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Class Information
Number: 257/E23.051
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for conducting electric current to or from solid-state body in operation, e.g., leads, terminal arrangements (epo) > Consisting of soldered or bonded constructions (epo) > Lead frames or other flat leads (epo) > Specifically adapted to facilitate heat dissipation (epo)
Description: This subclass is indented under subclass E21.031. This subclass is substantially the same in scope as ECLA classification H01L23/495H.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7443025 |
Thermally improved placement of power-dissipating components onto a circuit board |
Oct. 28, 2008 |
| 7405107 |
Semiconductor device, method and apparatus for fabricating the same |
Jul. 29, 2008 |
| 7388286 |
Semiconductor package having enhanced heat dissipation and method of fabricating the same |
Jun. 17, 2008 |
| 7382000 |
Semiconductor device |
Jun. 3, 2008 |
| 7382047 |
Heat dissipation device |
Jun. 3, 2008 |
| 7378730 |
Thermal interconnect systems methods of production and uses thereof |
May. 27, 2008 |
| 7365422 |
Package of leadframe with heatsinks |
Apr. 29, 2008 |
| 7352062 |
Integrated circuit package design |
Apr. 1, 2008 |
| 7338840 |
Method of forming a semiconductor die with heat and electrical pipes |
Mar. 4, 2008 |
| 7332806 |
Thin, thermally enhanced molded package with leadframe having protruding region |
Feb. 19, 2008 |
| 7317247 |
Semiconductor package having heat spreader and package stack using the same |
Jan. 8, 2008 |
| 7315077 |
Molded leadless package having a partially exposed lead frame pad |
Jan. 1, 2008 |
| 7307269 |
Phase-change RAM containing AIN thermal dissipation layer and TiN electrode |
Dec. 11, 2007 |
| 7294912 |
Semiconductor device |
Nov. 13, 2007 |
| 7262440 |
Light emitting diode package and fabrication method thereof |
Aug. 28, 2007 |
| 7259451 |
Invertible microfeature device packages |
Aug. 21, 2007 |
| 7256492 |
Heat sink and display panel including heat sink |
Aug. 14, 2007 |
| 7256489 |
Semiconductor apparatus |
Aug. 14, 2007 |
| 7235876 |
Semiconductor device having metallic plate with groove |
Jun. 26, 2007 |
| 7233065 |
Semiconductor device having capacitors for reducing power source noise |
Jun. 19, 2007 |
| 7230320 |
Electronic circuit device with reduced breaking and cracking |
Jun. 12, 2007 |
| 7227257 |
Cooling micro-channels |
Jun. 5, 2007 |
| 7224058 |
Integrated circuit package employing a heat-spreader member |
May. 29, 2007 |
| 7202559 |
Method of assembling a ball grid array package with patterned stiffener layer |
Apr. 10, 2007 |
| 7199465 |
Wire bonding system and method of use |
Apr. 3, 2007 |
| 7193318 |
Multiple power density chip structure |
Mar. 20, 2007 |
| 7148562 |
Power semiconductor device and power semiconductor module |
Dec. 12, 2006 |
| 7129571 |
Semiconductor chip package having decoupling capacitor and manufacturing method thereof |
Oct. 31, 2006 |
| 7115988 |
Bypass capacitor embedded flip chip package lid and stiffener |
Oct. 3, 2006 |
| 7112883 |
Semiconductor device with temperature control mechanism |
Sep. 26, 2006 |
| 7098533 |
Printed circuit board with a heat dissipation element and package comprising the printed circuit board |
Aug. 29, 2006 |
| 7075174 |
Semiconductor packaging techniques for use with non-ceramic packages |
Jul. 11, 2006 |
| 7067904 |
Flip-chip type quad flat package and leadframe |
Jun. 27, 2006 |
| 6972216 |
Semiconductor package with enhanced electrical and thermal performance and method for fabricating the same |
Dec. 6, 2005 |
| 6949838 |
Integrated circuit device |
Sep. 27, 2005 |
| 6927094 |
Method for assembling a semiconductor chip utilizing conducting bars rather than bonding wires |
Aug. 9, 2005 |
| 6920688 |
Method for a semiconductor assembly having a semiconductor die with dual heat spreaders |
Jul. 26, 2005 |
| 6919622 |
Semiconductor device |
Jul. 19, 2005 |
| 6891256 |
Thin, thermally enhanced flip chip in a leaded molded package |
May. 10, 2005 |
| 6876087 |
Chip scale package with heat dissipating part |
Apr. 5, 2005 |
| 6841857 |
Electronic component having a semiconductor chip, system carrier, and methods for producing the electronic component and the semiconductor chip |
Jan. 11, 2005 |
| 6809405 |
Semiconductor device and method of manufacturing the same |
Oct. 26, 2004 |
| 6765291 |
IC package with dual heat spreaders |
Jul. 20, 2004 |
| 6735859 |
Method of manufacturing chip scale package |
May. 18, 2004 |
| 6727585 |
Power device with a plastic molded package and direct bonded substrate |
Apr. 27, 2004 |
| 6720208 |
Semiconductor device |
Apr. 13, 2004 |
| 6720662 |
Semiconductor device of chip-on-chip structure with a radiation noise shield |
Apr. 13, 2004 |
| 6706565 |
Methods of forming an integrated circuit device |
Mar. 16, 2004 |
| 6703698 |
Semiconductor package with enhanced electrical and thermal performance and method for fabricating the same |
Mar. 9, 2004 |
| 6576985 |
Semiconductor device packaging assembly |
Jun. 10, 2003 |
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