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Class Information
Number: 257/E23.052
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for conducting electric current to or from solid-state body in operation, e.g., leads, terminal arrangements (epo) > Consisting of soldered or bonded constructions (epo) > Lead frames or other flat leads (epo) > Assembly of semiconductor devices on lead frame (epo)
Description: This subclass is indented under subclass E21.031. This subclass is substantially the same in scope as ECLA classification H01L23/495L.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7615853 |
Chip-stacked package structure having leadframe with multi-piece bus bar |
Nov. 10, 2009 |
| 7612434 |
Electronic device having wiring substrate and lead frame |
Nov. 3, 2009 |
| 7612436 |
Packaged microelectronic devices with a lead frame |
Nov. 3, 2009 |
| 7598605 |
Semiconductor device having capacitive insulation means and communication terminal using the device |
Oct. 6, 2009 |
| 7598606 |
Integrated circuit package system with die and package combination |
Oct. 6, 2009 |
| 7576440 |
Semiconductor chip having bond pads and multi-chip package |
Aug. 18, 2009 |
| 7575957 |
Leadless semiconductor package and method for manufacturing the same |
Aug. 18, 2009 |
| 7557454 |
Assemblies with bond pads of two or more semiconductor devices electrically connected to the same surface of a plurality of leads |
Jul. 7, 2009 |
| 7547977 |
Semiconductor chip having bond pads |
Jun. 16, 2009 |
| 7541682 |
Semiconductor chip having bond pads |
Jun. 2, 2009 |
| 7541664 |
Lead frame and semiconductor device having the lead frame |
Jun. 2, 2009 |
| 7535087 |
Semiconductor device with lead frames |
May. 19, 2009 |
| 7531893 |
Power semiconductor devices having integrated inductor |
May. 12, 2009 |
| 7528469 |
Semiconductor equipment having multiple semiconductor devices and multiple lead frames |
May. 5, 2009 |
| 7525183 |
Surface mount multichip devices |
Apr. 28, 2009 |
| 7518223 |
Semiconductor devices and semiconductor device assemblies including a nonconfluent spacer layer |
Apr. 14, 2009 |
| 7514796 |
Semiconductor chip capable of being laminated and a semiconductor device including the lamination of a plurality of semiconductor chips |
Apr. 7, 2009 |
| 7508059 |
Stacked chip package with redistribution lines |
Mar. 24, 2009 |
| 7501702 |
Integrated transistor module and method of fabricating same |
Mar. 10, 2009 |
| 7495323 |
Semiconductor package structure having multiple heat dissipation paths and method of manufacture |
Feb. 24, 2009 |
| 7495327 |
Chip stacking structure |
Feb. 24, 2009 |
| 7479691 |
Power semiconductor module having surface-mountable flat external contacts and method for producing the same |
Jan. 20, 2009 |
| 7466024 |
Multi-chip semiconductor device package |
Dec. 16, 2008 |
| 7459776 |
Stacked die assembly having semiconductor die projecting beyond support |
Dec. 2, 2008 |
| 7453159 |
Semiconductor chip having bond pads |
Nov. 18, 2008 |
| 7449370 |
Production process for manufacturing such semiconductor package |
Nov. 11, 2008 |
| 7443014 |
Electronic module and method of assembling the same |
Oct. 28, 2008 |
| 7432588 |
Semiconductor device and method of fabricating the same |
Oct. 7, 2008 |
| 7425756 |
Semiconductor device and electronic device |
Sep. 16, 2008 |
| 7391100 |
Integrated circuit package for semiconductor devices having a reduced leadframe pad and an increased bonding area |
Jun. 24, 2008 |
| 7385281 |
Semiconductor integrated circuit device |
Jun. 10, 2008 |
| 7382000 |
Semiconductor device |
Jun. 3, 2008 |
| 7361983 |
Semiconductor device and semiconductor assembly module with a gap-controlling lead structure |
Apr. 22, 2008 |
| 7332806 |
Thin, thermally enhanced molded package with leadframe having protruding region |
Feb. 19, 2008 |
| 7315078 |
Chip-stacked semiconductor package and method for fabricating the same |
Jan. 1, 2008 |
| 7304370 |
Electronic device having wiring substrate and lead frame |
Dec. 4, 2007 |
| 7304385 |
Semiconductor chip capable of implementing wire bonding over active circuits |
Dec. 4, 2007 |
| 7262440 |
Light emitting diode package and fabrication method thereof |
Aug. 28, 2007 |
| 7253506 |
Micro lead frame package |
Aug. 7, 2007 |
| 7242078 |
Surface mount multichip devices |
Jul. 10, 2007 |
| 7242085 |
Semiconductor device including a semiconductor chip mounted on a metal base |
Jul. 10, 2007 |
| 7235871 |
Stacked microelectronic dies |
Jun. 26, 2007 |
| 7230320 |
Electronic circuit device with reduced breaking and cracking |
Jun. 12, 2007 |
| 7227249 |
Three-dimensional stacked semiconductor package with chips on opposite sides of lead |
Jun. 5, 2007 |
| 7227198 |
Half-bridge package |
Jun. 5, 2007 |
| 7227251 |
Semiconductor device and a memory system including a plurality of IC chips in a common package |
Jun. 5, 2007 |
| 7224053 |
Semiconductor device responsive to different levels of input and output signals and signal processing system using the same |
May. 29, 2007 |
| 7199469 |
Semiconductor device having stacked semiconductor chips sealed with a resin seal member |
Apr. 3, 2007 |
| 7199458 |
Stacked offset semiconductor package and method for fabricating |
Apr. 3, 2007 |
| 7176062 |
Lead-frame method and assembly for interconnecting circuits within a circuit module |
Feb. 13, 2007 |
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