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Class Information
Number: 257/E23.05
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for conducting electric current to or from solid-state body in operation, e.g., leads, terminal arrangements (epo) > Consisting of soldered or bonded constructions (epo) > Lead frames or other flat leads (epo) > Geometry of lead frame (epo) > Insulating layers on lead frame, e.g., bridging members (epo) > Side rails of lead frame, e.g., with perforations, sprocket holes (epo)
Description: This subclass is indented under subclass E23.043. This subclass is substantially the same in scope as ECLA classification H01L23/495G9.










Patents under this class:
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Patent Number Title Of Patent Date Issued
8587099 Leadframe having selective planishing Nov. 19, 2013
8558358 Lead frame Oct. 15, 2013
8105881 Method of fabricating chip package structure Jan. 31, 2012
8088650 Method of fabricating chip package Jan. 3, 2012
7977773 Leadframe including die paddle apertures for reducing delamination Jul. 12, 2011
7935575 Method of forming a semiconductor package and structure therefor May. 3, 2011
7834431 Leadframe for packaged electronic device with enhanced mold locking capability Nov. 16, 2010
7795712 Lead frame with non-conductive connective bar Sep. 14, 2010
7786554 Stress-free lead frame Aug. 31, 2010
7619307 Leadframe-based semiconductor package having arched bend in a supporting bar and leadframe for the package Nov. 17, 2009
7615859 Thin semiconductor package having stackable lead frame and method of manufacturing the same Nov. 10, 2009
7576418 Lead frame structure and applications thereof Aug. 18, 2009
7566953 Leadframe designs for plastic overmold packages Jul. 28, 2009
7511362 Electronic component and semiconductor device, method of making the same and method of mounting the same, circuit board, and electronic instrument Mar. 31, 2009
7476913 Light emitting device having a mirror portion Jan. 13, 2009
7443013 Flexible substrate for package of die Oct. 28, 2008
7368807 Low cost method to produce high volume lead frames May. 6, 2008
7364784 Thin semiconductor package having stackable lead frame and method of manufacturing the same Apr. 29, 2008
7339261 Semiconductor device Mar. 4, 2008
7288833 Stress-free lead frame Oct. 30, 2007
7288832 Chip-mounted film package Oct. 30, 2007
7196428 Bond pad structure for integrated circuit chip Mar. 27, 2007
7192809 Low cost method to produce high volume lead frames Mar. 20, 2007
7067908 Semiconductor package having improved adhesiveness and ground bonding Jun. 27, 2006
7029256 Leadframe and method for removing cleaning compound flash from mold vents Apr. 18, 2006
6933592 Substrate structure capable of reducing package singular stress Aug. 23, 2005
6919513 Film carrier tape for semiconductor package and manufacturing method thereof Jul. 19, 2005
6867483 Stress-free lead frame Mar. 15, 2005
6744123 Film carrier tape for mounting electronic devices thereon and method of manufacturing the same Jun. 1, 2004
6740966 Semi-conductor apparatus, a method of fabrication of the same, and a reinforcing tape used in fabrication of the same May. 25, 2004
6666997 Method for removing cleaning compound flash from mold vents Dec. 23, 2003
6576491 Methods for producing high reliability lead frame and packaging semiconductor die using such lead frame Jun. 10, 2003
6566740 Lead frame for a semiconductor device and method of manufacturing a semiconductor device May. 20, 2003
6404216 Test contact Jun. 11, 2002
6331728 High reliability lead frame and packaging technology containing the same Dec. 18, 2001
6313526 Semiconductor apparatus, Including thin film belt-like insulating tape Nov. 6, 2001
5793100 Lead frame for semiconductor device Aug. 11, 1998
5223738 Leadframe Jun. 29, 1993
5025114 Multi-layer lead frames for integrated circuit packages Jun. 18, 1991
4951119 Lead frame for semiconductor devices Aug. 21, 1990
4859632 Method for manufacturing the same Aug. 22, 1989
4801561 Method for making a pre-testable semiconductor die package Jan. 31, 1989
4778564 Process for producing an assembly tape for bonding metal fingers to electronic devices Oct. 18, 1988
4736236 Tape bonding material and structure for electronic circuit fabrication Apr. 5, 1988
4733014 Lead frame Mar. 22, 1988
4721992 Hinge tape Jan. 26, 1988
4701781 Pre-testable semiconductor die package Oct. 20, 1987
4663650 Packaged integrated circuit chip May. 5, 1987
4283839 Method of bonding semiconductor devices to carrier tapes Aug. 18, 1981
4234666 Carrier tapes for semiconductor devices Nov. 18, 1980

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