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Class Information
Number: 257/E23.048
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for conducting electric current to or from solid-state body in operation, e.g., leads, terminal arrangements (epo) > Consisting of soldered or bonded constructions (epo) > Lead frames or other flat leads (epo) > Geometry of lead frame (epo) > Cross-section geometry (epo) > Characterized by bent parts (epo) > Bent parts being outer leads (epo)
Description: This subclass is indented under subclass E23.047. This subclass is substantially the same in scope as ECLA classification H01L23/495G4B6.










Patents under this class:
1 2 3 4 5

Patent Number Title Of Patent Date Issued
8629540 Apparatus and methods for packaging integrated circuit chips with antennas formed from package lead wires Jan. 14, 2014
8610254 Apparatus for integrated circuit packaging Dec. 17, 2013
8508036 Ultra-thin near-hermetic package based on rainier Aug. 13, 2013
8502371 Integrated circuit package system with extended corner leads Aug. 6, 2013
8455988 Integrated circuit package system with bumped lead and nonbumped lead Jun. 4, 2013
8431438 Forming in-situ micro-feature structures with coreless packages Apr. 30, 2013
8395251 Integrated circuit package to package stacking system Mar. 12, 2013
8390103 Apparatus for integrated circuit packaging Mar. 5, 2013
8384206 Semiconductor package Feb. 26, 2013
8344499 Chip-exposed semiconductor device Jan. 1, 2013
8310041 Stacked semiconductor package and stacking method thereof Nov. 13, 2012
8269343 Semiconductor device including a pressure-contact section Sep. 18, 2012
8236613 Wafer level chip scale package method using clip array Aug. 7, 2012
8235551 LED module and packaging method thereof Aug. 7, 2012
8232658 Stackable integrated circuit package system with multiple interconnect interface Jul. 31, 2012
8212341 Apparatus and methods for packaging integrated circuit chips with antennas formed from package lead wires Jul. 3, 2012
8212366 Semiconductor device Jul. 3, 2012
8106418 Light emitting device Jan. 31, 2012
8097933 Flexible semiconductor package and method for fabricating the same Jan. 17, 2012
8097934 Delamination resistant device package having low moisture sensitivity Jan. 17, 2012
7989932 Semiconductor device Aug. 2, 2011
7982235 Light emitting device, package and lead frame Jul. 19, 2011
7888185 Semiconductor device assemblies and systems including at least one conductive pathway extending around a side of at least one semiconductor device Feb. 15, 2011
7880313 Semiconductor flip chip package having substantially non-collapsible spacer Feb. 1, 2011
7868434 Integrated circuit package-on-package stacking system Jan. 11, 2011
7868447 Solid-state image sensing apparatus and package of same Jan. 11, 2011
7863737 Integrated circuit package system with wire bond pattern Jan. 4, 2011
7859090 Die attach method and leadframe structure Dec. 28, 2010
7847418 Semiconductor device Dec. 7, 2010
7737546 Surface mountable semiconductor package with solder bonding features Jun. 15, 2010
7723828 Semiconductor package with leads on a chip having multi-row of bonding pads May. 25, 2010
7709935 Reversible leadless package and methods of making and using same May. 4, 2010
7692208 Semiconductor optical device Apr. 6, 2010
7663223 Coupling substrate for semiconductor components and method for producing the same Feb. 16, 2010
7619307 Leadframe-based semiconductor package having arched bend in a supporting bar and leadframe for the package Nov. 17, 2009
7615851 Integrated circuit package system Nov. 10, 2009
7598600 Stackable power semiconductor package system Oct. 6, 2009
7541665 Lead frame for a magnetic sensor Jun. 2, 2009
7541672 Semiconductor device Jun. 2, 2009
7531895 Integrated circuit package and method of manufacture thereof May. 12, 2009
7528476 Semiconductor device, method for manufacturing semiconductor device, circuit board, and electronic instrument May. 5, 2009
7524699 Electronic component and a panel Apr. 28, 2009
7495326 Stacked electronic structures including offset substrates Feb. 24, 2009
7476913 Light emitting device having a mirror portion Jan. 13, 2009
7476962 Stack semiconductor package formed by multiple molding and method of manufacturing the same Jan. 13, 2009
7466015 Supporting frame for surface-mount diode package Dec. 16, 2008
7425755 Semiconductor package, method for manufacturing the same and lead frame for use in the same Sep. 16, 2008
7285850 Support elements for semiconductor devices with peripherally located bond pads Oct. 23, 2007
7279784 Semiconductor package Oct. 9, 2007
7271036 Leadframe alteration to direct compound flow into package Sep. 18, 2007

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