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Class Information
Number: 257/E23.048
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for conducting electric current to or from solid-state body in operation, e.g., leads, terminal arrangements (epo) > Consisting of soldered or bonded constructions (epo) > Lead frames or other flat leads (epo) > Geometry of lead frame (epo) > Cross-section geometry (epo) > Characterized by bent parts (epo) > Bent parts being outer leads (epo)
Description: This subclass is indented under subclass E23.047. This subclass is substantially the same in scope as ECLA classification H01L23/495G4B6.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7619307 |
Leadframe-based semiconductor package having arched bend in a supporting bar and leadframe for the package |
Nov. 17, 2009 |
| 7615851 |
Integrated circuit package system |
Nov. 10, 2009 |
| 7598600 |
Stackable power semiconductor package system |
Oct. 6, 2009 |
| 7541665 |
Lead frame for a magnetic sensor |
Jun. 2, 2009 |
| 7541672 |
Semiconductor device |
Jun. 2, 2009 |
| 7531895 |
Integrated circuit package and method of manufacture thereof |
May. 12, 2009 |
| 7528476 |
Semiconductor device, method for manufacturing semiconductor device, circuit board, and electronic instrument |
May. 5, 2009 |
| 7524699 |
Electronic component and a panel |
Apr. 28, 2009 |
| 7495326 |
Stacked electronic structures including offset substrates |
Feb. 24, 2009 |
| 7476962 |
Stack semiconductor package formed by multiple molding and method of manufacturing the same |
Jan. 13, 2009 |
| 7476913 |
Light emitting device having a mirror portion |
Jan. 13, 2009 |
| 7466015 |
Supporting frame for surface-mount diode package |
Dec. 16, 2008 |
| 7425755 |
Semiconductor package, method for manufacturing the same and lead frame for use in the same |
Sep. 16, 2008 |
| 7285850 |
Support elements for semiconductor devices with peripherally located bond pads |
Oct. 23, 2007 |
| 7279784 |
Semiconductor package |
Oct. 9, 2007 |
| 7271036 |
Leadframe alteration to direct compound flow into package |
Sep. 18, 2007 |
| 7256489 |
Semiconductor apparatus |
Aug. 14, 2007 |
| 7247927 |
Leadframe alteration to direct compound flow into package |
Jul. 24, 2007 |
| 7239008 |
Semiconductor apparatus and method for fabricating the same |
Jul. 3, 2007 |
| 7232699 |
Method of making a high precision microelectromechanical capacitor with programmable voltage source |
Jun. 19, 2007 |
| 7211886 |
Three-dimensional multichip stack electronic package structure |
May. 1, 2007 |
| 7193303 |
Supporting frame for surface-mount diode package |
Mar. 20, 2007 |
| 7187065 |
Semiconductor device and semiconductor device unit |
Mar. 6, 2007 |
| 7061091 |
Surface mount package with integral electro-static charge dissipating ring using lead frame as ESD device |
Jun. 13, 2006 |
| 7057273 |
Surface mount package |
Jun. 6, 2006 |
| 7009301 |
Semiconductor package with a heat spreader |
Mar. 7, 2006 |
| 7002240 |
Semiconductor leadframe for staggered board attach |
Feb. 21, 2006 |
| 6998703 |
Thin package for stacking integrated circuits |
Feb. 14, 2006 |
| 6939740 |
Method of fabricating an encapsulated semiconductor device with partly exposed leads |
Sep. 6, 2005 |
| 6919622 |
Semiconductor device |
Jul. 19, 2005 |
| 6899534 |
Mold assembly for a package stack via bottom-leaded plastic (blp) packaging |
May. 31, 2005 |
| 6884707 |
Interconnections |
Apr. 26, 2005 |
| 6797541 |
Leadless semiconductor product packaging apparatus having a window lid and method for packaging |
Sep. 28, 2004 |
| 6787388 |
Surface mount package with integral electro-static charge dissipating ring using lead frame as ESD device |
Sep. 7, 2004 |
| 6730544 |
Stackable semiconductor package and method for manufacturing same |
May. 4, 2004 |
| 6720208 |
Semiconductor device |
Apr. 13, 2004 |
| 6713311 |
Method for screening semiconductor devices for contact coplanarity |
Mar. 30, 2004 |
| 6707135 |
Semiconductor leadframe for staggered board attach |
Mar. 16, 2004 |
| 6664614 |
Lead frame and bottom lead semiconductor package using the lead frame |
Dec. 16, 2003 |
| 6583401 |
Optoelectronic component with a conductor strip element |
Jun. 24, 2003 |
| 6537051 |
Encapsulation mold with a castellated inner surface |
Mar. 25, 2003 |
| 6531760 |
Semiconductor device |
Mar. 11, 2003 |
| 6531769 |
SEMICONDUCTOR INTEGRATED CIRCUIT PACKAGE, SEMICONDUCTOR APPARATUS PROVIDED WITH A PLURALITY OF SEMICONDUCTOR INTEGRATED CIRCUIT PACKAGES, METHOD OF INSPECTING SEMICONDUCTOR INTEGRATED CIRCUIT |
Mar. 11, 2003 |
| 6525405 |
Leadless semiconductor product packaging apparatus having a window lid and method for packaging |
Feb. 25, 2003 |
| 6521987 |
Plastic integrated circuit device package and method for making the package |
Feb. 18, 2003 |
| 6516516 |
Semiconductor chip package having clip-type outlead and fabrication method of same |
Feb. 11, 2003 |
| 6501160 |
Semiconductor device and a method of manufacturing the same and a mount structure |
Dec. 31, 2002 |
| 6489173 |
Method for determining lead span and planarity of semiconductor devices |
Dec. 3, 2002 |
| 6462424 |
Semiconductor device, method of producing semiconductor device and semiconductor device mounting structure |
Oct. 8, 2002 |
| 6455356 |
Methods for moding a leadframe in plastic integrated circuit devices |
Sep. 24, 2002 |
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