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Class Information
Number: 257/E23.046
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for conducting electric current to or from solid-state body in operation, e.g., leads, terminal arrangements (epo) > Consisting of soldered or bonded constructions (epo) > Lead frames or other flat leads (epo) > Geometry of lead frame (epo) > Cross-section geometry (epo)
Description: This subclass is indented under subclass E23.043. This subclass is substantially the same in scope as ECLA classification H01L23/495G4.










Sub-classes under this class:

Class Number Class Name Patents
257/E23.047 Characterized by bent parts (epo) 256


Patents under this class:
1 2 3 4 5 6 7 8 9

Patent Number Title Of Patent Date Issued
8703535 Integrated circuit packaging system with warpage preventing mechanism and method of manufacture thereof Apr. 22, 2014
8674487 Semiconductor packages with lead extensions and related methods Mar. 18, 2014
8643158 Semiconductor package and lead frame therefor Feb. 4, 2014
8637966 Semiconductor device Jan. 28, 2014
8637965 Semiconductor device and a method of manufacturing the same and a mounting structure of a semiconductor device Jan. 28, 2014
8637976 Semiconductor device with lead terminals having portions thereof extending obliquely Jan. 28, 2014
8629549 Carrier body for a semiconductor component, semiconductor component and method for producing a carrier body Jan. 14, 2014
8629537 Padless die support integrated circuit package system Jan. 14, 2014
8618558 Light emitting device package and light emitting apparatus Dec. 31, 2013
8592967 Semiconductor apparatus and power supply circuit Nov. 26, 2013
8587099 Leadframe having selective planishing Nov. 19, 2013
8519525 Semiconductor encapsulation and method thereof Aug. 27, 2013
8502359 Semiconductor device Aug. 6, 2013
8502357 Integrated circuit packaging system with shaped lead and method of manufacture thereof Aug. 6, 2013
8476746 Package structure enhancing molding compound bondability Jul. 2, 2013
8471381 Complete power management system implemented in a single surface mount package Jun. 25, 2013
8421209 Semiconductor device with lead terminals having portions thereof extending obliquely Apr. 16, 2013
8405230 Semiconductor flip chip package having substantially non-collapsible spacer and method of manufacture thereof Mar. 26, 2013
8330258 System and method for improving solder joint reliability in an integrated circuit package Dec. 11, 2012
8212343 Semiconductor chip package Jul. 3, 2012
8203220 Integrated circuit package system with multiple device units and method for manufacturing thereof Jun. 19, 2012
8106490 Semiconductor chip package Jan. 31, 2012
8102040 Integrated circuit package system with die and package combination Jan. 24, 2012
8089166 Integrated circuit package with top pad Jan. 3, 2012
8080883 Wiring placement method of wirings having different length and semiconductor integrated circuit device Dec. 20, 2011
8067271 Integrated circuit package system with encapsulation lock Nov. 29, 2011
8067821 Flat semiconductor package with half package molding Nov. 29, 2011
8026591 Semiconductor device with lead terminals having portions thereof extending obliquely Sep. 27, 2011
8022514 Integrated circuit package system with leadfinger support Sep. 20, 2011
8018041 Integrated circuit package system with offset stacked die Sep. 13, 2011
7993979 Leadless package system having external contacts Aug. 9, 2011
7972906 Semiconductor die package including exposed connections Jul. 5, 2011
7968996 Integrated circuit package system with supported stacked die Jun. 28, 2011
7947534 Integrated circuit packaging system including a non-leaded package May. 24, 2011
7944031 Leadframe-based chip scale semiconductor packages May. 17, 2011
7928540 Integrated circuit package system Apr. 19, 2011
7893523 Microarray package with plated contact pedestals Feb. 22, 2011
7880313 Semiconductor flip chip package having substantially non-collapsible spacer Feb. 1, 2011
7875965 Semiconductor chip package Jan. 25, 2011
7834436 Semiconductor chip package Nov. 16, 2010
7829982 Lead frame, sensor including lead frame and method of forming sensor including lead frame Nov. 9, 2010
7825505 Semiconductor package and method therefor Nov. 2, 2010
7821124 Thin, thermally enhanced flip chip in a leaded molded package Oct. 26, 2010
7816186 Method for making QFN package with power and ground rings Oct. 19, 2010
7804159 Semiconductor device and a method of manufacturing the same and a mounting structure of a semiconductor device Sep. 28, 2010
7777310 Integrated circuit package system with integral inner lead and paddle Aug. 17, 2010
7759806 Integrated circuit package system with multiple device units Jul. 20, 2010
7705444 Semiconductor device with lead frame having lead terminals with wide portions of trapezoidal cross section Apr. 27, 2010
7701043 Lead frame Apr. 20, 2010
7696082 Semiconductor device manufacturing method, semiconductor device, and wiring board Apr. 13, 2010

1 2 3 4 5 6 7 8 9










 
 
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