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Class Information
Number: 257/E23.041
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for conducting electric current to or from solid-state body in operation, e.g., leads, terminal arrangements (epo) > Consisting of soldered or bonded constructions (epo) > Lead frames or other flat leads (epo) > Multilayer (epo)
Description: This subclass is indented under subclass E23.031. This subclass is substantially the same in scope as ECLA classification H01L23/495D.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7626255 |
Device, system and electric element |
Dec. 1, 2009 |
| 7612456 |
Electronic device, semiconductor device using same, and method for manufacturing semiconductor device |
Nov. 3, 2009 |
| 7579590 |
Method of measuring thin layers using SIMS |
Aug. 25, 2009 |
| 7557453 |
Semiconductor device, method of manufacturing a semiconductor device and substrate to be used to manufacture a semiconductor device |
Jul. 7, 2009 |
| 7462926 |
Leadframe comprising tin plating or an intermetallic layer formed therefrom |
Dec. 9, 2008 |
| 7459788 |
Ohmic electrode structure of nitride semiconductor device |
Dec. 2, 2008 |
| 7449367 |
Adhesive film for semiconductor, metal sheet with such adhesive film, wiring substrate with adhesive film, semiconductor device, and method for manufacturing semiconductor device |
Nov. 11, 2008 |
| 7329944 |
Leadframe for semiconductor device |
Feb. 12, 2008 |
| 7268021 |
Lead frame and method of manufacturing the same |
Sep. 11, 2007 |
| 7256481 |
Leadframes for improved moisture reliability and enhanced solderability of semiconductor devices |
Aug. 14, 2007 |
| 7247947 |
Semiconductor device comprising a plurality of semiconductor constructs |
Jul. 24, 2007 |
| 7239019 |
Selectively converted inter-layer dielectric |
Jul. 3, 2007 |
| 7187083 |
Thermal interface material and solder preforms |
Mar. 6, 2007 |
| 6768186 |
Semiconductor device and laminated leadframe package |
Jul. 27, 2004 |
| 6403402 |
Semiconductor chip having an underplate metal layer |
Jun. 11, 2002 |
| 6369441 |
Method of producing a semiconductor chip having an underplate metal layer |
Apr. 9, 2002 |
| 6351025 |
Semiconductor chip having an underplate metal layer |
Feb. 26, 2002 |
| 6139977 |
Palladium surface coating suitable for wirebonding and process for forming palladium surface coatings |
Oct. 31, 2000 |
| 6140153 |
Lead frame, the manufacturing method, semiconductor device and the manufacturing method |
Oct. 31, 2000 |
| 6087204 |
Method of making a multi-layer lead frame |
Jul. 11, 2000 |
| 6080264 |
Combination of semiconductor interconnect |
Jun. 27, 2000 |
| 5994768 |
Multi-layer lead frame |
Nov. 30, 1999 |
| 5976915 |
Low mutual inductance lead frame device |
Nov. 2, 1999 |
| 5917242 |
Combination of semiconductor interconnect |
Jun. 29, 1999 |
| 5909053 |
Lead frame and method for manufacturing same |
Jun. 1, 1999 |
| 5880520 |
Low mutual inductance lead frame device |
Mar. 9, 1999 |
| 5864173 |
Multi-layer lead frame |
Jan. 26, 1999 |
| 5672908 |
Thin semiconductor integrated circuit device assembly |
Sep. 30, 1997 |
| 5656855 |
Lead frame and method for manufacturing same |
Aug. 12, 1997 |
| 5643433 |
Lead frame and method for manufacturing same |
Jul. 1, 1997 |
| 5556807 |
Advance multilayer molded plastic package using mesic technology |
Sep. 17, 1996 |
| 5554886 |
Lead frame and semiconductor package with such lead frame |
Sep. 10, 1996 |
| 5525836 |
Multilayer metal leadframe |
Jun. 11, 1996 |
| 5488257 |
Multilayer molded plastic package using mesic technology |
Jan. 30, 1996 |
| 5480841 |
Process of multilayer conductor chip packaging |
Jan. 2, 1996 |
| 5461255 |
Multi-layered lead frame assembly for integrated circuits |
Oct. 24, 1995 |
| 5455387 |
Semiconductor package with chip redistribution interposer |
Oct. 3, 1995 |
| 5448106 |
Thin semiconductor integrated circuit device assembly |
Sep. 5, 1995 |
| 5437096 |
Method for making a multilayer metal leadframe |
Aug. 1, 1995 |
| 5410180 |
Metal plane support for multi-layer lead frames and a process for manufacturing such frames |
Apr. 25, 1995 |
| 5399902 |
Semiconductor chip packaging structure including a ground plane |
Mar. 21, 1995 |
| 5389816 |
Multi-layer lead frame using a metal-core substrate |
Feb. 14, 1995 |
| 5378657 |
Method for making an aluminum clad leadframe and a semiconductor device employing the same |
Jan. 3, 1995 |
| 5375041 |
Ra-tab array bump tab tape based I.C. package |
Dec. 20, 1994 |
| 5362656 |
Method of making an electronic assembly having a flexible circuit wrapped around a substrate |
Nov. 8, 1994 |
| 5357674 |
Method of manufacturing a printed circuit board |
Oct. 25, 1994 |
| 5331200 |
Lead-on-chip inner lead bonding lead frame method and apparatus |
Jul. 19, 1994 |
| 5329159 |
Semiconductor device employing an aluminum clad leadframe |
Jul. 12, 1994 |
| 5311407 |
Printed circuit based for mounted semiconductors and other electronic components |
May. 10, 1994 |
| 5309024 |
Multilayer package |
May. 3, 1994 |
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