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Class Information
Number: 257/E23.042
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for conducting electric current to or from solid-state body in operation, e.g., leads, terminal arrangements (epo) > Consisting of soldered or bonded constructions (epo) > Lead frames or other flat leads (epo) > Plurality of lead frames mounted in one device (epo)
Description: This subclass is indented under subclass E23.031. This subclass is substantially the same in scope as ECLA classification H01L23/495F.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7612435 |
Method of packaging integrated circuits |
Nov. 3, 2009 |
| 7598604 |
Low profile semiconductor package |
Oct. 6, 2009 |
| 7576418 |
Lead frame structure and applications thereof |
Aug. 18, 2009 |
| 7554179 |
Multi-leadframe semiconductor package and method of manufacture |
Jun. 30, 2009 |
| 7547964 |
Device packages having a III-nitride based power semiconductor device |
Jun. 16, 2009 |
| 7535087 |
Semiconductor device with lead frames |
May. 19, 2009 |
| 7495320 |
System and method for providing a power bus in a wirebond leadframe package |
Feb. 24, 2009 |
| 7482679 |
Leadframe for a semiconductor device |
Jan. 27, 2009 |
| 7436061 |
Semiconductor device, electronic device, electronic apparatus, and method of manufacturing semiconductor device |
Oct. 14, 2008 |
| 7345356 |
Optical package with double formed leadframe |
Mar. 18, 2008 |
| 7321160 |
Multi-part lead frame |
Jan. 22, 2008 |
| 7291924 |
Flip chip stacked package |
Nov. 6, 2007 |
| 7250672 |
Dual semiconductor die package with reverse lead form |
Jul. 31, 2007 |
| 7238549 |
Surface-mounting semiconductor device and method of making the same |
Jul. 3, 2007 |
| 7227252 |
Semiconductor component having stacked, encapsulated dice and method of fabrication |
Jun. 5, 2007 |
| 7227251 |
Semiconductor device and a memory system including a plurality of IC chips in a common package |
Jun. 5, 2007 |
| 7202105 |
Multi-chip semiconductor connector assembly method |
Apr. 10, 2007 |
| 7138707 |
Semiconductor package including leads and conductive posts for providing increased functionality |
Nov. 21, 2006 |
| 7119423 |
Semiconductor device and method of manufacturing the same, electronic module, and electronic instrument |
Oct. 10, 2006 |
| 7109063 |
Semiconductor substrate for build-up packages |
Sep. 19, 2006 |
| 7109576 |
Semiconductor component having encapsulated die stack |
Sep. 19, 2006 |
| 7066741 |
Flexible circuit connector for stacked chip module |
Jun. 27, 2006 |
| 7033866 |
Method for making dual gauge leadframe |
Apr. 25, 2006 |
| 6989585 |
Surface-mounting semiconductor device and method of making the same |
Jan. 24, 2006 |
| 6983537 |
Method of making a plastic package with an air cavity |
Jan. 10, 2006 |
| 6972214 |
Method for fabricating a semiconductor package with multi layered leadframe |
Dec. 6, 2005 |
| 6946722 |
Multi-part lead frame with dissimilar materials |
Sep. 20, 2005 |
| 6936915 |
Lead frame having chip mounting part and leads of different thicknesses |
Aug. 30, 2005 |
| 6927094 |
Method for assembling a semiconductor chip utilizing conducting bars rather than bonding wires |
Aug. 9, 2005 |
| 6919626 |
High density integrated circuit module |
Jul. 19, 2005 |
| 6902952 |
Multi-part lead frame with dissimilar materials and method of manufacturing |
Jun. 7, 2005 |
| 6867072 |
Flipchip QFN package and method therefor |
Mar. 15, 2005 |
| 6864566 |
Duel die package |
Mar. 8, 2005 |
| 6858467 |
Method for fabricating semiconductor packages with stacked dice and leadframes |
Feb. 22, 2005 |
| 6844616 |
Multi-chip semiconductor package structure |
Jan. 18, 2005 |
| 6835599 |
Method for fabricating semiconductor component with multi layered leadframe |
Dec. 28, 2004 |
| 6784525 |
Semiconductor component having multi layered leadframe |
Aug. 31, 2004 |
| 6747341 |
Integrated circuit and laminated leadframe package |
Jun. 8, 2004 |
| 6734536 |
Surface-mounting semiconductor device and method of making the same |
May. 11, 2004 |
| 6734044 |
Multiple leadframe laminated IC package |
May. 11, 2004 |
| 6713317 |
Semiconductor device and laminated leadframe package |
Mar. 30, 2004 |
| 6693304 |
Laminated lead frame, and optical communication module and method of manufacturing the same |
Feb. 17, 2004 |
| 6677181 |
Method for fabricating stacked chip package device |
Jan. 13, 2004 |
| 6603197 |
Semiconductor unit |
Aug. 5, 2003 |
| 6576985 |
Semiconductor device packaging assembly |
Jun. 10, 2003 |
| 6574107 |
Stacked intelligent power module package |
Jun. 3, 2003 |
| 6572387 |
Flexible circuit connector for stacked chip module |
Jun. 3, 2003 |
| 6570244 |
Multi-part lead frame with dissimilar materials |
May. 27, 2003 |
| 6566760 |
Semiconductor storage device having memory chips in a stacked structure |
May. 20, 2003 |
| 6551858 |
Method of producing a semiconductor device having two semiconductor chips sealed by a resin |
Apr. 22, 2003 |
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