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Class Information
Number: 257/E23.044
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for conducting electric current to or from solid-state body in operation, e.g., leads, terminal arrangements (epo) > Consisting of soldered or bonded constructions (epo) > Lead frames or other flat leads (epo) > Geometry of lead frame (epo) > For devices adapted for rectifying, amplifying, oscillating, or switching, capacitors, or resistors with at least one potential-jump barrier or surface barrier (epo)
Description: This subclass is indented under subclass E23.043. This subclass is substantially the same in scope as ECLA classification H01L23/495G8.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7615852 |
Semiconductor component in a housing with mechanically inforcing flat conductor webs |
Nov. 10, 2009 |
| 7615854 |
Semiconductor package that includes stacked semiconductor die |
Nov. 10, 2009 |
| 7612439 |
Semiconductor package having improved thermal performance |
Nov. 3, 2009 |
| 7569920 |
Electronic component having at least one vertical semiconductor power transistor |
Aug. 4, 2009 |
| 7528469 |
Semiconductor equipment having multiple semiconductor devices and multiple lead frames |
May. 5, 2009 |
| 7525183 |
Surface mount multichip devices |
Apr. 28, 2009 |
| 7476913 |
Light emitting device having a mirror portion |
Jan. 13, 2009 |
| 7466012 |
Power semiconductor package |
Dec. 16, 2008 |
| 7466015 |
Supporting frame for surface-mount diode package |
Dec. 16, 2008 |
| 7443014 |
Electronic module and method of assembling the same |
Oct. 28, 2008 |
| 7400027 |
Nonvolatile memory device having two or more resistance elements and methods of forming and using the same |
Jul. 15, 2008 |
| 7382000 |
Semiconductor device |
Jun. 3, 2008 |
| 7372142 |
Vertical conduction power electronic device package and corresponding assembling method |
May. 13, 2008 |
| 7361937 |
White-light emitting device and the use thereof |
Apr. 22, 2008 |
| 7348664 |
Semiconductor apparatus having a cooling apparatus that compressively engages a semiconductor device |
Mar. 25, 2008 |
| 7332806 |
Thin, thermally enhanced molded package with leadframe having protruding region |
Feb. 19, 2008 |
| 7242085 |
Semiconductor device including a semiconductor chip mounted on a metal base |
Jul. 10, 2007 |
| 7227198 |
Half-bridge package |
Jun. 5, 2007 |
| 7183625 |
Embedded MIM capacitor and zigzag inductor scheme |
Feb. 27, 2007 |
| 7135754 |
Chip type solid electrolytic capacitor having a small size and a simple structure |
Nov. 14, 2006 |
| 7132737 |
Package for electronic component and method of manufacturing piezoelectric device |
Nov. 7, 2006 |
| 7095098 |
Electrically isolated and thermally conductive double-sided pre-packaged component |
Aug. 22, 2006 |
| 7075174 |
Semiconductor packaging techniques for use with non-ceramic packages |
Jul. 11, 2006 |
| 7071033 |
Method for forming semiconductor device including stacked dies |
Jul. 4, 2006 |
| 7061077 |
Substrate based unmolded package including lead frame structure and semiconductor die |
Jun. 13, 2006 |
| 7057273 |
Surface mount package |
Jun. 6, 2006 |
| 7053469 |
Leadless semiconductor package and manufacturing method thereof |
May. 30, 2006 |
| 7052938 |
Flip clip attach and copper clip attach on MOSFET device |
May. 30, 2006 |
| 7045903 |
Integrated power circuits with distributed bonding and current flow |
May. 16, 2006 |
| 7045905 |
Molded package and semiconductor device using molded package |
May. 16, 2006 |
| 7042616 |
Electrochromic rearview mirror assembly incorporating a display/signal light |
May. 9, 2006 |
| 7042085 |
Method for packaging electronic modules and multiple chip packaging |
May. 9, 2006 |
| 7034385 |
Topless semiconductor package |
Apr. 25, 2006 |
| 7029947 |
Flip chip in leaded molded package with two dies |
Apr. 18, 2006 |
| 7031170 |
Electronic device having a plastic housing and components of a height-structured metallic leadframe and methods for the production of the electronic device |
Apr. 18, 2006 |
| 7012332 |
Semiconductor device having sealing structure for wide gap type semiconductor chip |
Mar. 14, 2006 |
| 7009291 |
Semiconductor module and semiconductor device |
Mar. 7, 2006 |
| 6992385 |
Semiconductor device, a method of manufacturing the same and an electronic device |
Jan. 31, 2006 |
| 6992386 |
Semiconductor device and a method of manufacturing the same |
Jan. 31, 2006 |
| 6989588 |
Semiconductor device including molded wireless exposed drain packaging |
Jan. 24, 2006 |
| 6989585 |
Surface-mounting semiconductor device and method of making the same |
Jan. 24, 2006 |
| 6984884 |
Electric power semiconductor device |
Jan. 10, 2006 |
| 6979843 |
Power semiconductor device |
Dec. 27, 2005 |
| 6963140 |
Transistor having multiple gate pads |
Nov. 8, 2005 |
| 6943434 |
Method for maintaining solder thickness in flipchip attach packaging processes |
Sep. 13, 2005 |
| 6936915 |
Lead frame having chip mounting part and leads of different thicknesses |
Aug. 30, 2005 |
| 6930355 |
Silicided trench gate power mosfets ultrasonically bonded to a surface source electrode |
Aug. 16, 2005 |
| 6930354 |
Semiconductor device |
Aug. 16, 2005 |
| 6930333 |
Semiconductor device wiring structure |
Aug. 16, 2005 |
| 6927094 |
Method for assembling a semiconductor chip utilizing conducting bars rather than bonding wires |
Aug. 9, 2005 |
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