| |
 |
|
Class Information
Number: 257/E23.051
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for conducting electric current to or from solid-state body in operation, e.g., leads, terminal arrangements (epo) > Consisting of soldered or bonded constructions (epo) > Lead frames or other flat leads (epo) > Specifically adapted to facilitate heat dissipation (epo)
Description: This subclass is indented under subclass E21.031. This subclass is substantially the same in scope as ECLA classification H01L23/495H.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7626251 |
Microelectronic die assembly having thermally conductive element at a backside thereof and method of making same |
Dec. 1, 2009 |
| 7626259 |
Heat sink for a high capacity thin module system |
Dec. 1, 2009 |
| 7622803 |
Heat sink assembly and related methods for semiconductor vacuum processing systems |
Nov. 24, 2009 |
| 7612448 |
Power module having a cooling device and semiconductor devices mounted on a resin substrate, method of producing same, and air conditioner |
Nov. 3, 2009 |
| 7608915 |
Heat dissipation semiconductor package |
Oct. 27, 2009 |
| 7598535 |
Light-emitting diode assembly and method of fabrication |
Oct. 6, 2009 |
| 7592702 |
Via heat sink material |
Sep. 22, 2009 |
| 7592695 |
Compound heat sink |
Sep. 22, 2009 |
| 7589401 |
Lightweight, hermetically sealed package having auxiliary, selectively contoured, low mass, pseudo wall insert for surface-mounting and dissipating heat from electronic circuit components |
Sep. 15, 2009 |
| 7585702 |
Structure and assembly procedure for low stress thin die flip chip packages designed for low-K Si and thin core substrate |
Sep. 8, 2009 |
| 7579687 |
Circuit module turbulence enhancement systems and methods |
Aug. 25, 2009 |
| 7579675 |
Semiconductor device having surface mountable external contact areas and method for producing the same |
Aug. 25, 2009 |
| 7564124 |
Semiconductor die package including stacked dice and heat sink structures |
Jul. 21, 2009 |
| 7560309 |
Drop-in heat sink and exposed die-back for molded flip die package |
Jul. 14, 2009 |
| 7557432 |
Thermally enhanced power semiconductor package system |
Jul. 7, 2009 |
| 7554179 |
Multi-leadframe semiconductor package and method of manufacture |
Jun. 30, 2009 |
| 7550845 |
Ball grid array package with separated stiffener layer |
Jun. 23, 2009 |
| 7547582 |
Method of fabricating a surface adapting cap with integral adapting material for single and multi chip assemblies |
Jun. 16, 2009 |
| 7521780 |
Integrated circuit package system with heat dissipation enclosure |
Apr. 21, 2009 |
| 7511365 |
Thermal enhanced low profile package structure |
Mar. 31, 2009 |
| 7501702 |
Integrated transistor module and method of fabricating same |
Mar. 10, 2009 |
| 7498673 |
Heatplates for heatsink attachment for semiconductor chips |
Mar. 3, 2009 |
| 7489033 |
Electronic assembly with hot spot cooling |
Feb. 10, 2009 |
| 7468548 |
Thermal enhanced upper and dual heat sink exposed molded leadless package |
Dec. 23, 2008 |
| 7443025 |
Thermally improved placement of power-dissipating components onto a circuit board |
Oct. 28, 2008 |
| 7405107 |
Semiconductor device, method and apparatus for fabricating the same |
Jul. 29, 2008 |
| 7388286 |
Semiconductor package having enhanced heat dissipation and method of fabricating the same |
Jun. 17, 2008 |
| 7382000 |
Semiconductor device |
Jun. 3, 2008 |
| 7382047 |
Heat dissipation device |
Jun. 3, 2008 |
| 7378730 |
Thermal interconnect systems methods of production and uses thereof |
May. 27, 2008 |
| 7365422 |
Package of leadframe with heatsinks |
Apr. 29, 2008 |
| 7352062 |
Integrated circuit package design |
Apr. 1, 2008 |
| 7338840 |
Method of forming a semiconductor die with heat and electrical pipes |
Mar. 4, 2008 |
| 7332806 |
Thin, thermally enhanced molded package with leadframe having protruding region |
Feb. 19, 2008 |
| 7317247 |
Semiconductor package having heat spreader and package stack using the same |
Jan. 8, 2008 |
| 7315077 |
Molded leadless package having a partially exposed lead frame pad |
Jan. 1, 2008 |
| 7307269 |
Phase-change RAM containing AIN thermal dissipation layer and TiN electrode |
Dec. 11, 2007 |
| 7294912 |
Semiconductor device |
Nov. 13, 2007 |
| 7262440 |
Light emitting diode package and fabrication method thereof |
Aug. 28, 2007 |
| 7259451 |
Invertible microfeature device packages |
Aug. 21, 2007 |
| 7256489 |
Semiconductor apparatus |
Aug. 14, 2007 |
| 7256492 |
Heat sink and display panel including heat sink |
Aug. 14, 2007 |
| 7235876 |
Semiconductor device having metallic plate with groove |
Jun. 26, 2007 |
| 7233065 |
Semiconductor device having capacitors for reducing power source noise |
Jun. 19, 2007 |
| 7230320 |
Electronic circuit device with reduced breaking and cracking |
Jun. 12, 2007 |
| 7227257 |
Cooling micro-channels |
Jun. 5, 2007 |
| 7224058 |
Integrated circuit package employing a heat-spreader member |
May. 29, 2007 |
| 7202559 |
Method of assembling a ball grid array package with patterned stiffener layer |
Apr. 10, 2007 |
| 7199465 |
Wire bonding system and method of use |
Apr. 3, 2007 |
| 7193318 |
Multiple power density chip structure |
Mar. 20, 2007 |
|
|
|
