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Class Information
Number: 257/E23.045
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for conducting electric current to or from solid-state body in operation, e.g., leads, terminal arrangements (epo) > Consisting of soldered or bonded constructions (epo) > Lead frames or other flat leads (epo) > Geometry of lead frame (epo) > Deformation absorbing parts in lead frame plane, e.g., meanderline shape (epo)
Description: This subclass is indented under subclass E23.043. This subclass is substantially the same in scope as ECLA classification H01L23/495G2.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7619303 |
Integrated circuit package |
Nov. 17, 2009 |
| 7619307 |
Leadframe-based semiconductor package having arched bend in a supporting bar and leadframe for the package |
Nov. 17, 2009 |
| 7598602 |
Controlling warping in integrated circuit devices |
Oct. 6, 2009 |
| 7556987 |
Method of fabricating an integrated circuit with etched ring and die paddle |
Jul. 7, 2009 |
| 7541665 |
Lead frame for a magnetic sensor |
Jun. 2, 2009 |
| 7485973 |
Electronic component, semiconductor device, methods of manufacturing the same, circuit board, and electronic instrument |
Feb. 3, 2009 |
| 7476913 |
Light emitting device having a mirror portion |
Jan. 13, 2009 |
| 7408246 |
Controlling warping in integrated circuit devices |
Aug. 5, 2008 |
| 7307351 |
Electronic component, semiconductor device, methods of manufacturing the same, circuit board, and electronic instrument |
Dec. 11, 2007 |
| 7239008 |
Semiconductor apparatus and method for fabricating the same |
Jul. 3, 2007 |
| 7235881 |
Electronic component, semiconductor device, methods of manufacturing the same, circuit board, and electronic instrument |
Jun. 26, 2007 |
| 7193299 |
Conductor frame and housing for a radiation-emitting component, radiation-emitting component and display and/or illumination system using radiation-emitting components |
Mar. 20, 2007 |
| 7157312 |
Surface mount package and method for forming multi-chip microsensor device |
Jan. 2, 2007 |
| 6996897 |
Method of making a mount for electronic devices |
Feb. 14, 2006 |
| 6979596 |
Method of fabricating a tape having apertures under a lead frame for conventional IC packages |
Dec. 27, 2005 |
| 6921966 |
Tape under frame for lead frame IC package assembly |
Jul. 26, 2005 |
| 6894372 |
Tape under frame for lead frame IC package assembly |
May. 17, 2005 |
| 6894370 |
Lead frame and semiconductor device having the same as well as method of resin-molding the same |
May. 17, 2005 |
| 6882048 |
Lead frame and semiconductor package having a groove formed in the respective terminals for limiting a plating area |
Apr. 19, 2005 |
| 6828659 |
Semiconductor device having a die pad supported by a die pad supporter |
Dec. 7, 2004 |
| 6633077 |
Semiconductor device and method for manufacturing the same |
Oct. 14, 2003 |
| 6555899 |
Semiconductor package leadframe assembly and method of manufacture |
Apr. 29, 2003 |
| 6518650 |
Tape under frame for lead frame IC package assembly |
Feb. 11, 2003 |
| 6455922 |
Deformation-absorbing leadframe for semiconductor devices |
Sep. 24, 2002 |
| 6455348 |
Lead frame, resin-molded semiconductor device, and method for manufacturing the same |
Sep. 24, 2002 |
| 6306684 |
Stress reducing lead-frame for plastic encapsulation |
Oct. 23, 2001 |
| 6303984 |
Lead frame including angle iron tie bar |
Oct. 16, 2001 |
| 6215177 |
Tape under frame for conventional-type IC package assembly |
Apr. 10, 2001 |
| 6169322 |
Die attach pad adapted to reduce delamination stress and method of using same |
Jan. 2, 2001 |
| 6111307 |
Method of making lead frame including angle iron tie bar |
Aug. 29, 2000 |
| 6091133 |
Assembly of a semiconductor device and paddleless lead frame having tape extending between the lead fingers |
Jul. 18, 2000 |
| 6081029 |
Resin encapsulated semiconductor device having a reduced thickness and improved reliability |
Jun. 27, 2000 |
| 6072230 |
Exposed leadframe for semiconductor packages and bend forming method of fabrication |
Jun. 6, 2000 |
| 6008528 |
Semiconductor lead frame with channel beam tie bar |
Dec. 28, 1999 |
| 5889318 |
Lead frame including angle iron tie bar and method of making the same |
Mar. 30, 1999 |
| 5637915 |
Semiconductor device affixed to an upper and a lower leadframe |
Jun. 10, 1997 |
| 5409866 |
Process for manufacturing a semiconductor device affixed to an upper and a lower leadframe |
Apr. 25, 1995 |
| 5304818 |
Lead frame |
Apr. 19, 1994 |
| 5250839 |
Multi-layer leadframes, electrically conductive plates used therefor and production of such conductive plates |
Oct. 5, 1993 |
| RE34269 |
Semiconductor integrated circuit packages |
Jun. 1, 1993 |
| 5126820 |
Thermal expansion compensated metal lead frame for integrated circuit package |
Jun. 30, 1992 |
| 5121300 |
Lead frame and electronic device employing the same |
Jun. 9, 1992 |
| 5043791 |
Electrical device having improved lead frame and thermally stable connection arrangement and method |
Aug. 27, 1991 |
| 4918511 |
Thermal expansion compensated metal lead frame for integrated circuit package |
Apr. 17, 1990 |
| 4907129 |
Lead frame and electronic divice |
Mar. 6, 1990 |
| 4870474 |
Lead frame |
Sep. 26, 1989 |
| 4803540 |
Semiconductor integrated circuit packages |
Feb. 7, 1989 |
| 4797726 |
Lead frame including deformable plates |
Jan. 10, 1989 |
| 4797787 |
Lead frame and electronic device |
Jan. 10, 1989 |
| 4791472 |
Lead frame and semiconductor device using the same |
Dec. 13, 1988 |
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