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Browse by Category: Main > Physics
Class Information
Number: 257/E23.04
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for conducting electric current to or from solid-state body in operation, e.g., leads, terminal arrangements (epo) > Consisting of soldered or bonded constructions (epo) > Lead frames or other flat leads (epo) > Characterized by die pad (epo) > Having bonding material between chip and die pad (epo)
Description: This subclass is indented under subclass E23.037. This subclass is substantially the same in scope as ECLA classification H01L23/495A6.










Patents under this class:
1 2 3 4 5

Patent Number Title Of Patent Date Issued
8704238 Method and structure of monolithically integrated IC-MEMS oscillator using IC foundry-compatible processes Apr. 22, 2014
8674520 Semiconductor device, method for manufacturing the same, and power supply unit Mar. 18, 2014
8674521 Semiconductor device package including a paste member Mar. 18, 2014
8614118 Component bonding method, component laminating method and bonded component structure Dec. 24, 2013
8513810 Semiconductor device and method of manufacturing same Aug. 20, 2013
8471386 Junction body, semiconductor module, and manufacturing method for junction body Jun. 25, 2013
8399997 Power package including multiple semiconductor devices Mar. 19, 2013
8390131 Semiconductor device with reduced contact resistance Mar. 5, 2013
8368234 Semiconductor device, production method for the same, and substrate Feb. 5, 2013
8299482 Light emitter Oct. 30, 2012
8283756 Electronic component with buffer layer Oct. 9, 2012
8252633 Subassembly that includes a power semiconductor die and a heat sink having an exposed surface portion thereof Aug. 28, 2012
8236577 Foundry compatible process for manufacturing a magneto meter using lorentz force for integrated systems Aug. 7, 2012
8188579 Semiconductor device including leadframe having power bars and increased I/O May. 29, 2012
8115286 Integrated sensor including sensing and processing die mounted on opposite sides of package substrate Feb. 14, 2012
8084861 Connection structure semiconductor chip and electronic component including the connection structure and methods for producing the connection structure Dec. 27, 2011
8071398 Method and structure of monolithically integrated IC-MEMS oscillator using IC foundry-compatible processes Dec. 6, 2011
8067826 Power device package comprising metal tab die attach paddle (DAP) and method of fabricating the package Nov. 29, 2011
8058719 Integrated circuit with flexible planer leads Nov. 15, 2011
8053281 Method of forming a wafer level package Nov. 8, 2011
8039364 Manufacturing method of semiconductor device Oct. 18, 2011
8018042 Integrated circuit with flexible planar leads Sep. 13, 2011
8008674 Light emitting device and LCD backlighting device Aug. 30, 2011
7982293 Multi-chip package including die paddle with steps Jul. 19, 2011
7948091 Mounting structure for semiconductor element May. 24, 2011
7915710 Method of fabricating a semiconductor device, and semiconductor device with a conductive member extending through a substrate and connected to a metal pattern bonded to the substrate Mar. 29, 2011
7911067 Semiconductor package system with die support pad Mar. 22, 2011
7901992 Die bonding agent and a semiconductor device made by using the same Mar. 8, 2011
7888185 Semiconductor device assemblies and systems including at least one conductive pathway extending around a side of at least one semiconductor device Feb. 15, 2011
7871856 Method and apparatus for manufacturing stacked-type semiconductor device Jan. 18, 2011
7868466 Semiconductor device and method of manufacture thereof, circuit board and electronic instrument Jan. 11, 2011
7847396 Semiconductor chip stack-type package and method of fabricating the same Dec. 7, 2010
7843074 Underfill for light emitting device Nov. 30, 2010
7838974 Intergrated circuit packaging with improved die bonding Nov. 23, 2010
7821124 Thin, thermally enhanced flip chip in a leaded molded package Oct. 26, 2010
7812431 Leadframe with die pad and leads corresponding thereto Oct. 12, 2010
7808117 Integrated circuit having pads and input/output (I/O) cells Oct. 5, 2010
7786568 Window BGA semiconductor package Aug. 31, 2010
7750467 Chip scale package structure with metal pads exposed from an encapsulant Jul. 6, 2010
7741706 Plastic surface mount large area power device Jun. 22, 2010
7736999 Manufacturing method of semiconductor device Jun. 15, 2010
7732300 Method of bonding aluminum electrodes of two semiconductor substrates Jun. 8, 2010
7701043 Lead frame Apr. 20, 2010
7662672 Manufacturing process of leadframe-based BGA packages Feb. 16, 2010
7649250 Semiconductor package Jan. 19, 2010
7645637 Methods for assembling thin semiconductor die Jan. 12, 2010
7642639 COB type IC package to enhanced bondibility of bumps embedded in substrate and method for fabricating the same Jan. 5, 2010
7638419 Method of fabricating a via attached to a bond pad utilizing a tapered interconnect Dec. 29, 2009
7629686 Bumped die and wire bonded board-on-chip package Dec. 8, 2009
7598600 Stackable power semiconductor package system Oct. 6, 2009

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