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Class Information
Number: 257/E23.047
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for conducting electric current to or from solid-state body in operation, e.g., leads, terminal arrangements (epo) > Consisting of soldered or bonded constructions (epo) > Lead frames or other flat leads (epo) > Geometry of lead frame (epo) > Cross-section geometry (epo) > Characterized by bent parts (epo)
Description: This subclass is indented under subclass E23.046. This subclass is substantially the same in scope as ECLA classification H01L23/495G4B.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7619307 |
Leadframe-based semiconductor package having arched bend in a supporting bar and leadframe for the package |
Nov. 17, 2009 |
| 7615853 |
Chip-stacked package structure having leadframe with multi-piece bus bar |
Nov. 10, 2009 |
| 7598600 |
Stackable power semiconductor package system |
Oct. 6, 2009 |
| 7595549 |
Surface mount semiconductor device |
Sep. 29, 2009 |
| 7589400 |
Inverter and vehicle drive unit using the same |
Sep. 15, 2009 |
| 7569920 |
Electronic component having at least one vertical semiconductor power transistor |
Aug. 4, 2009 |
| 7557454 |
Assemblies with bond pads of two or more semiconductor devices electrically connected to the same surface of a plurality of leads |
Jul. 7, 2009 |
| 7541665 |
Lead frame for a magnetic sensor |
Jun. 2, 2009 |
| 7535084 |
Multi-chip package with a single die pad |
May. 19, 2009 |
| 7535087 |
Semiconductor device with lead frames |
May. 19, 2009 |
| 7525183 |
Surface mount multichip devices |
Apr. 28, 2009 |
| 7508054 |
Semiconductor device and a method of manufacturing the same |
Mar. 24, 2009 |
| 7504714 |
Chip package with asymmetric molding |
Mar. 17, 2009 |
| 7485973 |
Electronic component, semiconductor device, methods of manufacturing the same, circuit board, and electronic instrument |
Feb. 3, 2009 |
| 7476913 |
Light emitting device having a mirror portion |
Jan. 13, 2009 |
| 7462932 |
Manufacture of mountable capped chips |
Dec. 9, 2008 |
| 7425755 |
Semiconductor package, method for manufacturing the same and lead frame for use in the same |
Sep. 16, 2008 |
| 7361531 |
Methods and apparatus for Flip-Chip-On-Lead semiconductor package |
Apr. 22, 2008 |
| 7345356 |
Optical package with double formed leadframe |
Mar. 18, 2008 |
| 7332806 |
Thin, thermally enhanced molded package with leadframe having protruding region |
Feb. 19, 2008 |
| 7307351 |
Electronic component, semiconductor device, methods of manufacturing the same, circuit board, and electronic instrument |
Dec. 11, 2007 |
| 7298025 |
Microelectronic component assemblies and microelectronic component lead frame structures |
Nov. 20, 2007 |
| 7279784 |
Semiconductor package |
Oct. 9, 2007 |
| 7256482 |
Integrated circuit chip packaging assembly |
Aug. 14, 2007 |
| 7242077 |
Leadframe with die pad |
Jul. 10, 2007 |
| 7239008 |
Semiconductor apparatus and method for fabricating the same |
Jul. 3, 2007 |
| 7235881 |
Electronic component, semiconductor device, methods of manufacturing the same, circuit board, and electronic instrument |
Jun. 26, 2007 |
| 7138707 |
Semiconductor package including leads and conductive posts for providing increased functionality |
Nov. 21, 2006 |
| 7057280 |
Leadframe having lead locks to secure leads to encapsulant |
Jun. 6, 2006 |
| 7053467 |
Leadframe alteration to direct compound flow into package |
May. 30, 2006 |
| 7053474 |
Semiconductor component having at least two chips which are integrated in a housing and with which contact is made by a common contact chip |
May. 30, 2006 |
| 7045396 |
Stackable semiconductor package and method for manufacturing same |
May. 16, 2006 |
| 7045882 |
Semiconductor package including flip chip |
May. 16, 2006 |
| 7012324 |
Lead frame with flag support structure |
Mar. 14, 2006 |
| 7009304 |
Resin-sealed semiconductor device |
Mar. 7, 2006 |
| 7005325 |
Semiconductor package with passive device integration |
Feb. 28, 2006 |
| 6989585 |
Surface-mounting semiconductor device and method of making the same |
Jan. 24, 2006 |
| 6967128 |
Semiconductor device and method of manufacturing the same |
Nov. 22, 2005 |
| 6949814 |
Mounting material, semiconductor device and method of manufacturing semiconductor device |
Sep. 27, 2005 |
| 6936915 |
Lead frame having chip mounting part and leads of different thicknesses |
Aug. 30, 2005 |
| 6924175 |
Clip-type lead frame for source mounted die |
Aug. 2, 2005 |
| 6924548 |
Semiconductor device and its manufacturing method with leads that have an inverted trapezoid-like section |
Aug. 2, 2005 |
| 6924549 |
Semiconductor device and a method of manufacturing the same |
Aug. 2, 2005 |
| 6917098 |
Three-level leadframe for no-lead packages |
Jul. 12, 2005 |
| 6911718 |
Double downset double dambar suspended leadframe |
Jun. 28, 2005 |
| 6909170 |
Semiconductor assembly with package using cup-shaped lead-frame |
Jun. 21, 2005 |
| 6897567 |
Method of making wireless semiconductor device, and leadframe used therefor |
May. 24, 2005 |
| 6893898 |
Semiconductor device and a method of manufacturing the same |
May. 17, 2005 |
| 6879028 |
Multi-die semiconductor package |
Apr. 12, 2005 |
| 6864423 |
Bump chip lead frame and package |
Mar. 8, 2005 |
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