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Class Information
Number: 257/E23.043
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for conducting electric current to or from solid-state body in operation, e.g., leads, terminal arrangements (epo) > Consisting of soldered or bonded constructions (epo) > Lead frames or other flat leads (epo) > Geometry of lead frame (epo)
Description: This subclass is indented under subclass E23.031. This subclass is substantially the same in scope as ECLA classification H01L23/495G.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 5508563 |
Semiconductor assembly having laminated semiconductor devices |
Apr. 16, 1996 |
| 5504370 |
Electronic system circuit package directly supporting components on isolated subsegments |
Apr. 2, 1996 |
| 5497030 |
Lead frame and resin-molded-type semiconductor device |
Mar. 5, 1996 |
| 5497032 |
Semiconductor device and lead frame therefore |
Mar. 5, 1996 |
| 5491360 |
Electronic package for isolated circuits |
Feb. 13, 1996 |
| 5489800 |
Dual channel small outline optocoupler package and method thereof |
Feb. 6, 1996 |
| 5486722 |
Lead frame having small pitch between outer leads |
Jan. 23, 1996 |
| 5484959 |
High density lead-on-package fabrication method and apparatus |
Jan. 16, 1996 |
| 5475259 |
Semiconductor device and carrier for carrying semiconductor device |
Dec. 12, 1995 |
| 5473189 |
Lead frame for a semiconductor integrated circuit with outer leads having a staggered configuration |
Dec. 5, 1995 |
| 5466968 |
Leadframe for making semiconductor devices |
Nov. 14, 1995 |
| 5466967 |
Lead frame for a multiplicity of terminals |
Nov. 14, 1995 |
| 5457340 |
Leadframe with power and ground planes |
Oct. 10, 1995 |
| 5451812 |
Leadframe for semiconductor devices |
Sep. 19, 1995 |
| 5438277 |
Ground bounce isolated output buffer |
Aug. 1, 1995 |
| 5437095 |
Method of making plastic encapsulated integrated circuit package |
Aug. 1, 1995 |
| 5434750 |
Partially-molded, PCB chip carrier package for certain non-square die shapes |
Jul. 18, 1995 |
| 5432380 |
Apparatus for tape-mounting a semiconductor device |
Jul. 11, 1995 |
| 5428889 |
Method for manufacturing composite lead frame |
Jul. 4, 1995 |
| 5428245 |
Lead frame including an inductor or other such magnetic component |
Jun. 27, 1995 |
| 5420459 |
Resin encapsulation type semiconductor device having an improved lead configuration |
May. 30, 1995 |
| 5411920 |
Lead frame, semiconductor device, and method of manufacturing same |
May. 2, 1995 |
| 5403785 |
Process of fabrication IC chip package from an IC chip carrier substrate and a leadframe and the IC chip package fabricated thereby |
Apr. 4, 1995 |
| 5394607 |
Method of providing low cost heat sink |
Mar. 7, 1995 |
| 5395800 |
Method for assembling semiconductor devices with lead frame containing common lead arrangement |
Mar. 7, 1995 |
| 5394010 |
Semiconductor assembly having laminated semiconductor devices |
Feb. 28, 1995 |
| 5389739 |
Electronic device packaging assembly |
Feb. 14, 1995 |
| 5389816 |
Multi-layer lead frame using a metal-core substrate |
Feb. 14, 1995 |
| 5386625 |
Tab type IC assembling method and an IC assembled thereby |
Feb. 7, 1995 |
| 5381037 |
Lead frame with selected inner leads coupled to an inner frame member for an integrated circuit package assemblies |
Jan. 10, 1995 |
| 5378656 |
Leadframe, semiconductor integrated circuit device using the same, and method of and process for fabricating the same |
Jan. 3, 1995 |
| 5376909 |
Device packaging |
Dec. 27, 1994 |
| 5371044 |
Method of uniformly encapsulating a semiconductor device in resin |
Dec. 6, 1994 |
| 5369058 |
Warp-resistent ultra-thin integrated circuit package fabrication method |
Nov. 29, 1994 |
| 5369056 |
Warp-resistent ultra-thin integrated circuit package fabrication method |
Nov. 29, 1994 |
| 5355018 |
Stress-free semiconductor leadframe |
Oct. 11, 1994 |
| 5347709 |
Method of making lead frame |
Sep. 20, 1994 |
| 5349233 |
Lead frame and semiconductor module using the same having first and second islands and three distinct pluralities of leads and semiconductor module using the lead frame |
Sep. 20, 1994 |
| 5343615 |
Semiconductor device and a process for making same having improved leads |
Sep. 6, 1994 |
| 5338392 |
Method for manufacturing a laminated plate used in a semiconductor device |
Aug. 16, 1994 |
| 5338972 |
Lead frame with deformable buffer portions |
Aug. 16, 1994 |
| 5338971 |
Electronic device structure with studs locating lead frame on backing plate |
Aug. 16, 1994 |
| 5334873 |
Semiconductor packages with centrally located electrode pads |
Aug. 2, 1994 |
| 5334872 |
Encapsulated semiconductor device having a hanging heat spreading plate electrically insulated from the die pad |
Aug. 2, 1994 |
| 5326990 |
Composite lead frame with connected inner and outer leads |
Jul. 5, 1994 |
| 5317189 |
Axial lead frame |
May. 31, 1994 |
| 5309017 |
Assembly lead frame with common lead arrangement for semiconductor devices |
May. 3, 1994 |
| 5309018 |
Lead frame having deformable supports |
May. 3, 1994 |
| 5307929 |
Lead arrangement for integrated circuits and method of assembly |
May. 3, 1994 |
| 5307503 |
Shielded circuit module with terminal pins arrayed on four sides for connection to a computer board |
Apr. 26, 1994 |
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