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Class Information
Number: 257/E23.042
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for conducting electric current to or from solid-state body in operation, e.g., leads, terminal arrangements (epo) > Consisting of soldered or bonded constructions (epo) > Lead frames or other flat leads (epo) > Plurality of lead frames mounted in one device (epo)
Description: This subclass is indented under subclass E23.031. This subclass is substantially the same in scope as ECLA classification H01L23/495F.

Patents under this class:
1 2 3 4 5

Patent Number Title Of Patent Date Issued
8643158 Semiconductor package and lead frame therefor Feb. 4, 2014
8629538 Power module package Jan. 14, 2014
8587101 Multi-chip module (MCM) power quad flat no-lead (PQFN) semiconductor package utilizing a leadframe for electrical interconnections Nov. 19, 2013
8492786 Light emitting device package and lighting system Jul. 23, 2013
8487418 LED package Jul. 16, 2013
8487322 Luminous body with LED dies and production thereof Jul. 16, 2013
8471271 Light emitting diode package and method of manufacturing the same Jun. 25, 2013
8426953 Semiconductor package with an embedded printed circuit board and stacked die Apr. 23, 2013
8384206 Semiconductor package Feb. 26, 2013
8378470 Semiconductor device that performs signal transmission using induction coupling, method of said manufacturing semiconductor device, and lead frame thereof Feb. 19, 2013
8373257 Top exposed clip with window array Feb. 12, 2013
8269334 Multichip package leadframe including electrical bussing Sep. 18, 2012
8154108 Dual-leadframe multi-chip package and method of manufacture Apr. 10, 2012
8138587 Device including two mounting surfaces Mar. 20, 2012
8120153 High-temperature, wirebondless, injection-molded, ultra-compact hybrid power module Feb. 21, 2012
8115214 Light emitting diode package and method of manufacturing the same Feb. 14, 2012
8063479 Housing for a semiconductor component Nov. 22, 2011
8030743 Semiconductor package with an embedded printed circuit board and stacked die Oct. 4, 2011
7977774 Fusion quad flat semiconductor package Jul. 12, 2011
7969000 Semiconductor device Jun. 28, 2011
7952198 BGA package with leads on chip May. 31, 2011
7923825 Integrated circuit package Apr. 12, 2011
7902655 Multichip package leadframe including electrical bussing Mar. 8, 2011
7902646 Multiphase synchronous buck converter Mar. 8, 2011
7898067 Pre-molded, clip-bonded multi-die semiconductor package Mar. 1, 2011
7888185 Semiconductor device assemblies and systems including at least one conductive pathway extending around a side of at least one semiconductor device Feb. 15, 2011
7843043 Structure of a lead-frame matrix of photoelectron devices Nov. 30, 2010
7821114 Multiphase synchronous buck converter Oct. 26, 2010
7790500 Partially patterned lead frames and methods of making and using the same in semiconductor packaging Sep. 7, 2010
7777314 Electronic component mounting package and package assembled substrate Aug. 17, 2010
7754537 Manufacture of mountable capped chips Jul. 13, 2010
7732302 Integrated sensor and circuitry and process therefor Jun. 8, 2010
7728420 High current lead electrode for semiconductor device Jun. 1, 2010
7719023 Light emitting device May. 18, 2010
7714418 Leadframe panel May. 11, 2010
7709944 Integrated circuit package system with package integration May. 4, 2010
7696612 Multiphase synchronous buck converter Apr. 13, 2010
7692285 Semiconductor device Apr. 6, 2010
7683476 Semiconductor package film having reinforcing member and related display module Mar. 23, 2010
7675170 Removable wafer expander for die bonding equipment Mar. 9, 2010
7671451 Semiconductor package having double layer leadframe Mar. 2, 2010
7666710 Method of manufacturing photo couplers Feb. 23, 2010
7662672 Manufacturing process of leadframe-based BGA packages Feb. 16, 2010
7612435 Method of packaging integrated circuits Nov. 3, 2009
7598604 Low profile semiconductor package Oct. 6, 2009
7576418 Lead frame structure and applications thereof Aug. 18, 2009
7554179 Multi-leadframe semiconductor package and method of manufacture Jun. 30, 2009
7547964 Device packages having a III-nitride based power semiconductor device Jun. 16, 2009
7535087 Semiconductor device with lead frames May. 19, 2009
7495320 System and method for providing a power bus in a wirebond leadframe package Feb. 24, 2009

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