| |
 |
|
Class Information
Number: 257/E23.052
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for conducting electric current to or from solid-state body in operation, e.g., leads, terminal arrangements (epo) > Consisting of soldered or bonded constructions (epo) > Lead frames or other flat leads (epo) > Assembly of semiconductor devices on lead frame (epo)
Description: This subclass is indented under subclass E21.031. This subclass is substantially the same in scope as ECLA classification H01L23/495L.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7459776 |
Stacked die assembly having semiconductor die projecting beyond support |
Dec. 2, 2008 |
| 7453159 |
Semiconductor chip having bond pads |
Nov. 18, 2008 |
| 7449370 |
Production process for manufacturing such semiconductor package |
Nov. 11, 2008 |
| 7443014 |
Electronic module and method of assembling the same |
Oct. 28, 2008 |
| 7432588 |
Semiconductor device and method of fabricating the same |
Oct. 7, 2008 |
| 7425756 |
Semiconductor device and electronic device |
Sep. 16, 2008 |
| 7391100 |
Integrated circuit package for semiconductor devices having a reduced leadframe pad and an increased bonding area |
Jun. 24, 2008 |
| 7385281 |
Semiconductor integrated circuit device |
Jun. 10, 2008 |
| 7382000 |
Semiconductor device |
Jun. 3, 2008 |
| 7361983 |
Semiconductor device and semiconductor assembly module with a gap-controlling lead structure |
Apr. 22, 2008 |
| 7332806 |
Thin, thermally enhanced molded package with leadframe having protruding region |
Feb. 19, 2008 |
| 7315078 |
Chip-stacked semiconductor package and method for fabricating the same |
Jan. 1, 2008 |
| 7304385 |
Semiconductor chip capable of implementing wire bonding over active circuits |
Dec. 4, 2007 |
| 7304370 |
Electronic device having wiring substrate and lead frame |
Dec. 4, 2007 |
| 7262440 |
Light emitting diode package and fabrication method thereof |
Aug. 28, 2007 |
| 7253506 |
Micro lead frame package |
Aug. 7, 2007 |
| 7242085 |
Semiconductor device including a semiconductor chip mounted on a metal base |
Jul. 10, 2007 |
| 7242078 |
Surface mount multichip devices |
Jul. 10, 2007 |
| 7235871 |
Stacked microelectronic dies |
Jun. 26, 2007 |
| 7230320 |
Electronic circuit device with reduced breaking and cracking |
Jun. 12, 2007 |
| 7227251 |
Semiconductor device and a memory system including a plurality of IC chips in a common package |
Jun. 5, 2007 |
| 7227249 |
Three-dimensional stacked semiconductor package with chips on opposite sides of lead |
Jun. 5, 2007 |
| 7227198 |
Half-bridge package |
Jun. 5, 2007 |
| 7224053 |
Semiconductor device responsive to different levels of input and output signals and signal processing system using the same |
May. 29, 2007 |
| 7199458 |
Stacked offset semiconductor package and method for fabricating |
Apr. 3, 2007 |
| 7199469 |
Semiconductor device having stacked semiconductor chips sealed with a resin seal member |
Apr. 3, 2007 |
| 7176062 |
Lead-frame method and assembly for interconnecting circuits within a circuit module |
Feb. 13, 2007 |
| 7148578 |
Semiconductor multi-chip package |
Dec. 12, 2006 |
| 7138707 |
Semiconductor package including leads and conductive posts for providing increased functionality |
Nov. 21, 2006 |
| 7132753 |
Stacked die assembly having semiconductor die overhanging support |
Nov. 7, 2006 |
| 7132752 |
Semiconductor chip and semiconductor device including lamination of semiconductor chips |
Nov. 7, 2006 |
| 7088003 |
Structures and methods for integration of ultralow-k dielectrics with improved reliability |
Aug. 8, 2006 |
| 7075173 |
Interposer including adhesive tape |
Jul. 11, 2006 |
| 7075174 |
Semiconductor packaging techniques for use with non-ceramic packages |
Jul. 11, 2006 |
| 7074647 |
Semiconductor component comprising leadframe, semiconductor chip and integrated passive component in vertical relationship to each other |
Jul. 11, 2006 |
| 7071033 |
Method for forming semiconductor device including stacked dies |
Jul. 4, 2006 |
| 7071543 |
Semiconductor device and manufacturing method thereof |
Jul. 4, 2006 |
| 7064425 |
Semiconductor device circuit board, and electronic equipment |
Jun. 20, 2006 |
| 7061080 |
Power module package having improved heat dissipating capability |
Jun. 13, 2006 |
| 7057281 |
Microelectronic component assemblies employing lead frames having reduced-thickness inner lengths |
Jun. 6, 2006 |
| 7057273 |
Surface mount package |
Jun. 6, 2006 |
| 7053469 |
Leadless semiconductor package and manufacturing method thereof |
May. 30, 2006 |
| 7053474 |
Semiconductor component having at least two chips which are integrated in a housing and with which contact is made by a common contact chip |
May. 30, 2006 |
| 7049684 |
Lead frame and method of producing the same, and resin-encapsulated semiconductor device and method of producing the same |
May. 23, 2006 |
| 7049687 |
Tape carrier package having stacked semiconductor elements, and short and long leads |
May. 23, 2006 |
| 7045386 |
Semiconductor device and semiconductor chip for use therein |
May. 16, 2006 |
| 7045907 |
Semiconductor device and method of manufacturing same |
May. 16, 2006 |
| 7041537 |
Method for fabricating semiconductor component with on board capacitor |
May. 9, 2006 |
| 7042085 |
Method for packaging electronic modules and multiple chip packaging |
May. 9, 2006 |
| 7042078 |
Semiconductor package |
May. 9, 2006 |
|
|
|
