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Class Information
Number: 257/E23.044
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for conducting electric current to or from solid-state body in operation, e.g., leads, terminal arrangements (epo) > Consisting of soldered or bonded constructions (epo) > Lead frames or other flat leads (epo) > Geometry of lead frame (epo) > For devices adapted for rectifying, amplifying, oscillating, or switching, capacitors, or resistors with at least one potential-jump barrier or surface barrier (epo)
Description: This subclass is indented under subclass E23.043. This subclass is substantially the same in scope as ECLA classification H01L23/495G8.










Patents under this class:
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Patent Number Title Of Patent Date Issued
8669648 Power semiconductor module Mar. 11, 2014
8624369 Balance filter packaging chip having balun mounted therein and manufacturing method thereof Jan. 7, 2014
8604597 Multi-die packages incorporating flip chip dies and associated packaging methods Dec. 10, 2013
8581378 Semiconductor device and method of manufacturing the same Nov. 12, 2013
8513811 Electronic device and method for connecting a die to a connection terminal Aug. 20, 2013
8431993 Semiconductor package for forming a leadframe package Apr. 30, 2013
8334583 Leadframe strip and mold apparatus for an electronic component and method of encapsulating an electronic component Dec. 18, 2012
8294256 Chip package structure and method of making the same Oct. 23, 2012
8237232 Semiconductor device including a DC-DC converter having a metal plate Aug. 7, 2012
8198709 Potted integrated circuit device with aluminum case Jun. 12, 2012
8193622 Thermally enhanced thin semiconductor package Jun. 5, 2012
8183681 Semiconductor device May. 22, 2012
8115289 Onboard electric power control device Feb. 14, 2012
8105883 Molding die with tilted runner, method of manufacturing semiconductor device using the same, and semiconductor device made by the method Jan. 31, 2012
8004070 Wire-free chip module and method Aug. 23, 2011
7999364 Method and flip chip structure for power devices Aug. 16, 2011
7989935 Semiconductor device Aug. 2, 2011
7948078 Semiconductor device May. 24, 2011
7939921 Leadframe May. 10, 2011
7932786 Surface mount type crystal oscillator Apr. 26, 2011
7932588 Semiconductor device including a DC-DC converter having a metal plate Apr. 26, 2011
7880280 Electronic component and method for manufacturing an electronic component Feb. 1, 2011
7875928 Component arrangement having an evaluation circuit for detecting wear on connections Jan. 25, 2011
7821124 Thin, thermally enhanced flip chip in a leaded molded package Oct. 26, 2010
7804160 Ultrasonic bonding equipment for manufacturing semiconductor device, semiconductor device and its manufacturing method Sep. 28, 2010
7759775 High current semiconductor power device SOIC package Jul. 20, 2010
7745929 Semiconductor device and method for producing the same Jun. 29, 2010
7737551 Semiconductor power module with SiC power diodes and method for its production Jun. 15, 2010
7705476 Integrated circuit package Apr. 27, 2010
7702434 Indicating apparatus for a motor vehicle Apr. 20, 2010
7692293 Semiconductor switching module Apr. 6, 2010
7687900 Semiconductor integrated circuit device and fabrication method for the same Mar. 30, 2010
7679182 Power module and motor integrated control unit Mar. 16, 2010
7679173 Semiconductor device including a DC-DC converter Mar. 16, 2010
7663211 Dual side cooling integrated power device package and module with a clip attached to a leadframe in the package and the module and methods of manufacture Feb. 16, 2010
7615852 Semiconductor component in a housing with mechanically inforcing flat conductor webs Nov. 10, 2009
7615854 Semiconductor package that includes stacked semiconductor die Nov. 10, 2009
7612439 Semiconductor package having improved thermal performance Nov. 3, 2009
7569920 Electronic component having at least one vertical semiconductor power transistor Aug. 4, 2009
7528469 Semiconductor equipment having multiple semiconductor devices and multiple lead frames May. 5, 2009
7525183 Surface mount multichip devices Apr. 28, 2009
7476913 Light emitting device having a mirror portion Jan. 13, 2009
7466012 Power semiconductor package Dec. 16, 2008
7466015 Supporting frame for surface-mount diode package Dec. 16, 2008
7443014 Electronic module and method of assembling the same Oct. 28, 2008
7400027 Nonvolatile memory device having two or more resistance elements and methods of forming and using the same Jul. 15, 2008
7382000 Semiconductor device Jun. 3, 2008
7372142 Vertical conduction power electronic device package and corresponding assembling method May. 13, 2008
7361937 White-light emitting device and the use thereof Apr. 22, 2008
7348664 Semiconductor apparatus having a cooling apparatus that compressively engages a semiconductor device Mar. 25, 2008

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