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Browse by Category: Main > Physics
Class Information
Number: 257/E23.045
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for conducting electric current to or from solid-state body in operation, e.g., leads, terminal arrangements (epo) > Consisting of soldered or bonded constructions (epo) > Lead frames or other flat leads (epo) > Geometry of lead frame (epo) > Deformation absorbing parts in lead frame plane, e.g., meanderline shape (epo)
Description: This subclass is indented under subclass E23.043. This subclass is substantially the same in scope as ECLA classification H01L23/495G2.










Patents under this class:
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Patent Number Title Of Patent Date Issued
8710540 LED package with top and bottom electrodes Apr. 29, 2014
8618643 Semiconductor device and lead frame used for the same Dec. 31, 2013
8399999 Electronic component, semiconductor device, methods of manufacturing the same, circuit board, and electronic instrument Mar. 19, 2013
8373257 Top exposed clip with window array Feb. 12, 2013
8344487 Stress mitigation in packaged microchips Jan. 1, 2013
8247835 LED package with top and bottom electrodes Aug. 21, 2012
8138027 Optical semiconductor device having pre-molded leadframe with window and method therefor Mar. 20, 2012
8133799 Controlling warping in integrated circuit devices Mar. 13, 2012
8044495 Metallic leadframes having laser-treated surfaces for improved adhesion to polymeric compounds Oct. 25, 2011
7994629 Leadless integrated circuit packaging system and method of manufacture thereof Aug. 9, 2011
7977774 Fusion quad flat semiconductor package Jul. 12, 2011
7960816 Semiconductor package with passive device integration Jun. 14, 2011
7928540 Integrated circuit package system Apr. 19, 2011
7923347 Controlling warping in integrated circuit devices Apr. 12, 2011
7888185 Semiconductor device assemblies and systems including at least one conductive pathway extending around a side of at least one semiconductor device Feb. 15, 2011
7863108 Integrated circuit packaging system with etched ring and die paddle and method of manufacture thereof Jan. 4, 2011
7833840 Integrated circuit package system with down-set die pad and method of manufacture thereof Nov. 16, 2010
7755205 Electronic component, semiconductor device, methods of manufacturing the same, circuit board, and electronic instrument Jul. 13, 2010
7750448 Semiconductor package and method for manufacturing the same Jul. 6, 2010
7675148 Power module having stacked flip-chip and method of fabricating the power module Mar. 9, 2010
7619303 Integrated circuit package Nov. 17, 2009
7619307 Leadframe-based semiconductor package having arched bend in a supporting bar and leadframe for the package Nov. 17, 2009
7598602 Controlling warping in integrated circuit devices Oct. 6, 2009
7556987 Method of fabricating an integrated circuit with etched ring and die paddle Jul. 7, 2009
7541665 Lead frame for a magnetic sensor Jun. 2, 2009
7485973 Electronic component, semiconductor device, methods of manufacturing the same, circuit board, and electronic instrument Feb. 3, 2009
7476913 Light emitting device having a mirror portion Jan. 13, 2009
7408246 Controlling warping in integrated circuit devices Aug. 5, 2008
7307351 Electronic component, semiconductor device, methods of manufacturing the same, circuit board, and electronic instrument Dec. 11, 2007
7239008 Semiconductor apparatus and method for fabricating the same Jul. 3, 2007
7235881 Electronic component, semiconductor device, methods of manufacturing the same, circuit board, and electronic instrument Jun. 26, 2007
7193299 Conductor frame and housing for a radiation-emitting component, radiation-emitting component and display and/or illumination system using radiation-emitting components Mar. 20, 2007
7157312 Surface mount package and method for forming multi-chip microsensor device Jan. 2, 2007
6996897 Method of making a mount for electronic devices Feb. 14, 2006
6979596 Method of fabricating a tape having apertures under a lead frame for conventional IC packages Dec. 27, 2005
6921966 Tape under frame for lead frame IC package assembly Jul. 26, 2005
6894370 Lead frame and semiconductor device having the same as well as method of resin-molding the same May. 17, 2005
6894372 Tape under frame for lead frame IC package assembly May. 17, 2005
6882048 Lead frame and semiconductor package having a groove formed in the respective terminals for limiting a plating area Apr. 19, 2005
6828659 Semiconductor device having a die pad supported by a die pad supporter Dec. 7, 2004
6633077 Semiconductor device and method for manufacturing the same Oct. 14, 2003
6555899 Semiconductor package leadframe assembly and method of manufacture Apr. 29, 2003
6518650 Tape under frame for lead frame IC package assembly Feb. 11, 2003
6455922 Deformation-absorbing leadframe for semiconductor devices Sep. 24, 2002
6455348 Lead frame, resin-molded semiconductor device, and method for manufacturing the same Sep. 24, 2002
6306684 Stress reducing lead-frame for plastic encapsulation Oct. 23, 2001
6303984 Lead frame including angle iron tie bar Oct. 16, 2001
6215177 Tape under frame for conventional-type IC package assembly Apr. 10, 2001
6169322 Die attach pad adapted to reduce delamination stress and method of using same Jan. 2, 2001
6111307 Method of making lead frame including angle iron tie bar Aug. 29, 2000

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