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Class Information
Number: 257/E23.051
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for conducting electric current to or from solid-state body in operation, e.g., leads, terminal arrangements (epo) > Consisting of soldered or bonded constructions (epo) > Lead frames or other flat leads (epo) > Specifically adapted to facilitate heat dissipation (epo)
Description: This subclass is indented under subclass E21.031. This subclass is substantially the same in scope as ECLA classification H01L23/495H.










Patents under this class:
1 2 3 4 5 6 7

Patent Number Title Of Patent Date Issued
8704346 Semiconductor package and radiation lead frame Apr. 22, 2014
8686545 Semiconductor device and method for manufacturing the same Apr. 1, 2014
8669140 Method of forming stacked die package using redistributed chip packaging Mar. 11, 2014
8653651 Semiconductor apparatus and method for manufacturing the same Feb. 18, 2014
8633060 Semiconductor device production method and semiconductor device Jan. 21, 2014
8633597 Thermal vias in an integrated circuit package with an embedded die Jan. 21, 2014
8623707 Method of fabricating a semiconductor package with integrated substrate thermal slug Jan. 7, 2014
8618653 Integrated circuit package system with wafer scale heat slug Dec. 31, 2013
8597986 System in package and method of fabricating same Dec. 3, 2013
8598701 Semiconductor device Dec. 3, 2013
8586857 Combined diode, lead assembly incorporating an expansion joint Nov. 19, 2013
8587105 Semiconductor device Nov. 19, 2013
8581374 Placing heat sink into packaging by strip formation assembly Nov. 12, 2013
8581375 Leadframe-based mold array package heat spreader and fabrication method therefor Nov. 12, 2013
8536687 Semiconductor device having separated heatsink and chip mounting portion Sep. 17, 2013
8487426 Semiconductor package with embedded die and manufacturing methods thereof Jul. 16, 2013
8482109 Integrated circuit packaging system with dual connection and method of manufacture thereof Jul. 9, 2013
8476756 Semiconductor device and heat sink with 3-dimensional thermal conductivity Jul. 2, 2013
8466548 Semiconductor device including excess solder Jun. 18, 2013
8466561 Semiconductor module with a power semiconductor chip and a passive component and method for producing the same Jun. 18, 2013
8455987 Electrically isolated power semiconductor package with optimized layout Jun. 4, 2013
8441110 Side leaded, bottom exposed pad and bottom exposed lead fusion quad flat semiconductor package May. 14, 2013
8410602 Cooling system for semiconductor devices Apr. 2, 2013
8405194 Semiconductor device including two heat sinks and method of manufacturing the same Mar. 26, 2013
8399301 Mounting structures for integrated circuit modules Mar. 19, 2013
8394675 Manufacturing light emitting diode (LED) packages Mar. 12, 2013
8395255 Semiconductor device having a cooling function component Mar. 12, 2013
8368203 Heat radiation member for a semiconductor package with a power element and a control circuit Feb. 5, 2013
8368205 Metallic thermal joint for high power density chips Feb. 5, 2013
8358017 Semiconductor package featuring flip-chip die sandwiched between metal layers Jan. 22, 2013
8334583 Leadframe strip and mold apparatus for an electronic component and method of encapsulating an electronic component Dec. 18, 2012
8324723 Semiconductor chip assembly with bump/base heat spreader and dual-angle cavity in bump Dec. 4, 2012
8304293 Thermally enhanced semiconductor package Nov. 6, 2012
8304897 Thermal interface material design for enhanced thermal performance and improved package structural integrity Nov. 6, 2012
8278154 Method of fabricating a semiconductor device package including a heat radiation plate Oct. 2, 2012
8269338 Semiconductor device having improved heat dissipation capabilities Sep. 18, 2012
8269323 Integrated circuit package with etched leadframe for package-on-package interconnects Sep. 18, 2012
8247891 Chip package structure including heat dissipation device and an insulation sheet Aug. 21, 2012
8232634 Semiconductor device having a pin mounted heat sink Jul. 31, 2012
8227907 Flexible interconnect pattern on semiconductor package Jul. 24, 2012
8211746 Integrated circuit packaging system with lead frame and method of manufacture thereof Jul. 3, 2012
8211753 Leadframe-based mold array package heat spreader and fabrication method therefor Jul. 3, 2012
8203200 Diode leadframe for solar module assembly Jun. 19, 2012
8188594 Input/output package architectures May. 29, 2012
8183681 Semiconductor device May. 22, 2012
8102047 Load driving device Jan. 24, 2012
8097933 Flexible semiconductor package and method for fabricating the same Jan. 17, 2012
8089085 Heat sink base for LEDS Jan. 3, 2012
8072047 Integrated circuit package system with shield and tie bar Dec. 6, 2011
8062933 Method for fabricating heat dissipating package structure Nov. 22, 2011

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