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Class Information
Number: 257/E23.041
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for conducting electric current to or from solid-state body in operation, e.g., leads, terminal arrangements (epo) > Consisting of soldered or bonded constructions (epo) > Lead frames or other flat leads (epo) > Multilayer (epo)
Description: This subclass is indented under subclass E23.031. This subclass is substantially the same in scope as ECLA classification H01L23/495D.

Patents under this class:
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Patent Number Title Of Patent Date Issued
8669652 Lead component and method for manufacturing the same, and semiconductor package Mar. 11, 2014
8659131 Structure for multi-row lead frame and semiconductor package capable of minimizing an under-cut Feb. 25, 2014
8536695 Chip-last embedded interconnect structures Sep. 17, 2013
8466546 Chip-scale package Jun. 18, 2013
8445382 Side wall pore sealing for low-k dielectrics May. 21, 2013
8319330 Semiconductor package having exterior plating films formed over surfaces of outer leads Nov. 27, 2012
8084861 Connection structure semiconductor chip and electronic component including the connection structure and methods for producing the connection structure Dec. 27, 2011
8062961 Method for manufacturing a semiconductor device Nov. 22, 2011
8017434 Semiconductor chip package fixture Sep. 13, 2011
7964888 Semiconductor light emitting device packages and methods Jun. 21, 2011
7952210 Semiconductor package and fabrication method thereof May. 31, 2011
7936059 Lead frame packaging technique with reduced noise and cross-talk May. 3, 2011
7888185 Semiconductor device assemblies and systems including at least one conductive pathway extending around a side of at least one semiconductor device Feb. 15, 2011
7816770 Device and method for hermetically sealing a cavity in an electronic component Oct. 19, 2010
7816187 Method for fabricating semiconductor package free of substrate Oct. 19, 2010
7811854 Assembling stacked substrates that can form 3-D structures Oct. 12, 2010
7728427 Assembling stacked substrates that can form cylindrical inductors and adjustable transformers Jun. 1, 2010
7656033 Semiconductor device with a semiconductor chip using lead technology and method of manufacturing the same Feb. 2, 2010
7626255 Device, system and electric element Dec. 1, 2009
7612456 Electronic device, semiconductor device using same, and method for manufacturing semiconductor device Nov. 3, 2009
7579590 Method of measuring thin layers using SIMS Aug. 25, 2009
7557453 Semiconductor device, method of manufacturing a semiconductor device and substrate to be used to manufacture a semiconductor device Jul. 7, 2009
7462926 Leadframe comprising tin plating or an intermetallic layer formed therefrom Dec. 9, 2008
7459788 Ohmic electrode structure of nitride semiconductor device Dec. 2, 2008
7449367 Adhesive film for semiconductor, metal sheet with such adhesive film, wiring substrate with adhesive film, semiconductor device, and method for manufacturing semiconductor device Nov. 11, 2008
7329944 Leadframe for semiconductor device Feb. 12, 2008
7268021 Lead frame and method of manufacturing the same Sep. 11, 2007
7256481 Leadframes for improved moisture reliability and enhanced solderability of semiconductor devices Aug. 14, 2007
7247947 Semiconductor device comprising a plurality of semiconductor constructs Jul. 24, 2007
7239019 Selectively converted inter-layer dielectric Jul. 3, 2007
7187083 Thermal interface material and solder preforms Mar. 6, 2007
6768186 Semiconductor device and laminated leadframe package Jul. 27, 2004
6403402 Semiconductor chip having an underplate metal layer Jun. 11, 2002
6369441 Method of producing a semiconductor chip having an underplate metal layer Apr. 9, 2002
6351025 Semiconductor chip having an underplate metal layer Feb. 26, 2002
6140153 Lead frame, the manufacturing method, semiconductor device and the manufacturing method Oct. 31, 2000
6139977 Palladium surface coating suitable for wirebonding and process for forming palladium surface coatings Oct. 31, 2000
6087204 Method of making a multi-layer lead frame Jul. 11, 2000
6080264 Combination of semiconductor interconnect Jun. 27, 2000
5994768 Multi-layer lead frame Nov. 30, 1999
5976915 Low mutual inductance lead frame device Nov. 2, 1999
5917242 Combination of semiconductor interconnect Jun. 29, 1999
5909053 Lead frame and method for manufacturing same Jun. 1, 1999
5880520 Low mutual inductance lead frame device Mar. 9, 1999
5864173 Multi-layer lead frame Jan. 26, 1999
5672908 Thin semiconductor integrated circuit device assembly Sep. 30, 1997
5656855 Lead frame and method for manufacturing same Aug. 12, 1997
5643433 Lead frame and method for manufacturing same Jul. 1, 1997
5556807 Advance multilayer molded plastic package using mesic technology Sep. 17, 1996
5554886 Lead frame and semiconductor package with such lead frame Sep. 10, 1996

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