031 Lean, high conductivity, relaxation-resistant beryllium-nickel-copper alloys Nov. 28, 2000
6149741 Copper-based alloy having a high electrical conductivity and a high softening temperature for application in electronics Nov. 21, 2000
6139977 Palladium surface coating suitable for wirebonding and process for forming palladium surface coatings Oct. 31, 2000
6132529 Leadframe made of a high-strength, high-electroconductivity copper alloy Oct. 17, 2000
6124151 Plastic lead frames for semiconductor devices, packages including same, and methods of fabrication Sep. 26, 2000
6117566 Lead frame material Sep. 12, 2000
6091136 Plastic lead frames for semiconductor devices Jul. 18, 2000
6001196 Lean, high conductivity, relaxation-resistant beryllium-nickel-copper alloys Dec. 14, 1999
5993574 Lean, high conductivity, relaxation-resistant beryllium-nickel-copper alloys Nov. 30, 1999

1 2 3










 
 
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