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Class Information
Number: 257/E23.043
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for conducting electric current to or from solid-state body in operation, e.g., leads, terminal arrangements (epo) > Consisting of soldered or bonded constructions (epo) > Lead frames or other flat leads (epo) > Geometry of lead frame (epo)
Description: This subclass is indented under subclass E23.031. This subclass is substantially the same in scope as ECLA classification H01L23/495G.










Sub-classes under this class:

Class Number Class Name Patents
257/E23.046 Cross-section geometry (epo) 410
257/E23.045 Deformation absorbing parts in lead frame plane, e.g., meanderline shape (epo) 73
257/E23.044 For devices adapted for rectifying, amplifying, oscillating, or switching, capacitors, or resistors with at least one potential-jump barrier or surface barrier (epo) 451
257/E23.049 Insulating layers on lead frame, e.g., bridging members (epo) 213


Patents under this class:
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15

Patent Number Title Of Patent Date Issued
8710675 Integrated circuit package system with bonding lands Apr. 29, 2014
8710645 Area reduction for surface mount package chips Apr. 29, 2014
8674487 Semiconductor packages with lead extensions and related methods Mar. 18, 2014
8659135 Semiconductor device stack and method for its production Feb. 25, 2014
8659023 Monocrystalline substrate including lattice matching atoms in a near surface region and a monocrystalline layer disposed on the substrate Feb. 25, 2014
8659131 Structure for multi-row lead frame and semiconductor package capable of minimizing an under-cut Feb. 25, 2014
8643158 Semiconductor package and lead frame therefor Feb. 4, 2014
8637976 Semiconductor device with lead terminals having portions thereof extending obliquely Jan. 28, 2014
RE44699 Semiconductor integrated circuit having pads layout for increasing signal integrity and reducing chip size Jan. 14, 2014
8610254 Apparatus for integrated circuit packaging Dec. 17, 2013
8592967 Semiconductor apparatus and power supply circuit Nov. 26, 2013
8587098 Integrated circuit protruding pad package system and method for manufacturing thereof Nov. 19, 2013
8586857 Combined diode, lead assembly incorporating an expansion joint Nov. 19, 2013
8575744 Semiconductor device and lead frame thereof Nov. 5, 2013
8571229 Semiconductor device Oct. 29, 2013
8519525 Semiconductor encapsulation and method thereof Aug. 27, 2013
8502359 Semiconductor device Aug. 6, 2013
8487322 Luminous body with LED dies and production thereof Jul. 16, 2013
8471271 Light emitting diode package and method of manufacturing the same Jun. 25, 2013
8466009 Method of fabricating a semiconductor package with mold lock opening Jun. 18, 2013
8455986 Mosfet package Jun. 4, 2013
8436459 Power semiconductor module May. 7, 2013
8427844 Widebody coil isolators Apr. 23, 2013
8424195 Apparatus for manufacturing semiconductor package for wide lead frame and method of constructing semiconductor package using the same Apr. 23, 2013
8421209 Semiconductor device with lead terminals having portions thereof extending obliquely Apr. 16, 2013
8409922 Semiconductor device and method of forming leadframe interposer over semiconductor die and TSV substrate for vertical electrical interconnect Apr. 2, 2013
8405194 Semiconductor device including two heat sinks and method of manufacturing the same Mar. 26, 2013
8399999 Electronic component, semiconductor device, methods of manufacturing the same, circuit board, and electronic instrument Mar. 19, 2013
8395251 Integrated circuit package to package stacking system Mar. 12, 2013
8394675 Manufacturing light emitting diode (LED) packages Mar. 12, 2013
8390041 High efficiency module Mar. 5, 2013
8390103 Apparatus for integrated circuit packaging Mar. 5, 2013
8362516 Semiconductor light emitting device Jan. 29, 2013
8362605 Apparatus and method for use in mounting electronic elements Jan. 29, 2013
8324721 Integrated shunt resistor with external contact in a semiconductor package Dec. 4, 2012
8294249 Lead frame package Oct. 23, 2012
8288848 Semiconductor chip package including a lead frame Oct. 16, 2012
8232629 Semiconductor device Jul. 31, 2012
8212343 Semiconductor chip package Jul. 3, 2012
8207597 Integrated circuit package system with flashless leads Jun. 26, 2012
8203200 Diode leadframe for solar module assembly Jun. 19, 2012
8198134 Dual side cooling integrated power device module and methods of manufacture Jun. 12, 2012
8188582 Lead frame, semiconductor device using the lead frame, and methods of manufacturing the same May. 29, 2012
8183607 Semiconductor device May. 22, 2012
8120151 Optical semiconductor device and method for manufacturing the same Feb. 21, 2012
8120150 Integrated circuit package system with dual connectivity Feb. 21, 2012
8120152 Advanced quad flat no lead chip package having marking and corner lead features and manufacturing methods thereof Feb. 21, 2012
8115214 Light emitting diode package and method of manufacturing the same Feb. 14, 2012
8115298 Semiconductor device Feb. 14, 2012
8106490 Semiconductor chip package Jan. 31, 2012

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15










 
 
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