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Class Information
Number: 257/E23.052
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for conducting electric current to or from solid-state body in operation, e.g., leads, terminal arrangements (epo) > Consisting of soldered or bonded constructions (epo) > Lead frames or other flat leads (epo) > Assembly of semiconductor devices on lead frame (epo)
Description: This subclass is indented under subclass E21.031. This subclass is substantially the same in scope as ECLA classification H01L23/495L.










Patents under this class:
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Patent Number Title Of Patent Date Issued
8692387 Stacked die semiconductor package Apr. 8, 2014
8686550 Method and apparatus for high pressure sensor device Apr. 1, 2014
8686547 Stack die structure for stress reduction and facilitation of electromagnetic shielding Apr. 1, 2014
8680659 Semiconductor device Mar. 25, 2014
8674486 Isolation barrier device and methods of use Mar. 18, 2014
8674487 Semiconductor packages with lead extensions and related methods Mar. 18, 2014
8653636 Contactless communication medium Feb. 18, 2014
8648449 Electrical connectivity for circuit applications Feb. 11, 2014
8637966 Semiconductor device Jan. 28, 2014
8604627 Semiconductor device Dec. 10, 2013
8598694 Chip-package having a cavity and a manufacturing method thereof Dec. 3, 2013
8587101 Multi-chip module (MCM) power quad flat no-lead (PQFN) semiconductor package utilizing a leadframe for electrical interconnections Nov. 19, 2013
8586422 Optical semiconductor device having pre-molded leadframe with window and method therefor Nov. 19, 2013
8575738 Semiconductor memory card Nov. 5, 2013
8535987 Method of manufacturing substrate for semiconductor element, and semiconductor device Sep. 17, 2013
8525305 Lead carrier with print-formed package components Sep. 3, 2013
8525315 Semiconductor power module and method of manufacturing the same Sep. 3, 2013
8519520 Semiconductor package of small footprint with a stack of lead frame die paddle sandwich between high-side and low-side MOSFETs and manufacturing method Aug. 27, 2013
8519519 Semiconductor device having die pads isolated from interconnect portion and method of assembling same Aug. 27, 2013
8513811 Electronic device and method for connecting a die to a connection terminal Aug. 20, 2013
8497572 Semiconductor module and method of manufacturing the same Jul. 30, 2013
8476746 Package structure enhancing molding compound bondability Jul. 2, 2013
8461669 Integrated power converter package with die stacking Jun. 11, 2013
8424195 Apparatus for manufacturing semiconductor package for wide lead frame and method of constructing semiconductor package using the same Apr. 23, 2013
8427844 Widebody coil isolators Apr. 23, 2013
8421198 Integrated circuit package system with external interconnects at high density Apr. 16, 2013
8390041 High efficiency module Mar. 5, 2013
8377750 Integrated circuit packaging system with multiple row leads and method of manufacture thereof Feb. 19, 2013
8378470 Semiconductor device that performs signal transmission using induction coupling, method of said manufacturing semiconductor device, and lead frame thereof Feb. 19, 2013
8367474 Method of manufacturing integrated circuit having stress tuning layer Feb. 5, 2013
8368112 Aligned multiple emitter package Feb. 5, 2013
8338927 Semiconductor device with the leads projected from sealing body Dec. 25, 2012
8324025 Power semiconductor device packaging Dec. 4, 2012
8314489 Semiconductor module and method for production thereof Nov. 20, 2012
8299587 Lead frame package structure for side-by-side disposed chips Oct. 30, 2012
8293547 Hybrid integrated circuit device Oct. 23, 2012
8288848 Semiconductor chip package including a lead frame Oct. 16, 2012
8283756 Electronic component with buffer layer Oct. 9, 2012
8237232 Semiconductor device including a DC-DC converter having a metal plate Aug. 7, 2012
8212347 Stacked chip package structure with leadframe having bus bar Jul. 3, 2012
8212343 Semiconductor chip package Jul. 3, 2012
8207603 Stacked chip package structure with leadframe having inner leads with transfer pad Jun. 26, 2012
RE43443 Leadframe semiconductor integrated circuit device using the same, and method of and process for fabricating the two Jun. 5, 2012
8183687 Interposer for die stacking in semiconductor packages and the method of making the same May. 22, 2012
8169062 Integrated circuit package for semiconductior devices with improved electric resistance and inductance May. 1, 2012
8153478 Method for manufacturing integrated circuit package system with under paddle leadfingers Apr. 10, 2012
8110905 Integrated circuit packaging system with leadframe interposer and method of manufacture thereof Feb. 7, 2012
8106490 Semiconductor chip package Jan. 31, 2012
8102040 Integrated circuit package system with die and package combination Jan. 24, 2012
8097935 Quad flat package Jan. 17, 2012

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