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Class Information
Number: 257/E23.047
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for conducting electric current to or from solid-state body in operation, e.g., leads, terminal arrangements (epo) > Consisting of soldered or bonded constructions (epo) > Lead frames or other flat leads (epo) > Geometry of lead frame (epo) > Cross-section geometry (epo) > Characterized by bent parts (epo)
Description: This subclass is indented under subclass E23.046. This subclass is substantially the same in scope as ECLA classification H01L23/495G4B.










Sub-classes under this class:

Class Number Class Name Patents
257/E23.048 Bent parts being outer leads (epo) 236


Patents under this class:
1 2 3 4 5 6

Patent Number Title Of Patent Date Issued
8680658 Conductive clip for semiconductor device package Mar. 25, 2014
8586857 Combined diode, lead assembly incorporating an expansion joint Nov. 19, 2013
8525208 Light emitting device Sep. 3, 2013
8399999 Electronic component, semiconductor device, methods of manufacturing the same, circuit board, and electronic instrument Mar. 19, 2013
8344499 Chip-exposed semiconductor device Jan. 1, 2013
8299602 Semiconductor device including leadframe with increased I/O Oct. 30, 2012
8235551 LED module and packaging method thereof Aug. 7, 2012
8203200 Diode leadframe for solar module assembly Jun. 19, 2012
8193041 Semiconductor device and manufacturing method of the same Jun. 5, 2012
8129227 Semiconductor device having grooved leads to confine solder wicking Mar. 6, 2012
8106418 Light emitting device Jan. 31, 2012
8097934 Delamination resistant device package having low moisture sensitivity Jan. 17, 2012
8089166 Integrated circuit package with top pad Jan. 3, 2012
8076183 Method of attaching an interconnection plate to a semiconductor die within a leadframe package Dec. 13, 2011
8072051 Folded lands and vias for multichip semiconductor packages Dec. 6, 2011
8008758 Semiconductor device with increased I/O leadframe Aug. 30, 2011
7960815 Leadframe design for QFN package with top terminal leads Jun. 14, 2011
7902657 Self locking and aligning clip structure for semiconductor die package Mar. 8, 2011
7867827 Physical quantity sensor, lead frame, and manufacturing method therefor Jan. 11, 2011
7859121 Wiring board and method of manufacturing the same, and electronic component device using the wiring board and method of manufacturing the same Dec. 28, 2010
7859090 Die attach method and leadframe structure Dec. 28, 2010
7855391 Lead frame and light emitting device package using the same Dec. 21, 2010
7847392 Semiconductor device including leadframe with increased I/O Dec. 7, 2010
7834432 Chip package having asymmetric molding Nov. 16, 2010
7821124 Thin, thermally enhanced flip chip in a leaded molded package Oct. 26, 2010
7808088 Semiconductor device with improved high current performance Oct. 5, 2010
7777310 Integrated circuit package system with integral inner lead and paddle Aug. 17, 2010
7755205 Electronic component, semiconductor device, methods of manufacturing the same, circuit board, and electronic instrument Jul. 13, 2010
7719027 Intergrated circuit utilizing down bond to define the function of the die and the implementing method thereof May. 18, 2010
7719094 Semiconductor package and manufacturing method thereof May. 18, 2010
7675148 Power module having stacked flip-chip and method of fabricating the power module Mar. 9, 2010
7652365 Microelectronic component assemblies and microelectronic component lead frame structures Jan. 26, 2010
7635613 Semiconductor device having firmly secured heat spreader Dec. 22, 2009
7619307 Leadframe-based semiconductor package having arched bend in a supporting bar and leadframe for the package Nov. 17, 2009
7615853 Chip-stacked package structure having leadframe with multi-piece bus bar Nov. 10, 2009
7598600 Stackable power semiconductor package system Oct. 6, 2009
7595549 Surface mount semiconductor device Sep. 29, 2009
7589400 Inverter and vehicle drive unit using the same Sep. 15, 2009
7569920 Electronic component having at least one vertical semiconductor power transistor Aug. 4, 2009
7557454 Assemblies with bond pads of two or more semiconductor devices electrically connected to the same surface of a plurality of leads Jul. 7, 2009
7541665 Lead frame for a magnetic sensor Jun. 2, 2009
7535084 Multi-chip package with a single die pad May. 19, 2009
7535087 Semiconductor device with lead frames May. 19, 2009
7525183 Surface mount multichip devices Apr. 28, 2009
7508054 Semiconductor device and a method of manufacturing the same Mar. 24, 2009
7504714 Chip package with asymmetric molding Mar. 17, 2009
7485973 Electronic component, semiconductor device, methods of manufacturing the same, circuit board, and electronic instrument Feb. 3, 2009
7476913 Light emitting device having a mirror portion Jan. 13, 2009
7462932 Manufacture of mountable capped chips Dec. 9, 2008
7425755 Semiconductor package, method for manufacturing the same and lead frame for use in the same Sep. 16, 2008

1 2 3 4 5 6










 
 
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