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Class Information
Number: 257/E23.043
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for conducting electric current to or from solid-state body in operation, e.g., leads, terminal arrangements (epo) > Consisting of soldered or bonded constructions (epo) > Lead frames or other flat leads (epo) > Geometry of lead frame (epo)
Description: This subclass is indented under subclass E23.031. This subclass is substantially the same in scope as ECLA classification H01L23/495G.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7405467 |
Power module package structure |
Jul. 29, 2008 |
| 7391101 |
Semiconductor pressure sensor |
Jun. 24, 2008 |
| 7388280 |
Package stacking lead frame system |
Jun. 17, 2008 |
| 7372133 |
Microelectronic package having a stiffening element and method of making same |
May. 13, 2008 |
| 7368807 |
Low cost method to produce high volume lead frames |
May. 6, 2008 |
| 7364784 |
Thin semiconductor package having stackable lead frame and method of manufacturing the same |
Apr. 29, 2008 |
| 7361977 |
Semiconductor assembly and packaging for high current and low inductance |
Apr. 22, 2008 |
| 7361983 |
Semiconductor device and semiconductor assembly module with a gap-controlling lead structure |
Apr. 22, 2008 |
| 7345357 |
High density chip scale leadframe package and method of manufacturing the package |
Mar. 18, 2008 |
| 7339261 |
Semiconductor device |
Mar. 4, 2008 |
| 7338841 |
Leadframe with encapsulant guide and method for the fabrication thereof |
Mar. 4, 2008 |
| 7332803 |
Circuit device |
Feb. 19, 2008 |
| 7323765 |
Die attach paddle for mounting integrated circuit die |
Jan. 29, 2008 |
| 7323769 |
High performance chip scale leadframe package with thermal dissipating structure and annular element and method of manufacturing package |
Jan. 29, 2008 |
| 7309624 |
Semiconductor device and method for the fabrication thereof including grinding a major portion of the frame |
Dec. 18, 2007 |
| 7307351 |
Electronic component, semiconductor device, methods of manufacturing the same, circuit board, and electronic instrument |
Dec. 11, 2007 |
| 7304371 |
Lead frame having a lead with a non-uniform width |
Dec. 4, 2007 |
| 7279780 |
Quad flat no-lead (QFN) grid array package, method of making and memory module and computer system including same |
Oct. 9, 2007 |
| 7274090 |
Electronic package and semiconductor device using the same |
Sep. 25, 2007 |
| 7271471 |
Metal substrate apparatus, method of manufacturing an IC card module apparatus, and an IC card module apparatus |
Sep. 18, 2007 |
| 7265453 |
Semiconductor component having dummy segments with trapped corner air |
Sep. 4, 2007 |
| 7259460 |
Wire bonding on thinned portions of a lead-frame configured for use in a micro-array integrated circuit package |
Aug. 21, 2007 |
| 7238549 |
Surface-mounting semiconductor device and method of making the same |
Jul. 3, 2007 |
| 7235881 |
Electronic component, semiconductor device, methods of manufacturing the same, circuit board, and electronic instrument |
Jun. 26, 2007 |
| 7230320 |
Electronic circuit device with reduced breaking and cracking |
Jun. 12, 2007 |
| 7227240 |
Semiconductor device with wire bond inductor and method |
Jun. 5, 2007 |
| 7227198 |
Half-bridge package |
Jun. 5, 2007 |
| 7192809 |
Low cost method to produce high volume lead frames |
Mar. 20, 2007 |
| 7187065 |
Semiconductor device and semiconductor device unit |
Mar. 6, 2007 |
| 7176062 |
Lead-frame method and assembly for interconnecting circuits within a circuit module |
Feb. 13, 2007 |
| 7176557 |
Semiconductor device |
Feb. 13, 2007 |
| 7173321 |
Semiconductor package having multiple row of leads |
Feb. 6, 2007 |
| 7170168 |
Flip-chip semiconductor package with lead frame and method for fabricating the same |
Jan. 30, 2007 |
| 7138707 |
Semiconductor package including leads and conductive posts for providing increased functionality |
Nov. 21, 2006 |
| 7102216 |
Semiconductor package and leadframe with horizontal leads spaced in the vertical direction and method of making |
Sep. 5, 2006 |
| 7095099 |
Low profile package having multiple die |
Aug. 22, 2006 |
| 7075172 |
Lead-frame for semiconductor devices |
Jul. 11, 2006 |
| 7067904 |
Flip-chip type quad flat package and leadframe |
Jun. 27, 2006 |
| 7064420 |
Integrated circuit leadframe with ground plane |
Jun. 20, 2006 |
| 7061078 |
Semiconductor package |
Jun. 13, 2006 |
| 7057280 |
Leadframe having lead locks to secure leads to encapsulant |
Jun. 6, 2006 |
| 7042068 |
Leadframe and semiconductor package made using the leadframe |
May. 9, 2006 |
| 7009282 |
Packaged integrated circuit providing trace access to high-speed leads |
Mar. 7, 2006 |
| 7009283 |
Nonexposed heat sink for semiconductor package |
Mar. 7, 2006 |
| 7002249 |
Microelectronic component with reduced parasitic inductance and method of fabricating |
Feb. 21, 2006 |
| 6984884 |
Electric power semiconductor device |
Jan. 10, 2006 |
| 6982479 |
Semiconductor package with leadframe inductors |
Jan. 3, 2006 |
| 6972943 |
Electronic component having lead frame |
Dec. 6, 2005 |
| 6969918 |
System for fabricating semiconductor components using mold cavities having runners configured to minimize venting |
Nov. 29, 2005 |
| 6965157 |
Semiconductor package with exposed die pad and body-locking leadframe |
Nov. 15, 2005 |
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