| |
 |
|
Class Information
Number: 257/E23.049
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for conducting electric current to or from solid-state body in operation, e.g., leads, terminal arrangements (epo) > Consisting of soldered or bonded constructions (epo) > Lead frames or other flat leads (epo) > Geometry of lead frame (epo) > Insulating layers on lead frame, e.g., bridging members (epo)
Description: This subclass is indented under subclass E23.043. This subclass is substantially the same in scope as ECLA classification H01L23/495G6.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7575957 |
Leadless semiconductor package and method for manufacturing the same |
Aug. 18, 2009 |
| 7573129 |
Contrast interposer stacking system and method |
Aug. 11, 2009 |
| 7476913 |
Light emitting device having a mirror portion |
Jan. 13, 2009 |
| 7473999 |
Semiconductor chip and process for forming the same |
Jan. 6, 2009 |
| 7345356 |
Optical package with double formed leadframe |
Mar. 18, 2008 |
| 7304371 |
Lead frame having a lead with a non-uniform width |
Dec. 4, 2007 |
| 7298026 |
Large die package and method for the fabrication thereof |
Nov. 20, 2007 |
| 7129568 |
Chip package and electrical connection structure between chip and substrate |
Oct. 31, 2006 |
| 7105916 |
Inlet for an electronic tag |
Sep. 12, 2006 |
| 7069653 |
Method for electrically connecting a semiconductor component to an electrical subassembly |
Jul. 4, 2006 |
| 6956282 |
Stabilizer/spacer for semiconductor device |
Oct. 18, 2005 |
| 6955949 |
System and method for reducing or eliminating semiconductor device wire sweep |
Oct. 18, 2005 |
| 6927480 |
Multi-chip package with electrical interconnection |
Aug. 9, 2005 |
| 6919622 |
Semiconductor device |
Jul. 19, 2005 |
| 6864564 |
Flash-preventing semiconductor package |
Mar. 8, 2005 |
| 6861286 |
Method for making power chip scale package |
Mar. 1, 2005 |
| 6818968 |
Integrated circuit package and process for forming the same |
Nov. 16, 2004 |
| 6809405 |
Semiconductor device and method of manufacturing the same |
Oct. 26, 2004 |
| 6798046 |
Semiconductor package including ring structure connected to leads with vertically downset inner ends |
Sep. 28, 2004 |
| 6762490 |
Semiconductor device and method for producing the same |
Jul. 13, 2004 |
| 6720208 |
Semiconductor device |
Apr. 13, 2004 |
| 6696752 |
Encapsulated semiconductor device with flash-proof structure |
Feb. 24, 2004 |
| 6693304 |
Laminated lead frame, and optical communication module and method of manufacturing the same |
Feb. 17, 2004 |
| 6646329 |
Power chip scale package |
Nov. 11, 2003 |
| 6627977 |
Semiconductor package including isolated ring structure |
Sep. 30, 2003 |
| RE38043 |
Lead frame |
Mar. 25, 2003 |
| 6531760 |
Semiconductor device |
Mar. 11, 2003 |
| 6407411 |
Led lead frame assembly |
Jun. 18, 2002 |
| 6339252 |
Electronic device package and leadframe |
Jan. 15, 2002 |
| RE37323 |
Method for sticking an insulating film to a lead frame |
Aug. 14, 2001 |
| 6258629 |
Electronic device package and leadframe and method for making the package |
Jul. 10, 2001 |
| 6249042 |
Member for lead |
Jun. 19, 2001 |
| 6225146 |
Lead frame, method of manufacturing lead frame, semiconductor device and method of manufacturing semiconductor device |
May. 1, 2001 |
| 6204552 |
Semiconductor device |
Mar. 20, 2001 |
| 6166430 |
Lead frame, method for manufacturing the frame, resin-molded semiconductor device and method for manufacturing the device |
Dec. 26, 2000 |
| 6157074 |
Lead frame adapted for variable sized devices, semiconductor package with such lead frame and method for using same |
Dec. 5, 2000 |
| RE36894 |
Semiconductor package with high density I/O lead connection |
Oct. 3, 2000 |
| 6124642 |
Lead structure for a semiconductor device with an isolating protective layer and method of fabricating the same |
Sep. 26, 2000 |
| 6114749 |
Integrated circuit with lead frame package having internal power and ground busses |
Sep. 5, 2000 |
| 6111308 |
Ground plane for plastic encapsulated integrated circuit die packages |
Aug. 29, 2000 |
| 6081035 |
Microelectronic bond ribbon design |
Jun. 27, 2000 |
| 6081023 |
Semiconductor device |
Jun. 27, 2000 |
| 6072231 |
Semiconductor device |
Jun. 6, 2000 |
| 6069029 |
Semiconductor device chip on lead and lead on chip manufacturing |
May. 30, 2000 |
| 6057177 |
Reinforced leadframe to substrate attachment |
May. 2, 2000 |
| 6043108 |
Lead frame with lead-securing tape bonded to the inner lead sections of plural leads and a method of manufacturing the same |
Mar. 28, 2000 |
| 6037652 |
Lead frame with each lead having a peel generation preventing means and a semiconductor device using same |
Mar. 14, 2000 |
| 6018191 |
Semiconductor device |
Jan. 25, 2000 |
| 6005293 |
Wire-bonded semiconductor device |
Dec. 21, 1999 |
| 5982025 |
Wire fixation structure |
Nov. 9, 1999 |
|
|
|
