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Class Information
Number: 257/E23.046
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for conducting electric current to or from solid-state body in operation, e.g., leads, terminal arrangements (epo) > Consisting of soldered or bonded constructions (epo) > Lead frames or other flat leads (epo) > Geometry of lead frame (epo) > Cross-section geometry (epo)
Description: This subclass is indented under subclass E23.043. This subclass is substantially the same in scope as ECLA classification H01L23/495G4.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7619307 |
Leadframe-based semiconductor package having arched bend in a supporting bar and leadframe for the package |
Nov. 17, 2009 |
| 7598606 |
Integrated circuit package system with die and package combination |
Oct. 6, 2009 |
| 7579676 |
Leadless leadframe implemented in a leadframe-based BGA package |
Aug. 25, 2009 |
| 7576418 |
Lead frame structure and applications thereof |
Aug. 18, 2009 |
| 7560804 |
Integrated circuit package and method of making the same |
Jul. 14, 2009 |
| 7554179 |
Multi-leadframe semiconductor package and method of manufacture |
Jun. 30, 2009 |
| 7535085 |
Semiconductor package having improved adhesiveness and ground bonding |
May. 19, 2009 |
| 7535084 |
Multi-chip package with a single die pad |
May. 19, 2009 |
| 7525179 |
Lead frame structure with aperture or groove for flip chip in a leaded molded package |
Apr. 28, 2009 |
| 7476913 |
Light emitting device having a mirror portion |
Jan. 13, 2009 |
| 7459770 |
Lead frame structure having blocking surfaces and semiconductor package integrated with the lead frame structure |
Dec. 2, 2008 |
| 7449770 |
Substrate with slot |
Nov. 11, 2008 |
| 7372133 |
Microelectronic package having a stiffening element and method of making same |
May. 13, 2008 |
| 7368810 |
Invertible microfeature device packages |
May. 6, 2008 |
| 7348664 |
Semiconductor apparatus having a cooling apparatus that compressively engages a semiconductor device |
Mar. 25, 2008 |
| 7338841 |
Leadframe with encapsulant guide and method for the fabrication thereof |
Mar. 4, 2008 |
| 7339261 |
Semiconductor device |
Mar. 4, 2008 |
| 7332803 |
Circuit device |
Feb. 19, 2008 |
| 7332806 |
Thin, thermally enhanced molded package with leadframe having protruding region |
Feb. 19, 2008 |
| 7304385 |
Semiconductor chip capable of implementing wire bonding over active circuits |
Dec. 4, 2007 |
| 7259451 |
Invertible microfeature device packages |
Aug. 21, 2007 |
| 7239008 |
Semiconductor apparatus and method for fabricating the same |
Jul. 3, 2007 |
| 7202113 |
Wafer level bumpless method of making a flip chip mounted semiconductor device package |
Apr. 10, 2007 |
| 7138707 |
Semiconductor package including leads and conductive posts for providing increased functionality |
Nov. 21, 2006 |
| 7102216 |
Semiconductor package and leadframe with horizontal leads spaced in the vertical direction and method of making |
Sep. 5, 2006 |
| 7075816 |
Quad flat no-lead (QFN) grid array package, method of making and memory module and computer system including same |
Jul. 11, 2006 |
| 7074647 |
Semiconductor component comprising leadframe, semiconductor chip and integrated passive component in vertical relationship to each other |
Jul. 11, 2006 |
| 7067357 |
Semiconductor package and method of fabricating same |
Jun. 27, 2006 |
| 7064011 |
Semiconductor device fabricating apparatus and semiconductor device fabricating method |
Jun. 20, 2006 |
| 7057281 |
Microelectronic component assemblies employing lead frames having reduced-thickness inner lengths |
Jun. 6, 2006 |
| 7057280 |
Leadframe having lead locks to secure leads to encapsulant |
Jun. 6, 2006 |
| 7053469 |
Leadless semiconductor package and manufacturing method thereof |
May. 30, 2006 |
| 7049684 |
Lead frame and method of producing the same, and resin-encapsulated semiconductor device and method of producing the same |
May. 23, 2006 |
| 7050303 |
Semiconductor module with vertically mounted semiconductor chip packages |
May. 23, 2006 |
| 7045906 |
Resin-encapsulated package, lead member for the same and method of fabricating the lead member |
May. 16, 2006 |
| 7042068 |
Leadframe and semiconductor package made using the leadframe |
May. 9, 2006 |
| 7042071 |
Leadframe, plastic-encapsulated semiconductor device, and method for fabricating the same |
May. 9, 2006 |
| 7033866 |
Method for making dual gauge leadframe |
Apr. 25, 2006 |
| 7030471 |
Semiconductor package containing an integrated-circuit chip supported by electrical connection leads |
Apr. 18, 2006 |
| 7031170 |
Electronic device having a plastic housing and components of a height-structured metallic leadframe and methods for the production of the electronic device |
Apr. 18, 2006 |
| 7023074 |
Enhanced solder joint strength and ease of inspection of leadless leadframe package (LLP) |
Apr. 4, 2006 |
| 7019388 |
Semiconductor device |
Mar. 28, 2006 |
| 7012325 |
Ultra-thin semiconductor package device and method for manufacturing the same |
Mar. 14, 2006 |
| 7008826 |
Lead-frame-based semiconductor package and fabrication method thereof |
Mar. 7, 2006 |
| 7005325 |
Semiconductor package with passive device integration |
Feb. 28, 2006 |
| 7001798 |
Method of manufacturing semiconductor device |
Feb. 21, 2006 |
| 6992385 |
Semiconductor device, a method of manufacturing the same and an electronic device |
Jan. 31, 2006 |
| 6989585 |
Surface-mounting semiconductor device and method of making the same |
Jan. 24, 2006 |
| 6984877 |
Bumped chip carrier package using lead frame and method for manufacturing the same |
Jan. 10, 2006 |
| 6984880 |
Leadframe, resin-molded semiconductor device including the leadframe, method of making the leadframe and method for manufacturing the device |
Jan. 10, 2006 |
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