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Class Information
Number: 257/E23.043
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for conducting electric current to or from solid-state body in operation, e.g., leads, terminal arrangements (epo) > Consisting of soldered or bonded constructions (epo) > Lead frames or other flat leads (epo) > Geometry of lead frame (epo)
Description: This subclass is indented under subclass E23.031. This subclass is substantially the same in scope as ECLA classification H01L23/495G.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7622333 |
Integrated circuit package system for package stacking and manufacturing method thereof |
Nov. 24, 2009 |
| 7619303 |
Integrated circuit package |
Nov. 17, 2009 |
| 7619307 |
Leadframe-based semiconductor package having arched bend in a supporting bar and leadframe for the package |
Nov. 17, 2009 |
| 7615859 |
Thin semiconductor package having stackable lead frame and method of manufacturing the same |
Nov. 10, 2009 |
| 7615853 |
Chip-stacked package structure having leadframe with multi-piece bus bar |
Nov. 10, 2009 |
| 7615851 |
Integrated circuit package system |
Nov. 10, 2009 |
| 7612435 |
Method of packaging integrated circuits |
Nov. 3, 2009 |
| 7612436 |
Packaged microelectronic devices with a lead frame |
Nov. 3, 2009 |
| 7608482 |
Integrated circuit package with molded insulation |
Oct. 27, 2009 |
| 7605451 |
RF power transistor having an encapsulated chip package |
Oct. 20, 2009 |
| 7595547 |
Semiconductor die package including cup-shaped leadframe |
Sep. 29, 2009 |
| 7589404 |
Semiconductor device |
Sep. 15, 2009 |
| 7589412 |
Semiconductor device |
Sep. 15, 2009 |
| 7579676 |
Leadless leadframe implemented in a leadframe-based BGA package |
Aug. 25, 2009 |
| 7566954 |
Bonding configurations for lead-frame-based and substrate-based semiconductor packages |
Jul. 28, 2009 |
| 7563647 |
Integrated circuit package system with interconnect support |
Jul. 21, 2009 |
| 7563648 |
Semiconductor device package and method for manufacturing same |
Jul. 21, 2009 |
| 7550829 |
Electronic package and semiconductor device using the same |
Jun. 23, 2009 |
| 7550855 |
Vertically spaced plural microsprings |
Jun. 23, 2009 |
| 7541664 |
Lead frame and semiconductor device having the lead frame |
Jun. 2, 2009 |
| 7538416 |
Resin molded type semiconductor device and a method of manufacturing the same |
May. 26, 2009 |
| 7535084 |
Multi-chip package with a single die pad |
May. 19, 2009 |
| 7514724 |
Solid state light source having a variable number of dies |
Apr. 7, 2009 |
| 7489023 |
Semiconductor device including a semiconductor chip with signal contact areas and supply contact areas, and method for producing the semiconductor device |
Feb. 10, 2009 |
| 7485973 |
Electronic component, semiconductor device, methods of manufacturing the same, circuit board, and electronic instrument |
Feb. 3, 2009 |
| 7476913 |
Light emitting device having a mirror portion |
Jan. 13, 2009 |
| 7468316 |
Low fabrication cost, fine pitch and high reliability solder bump |
Dec. 23, 2008 |
| 7466016 |
Bent lead transistor |
Dec. 16, 2008 |
| 7449770 |
Substrate with slot |
Nov. 11, 2008 |
| 7443012 |
Semiconductor device |
Oct. 28, 2008 |
| 7443013 |
Flexible substrate for package of die |
Oct. 28, 2008 |
| 7425755 |
Semiconductor package, method for manufacturing the same and lead frame for use in the same |
Sep. 16, 2008 |
| 7425756 |
Semiconductor device and electronic device |
Sep. 16, 2008 |
| 7420265 |
Integrated circuit package system with integrated circuit support |
Sep. 2, 2008 |
| 7405467 |
Power module package structure |
Jul. 29, 2008 |
| 7391101 |
Semiconductor pressure sensor |
Jun. 24, 2008 |
| 7388280 |
Package stacking lead frame system |
Jun. 17, 2008 |
| 7372133 |
Microelectronic package having a stiffening element and method of making same |
May. 13, 2008 |
| 7368807 |
Low cost method to produce high volume lead frames |
May. 6, 2008 |
| 7364784 |
Thin semiconductor package having stackable lead frame and method of manufacturing the same |
Apr. 29, 2008 |
| 7361983 |
Semiconductor device and semiconductor assembly module with a gap-controlling lead structure |
Apr. 22, 2008 |
| 7361977 |
Semiconductor assembly and packaging for high current and low inductance |
Apr. 22, 2008 |
| 7345357 |
High density chip scale leadframe package and method of manufacturing the package |
Mar. 18, 2008 |
| 7338841 |
Leadframe with encapsulant guide and method for the fabrication thereof |
Mar. 4, 2008 |
| 7339261 |
Semiconductor device |
Mar. 4, 2008 |
| 7332803 |
Circuit device |
Feb. 19, 2008 |
| 7323769 |
High performance chip scale leadframe package with thermal dissipating structure and annular element and method of manufacturing package |
Jan. 29, 2008 |
| 7323765 |
Die attach paddle for mounting integrated circuit die |
Jan. 29, 2008 |
| 7309624 |
Semiconductor device and method for the fabrication thereof including grinding a major portion of the frame |
Dec. 18, 2007 |
| 7307351 |
Electronic component, semiconductor device, methods of manufacturing the same, circuit board, and electronic instrument |
Dec. 11, 2007 |
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