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Class Information
Number: 257/E23.049
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for conducting electric current to or from solid-state body in operation, e.g., leads, terminal arrangements (epo) > Consisting of soldered or bonded constructions (epo) > Lead frames or other flat leads (epo) > Geometry of lead frame (epo) > Insulating layers on lead frame, e.g., bridging members (epo)
Description: This subclass is indented under subclass E23.043. This subclass is substantially the same in scope as ECLA classification H01L23/495G6.

Sub-classes under this class:

Class Number Class Name Patents
257/E23.05 Side rails of lead frame, e.g., with perforations, sprocket holes (epo) 52

Patents under this class:
1 2 3 4 5

Patent Number Title Of Patent Date Issued
8703537 System and method to manufacture an implantable electrode Apr. 22, 2014
8658465 System and method to manufacture an implantable electrode Feb. 25, 2014
8648449 Electrical connectivity for circuit applications Feb. 11, 2014
8648458 Leadframe circuit and method therefor Feb. 11, 2014
8258609 Integrated circuit package system with lead support Sep. 4, 2012
8241950 System and method to manufacture an implantable electrode Aug. 14, 2012
8173454 Light emitting diode package and method of manufacturing the same May. 8, 2012
8097933 Flexible semiconductor package and method for fabricating the same Jan. 17, 2012
8017446 Method for manufacturing a rigid power module suited for high-voltage applications Sep. 13, 2011
7871863 Integrated circuit package system with multiple molding Jan. 18, 2011
7816771 Stacked chip package structure with leadframe having inner leads with transfer pad Oct. 19, 2010
7808096 Semiconductor package and production method thereof, and semiconductor device Oct. 5, 2010
7791178 Lead frame unit, semiconductor package having a lead frame unit, stacked semiconductor package having a semiconductor package and methods of manufacturing the same Sep. 7, 2010
7759778 Leaded semiconductor power module with direct bonding and double sided cooling Jul. 20, 2010
7683477 Semiconductor device including semiconductor chips having contact elements Mar. 23, 2010
7671453 Semiconductor device and method for producing the same Mar. 2, 2010
7671382 Semiconductor device with thermoplastic resin to reduce warpage Mar. 2, 2010
7575957 Leadless semiconductor package and method for manufacturing the same Aug. 18, 2009
7573129 Contrast interposer stacking system and method Aug. 11, 2009
7476913 Light emitting device having a mirror portion Jan. 13, 2009
7473999 Semiconductor chip and process for forming the same Jan. 6, 2009
7345356 Optical package with double formed leadframe Mar. 18, 2008
7304371 Lead frame having a lead with a non-uniform width Dec. 4, 2007
7298026 Large die package and method for the fabrication thereof Nov. 20, 2007
7129568 Chip package and electrical connection structure between chip and substrate Oct. 31, 2006
7105916 Inlet for an electronic tag Sep. 12, 2006
7069653 Method for electrically connecting a semiconductor component to an electrical subassembly Jul. 4, 2006
6956282 Stabilizer/spacer for semiconductor device Oct. 18, 2005
6955949 System and method for reducing or eliminating semiconductor device wire sweep Oct. 18, 2005
6927480 Multi-chip package with electrical interconnection Aug. 9, 2005
6919622 Semiconductor device Jul. 19, 2005
6864564 Flash-preventing semiconductor package Mar. 8, 2005
6861286 Method for making power chip scale package Mar. 1, 2005
6818968 Integrated circuit package and process for forming the same Nov. 16, 2004
6809405 Semiconductor device and method of manufacturing the same Oct. 26, 2004
6798046 Semiconductor package including ring structure connected to leads with vertically downset inner ends Sep. 28, 2004
6762490 Semiconductor device and method for producing the same Jul. 13, 2004
6720208 Semiconductor device Apr. 13, 2004
6696752 Encapsulated semiconductor device with flash-proof structure Feb. 24, 2004
6693304 Laminated lead frame, and optical communication module and method of manufacturing the same Feb. 17, 2004
6646329 Power chip scale package Nov. 11, 2003
6627977 Semiconductor package including isolated ring structure Sep. 30, 2003
RE38043 Lead frame Mar. 25, 2003
6531760 Semiconductor device Mar. 11, 2003
6407411 Led lead frame assembly Jun. 18, 2002
6339252 Electronic device package and leadframe Jan. 15, 2002
RE37323 Method for sticking an insulating film to a lead frame Aug. 14, 2001
6258629 Electronic device package and leadframe and method for making the package Jul. 10, 2001
6249042 Member for lead Jun. 19, 2001
6225146 Lead frame, method of manufacturing lead frame, semiconductor device and method of manufacturing semiconductor device May. 1, 2001

1 2 3 4 5

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