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Class Information
Number: 257/E23.039
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for conducting electric current to or from solid-state body in operation, e.g., leads, terminal arrangements (epo) > Consisting of soldered or bonded constructions (epo) > Lead frames or other flat leads (epo) > Characterized by die pad (epo) > Chip-on-leads or leads-on-chip techniques, i.e., inner lead fingers being used as die pad (epo)
Description: This subclass is indented under subclass E23.037. This subclass is substantially the same in scope as ECLA classification H01L23/495A4.

Patents under this class:

Patent Number Title Of Patent Date Issued
6537051 Encapsulation mold with a castellated inner surface Mar. 25, 2003
6537856 Method of attaching a semiconductor chip to a leadframe with a footprint of about the same size as the chip and packages formed thereby Mar. 25, 2003
6538200 Underfill coating for LOC package Mar. 25, 2003
6538898 Method and apparatus of die attachment for BOC and F/C surface mount Mar. 25, 2003
6534845 Semiconductor device Mar. 18, 2003
6534846 Lead frame for semiconductor device and semiconductor device using same Mar. 18, 2003
6534861 Ball grid substrate for lead-on-chip semiconductor package Mar. 18, 2003
6535393 Electrical device allowing for increased device densities Mar. 18, 2003
6534342 Method of manufacturing LOC semiconductor assembled with room temperature adhesive Mar. 18, 2003
6531342 Method for transverse hybrid loc package Mar. 11, 2003
6531760 Semiconductor device Mar. 11, 2003
6531761 High density direct connect LOC assembly Mar. 11, 2003
6531765 Interdigitated capacitor design for integrated circuit lead frames and method Mar. 11, 2003
6528722 Ball grid array semiconductor package with exposed base layer Mar. 4, 2003
6528867 Integrated circuit devices including connection components mechanically and electrically attached to semiconductor dice Mar. 4, 2003
6523446 Punched adhesive tape for semiconductor, method of manufacturing lead frame with the adhesive tape, lead frame with the adhesive tape, and semiconductor device comprising the lead frame Feb. 25, 2003
6524891 Method of pressure curing for reducing voids in a die attach bondline and applications thereof Feb. 25, 2003
6525405 Leadless semiconductor product packaging apparatus having a window lid and method for packaging Feb. 25, 2003
6525411 Semiconductor package and method of fabricating the same Feb. 25, 2003
6521979 Member for semiconductor package and semiconductor package using the same, and fabrication method thereof Feb. 18, 2003
6521987 Plastic integrated circuit device package and method for making the package Feb. 18, 2003
6522020 Wafer-level package Feb. 18, 2003
6518652 Semiconductor package Feb. 11, 2003
6510976 Method for forming a flip chip semiconductor package Jan. 28, 2003
6512303 Flip chip adaptor package for bare die Jan. 28, 2003
6512304 Nickel-iron expansion contact for semiconductor die Jan. 28, 2003
6506625 Semiconductor package having stacked dice and leadframes and method of fabrication Jan. 14, 2003
6506628 Method of attaching a leadframe to singulated semiconductor dice Jan. 14, 2003
6501170 Substrates and assemblies including pre-applied adhesion promoter Dec. 31, 2002
6501183 Semiconductor device and a method of manufacturing the same and an electronic device Dec. 31, 2002
6498391 Dual-chip integrated circuit package with unaligned chip arrangement and method of manufacturing the same Dec. 24, 2002
6495908 Multi-chip semiconductor package Dec. 17, 2002
6492713 Gravitationally assisted control of spread of viscous material applied to semiconductor assembly components Dec. 10, 2002
6489681 Gravitationally-assisted control of spread of viscous material applied to semiconductor assembly components Dec. 3, 2002
6489183 Method of manufacturing a taped semiconductor device Dec. 3, 2002
6489186 Adhesion enhanced semiconductor die for mold compound packaging Dec. 3, 2002
6489557 Implementing micro BGA.TM. assembly techniques for small die Dec. 3, 2002
6484922 Apparatus and method of clamping semiconductor devices using sliding finger supports Nov. 26, 2002
6485778 Method of applying an adhesive material to lead fingers of a lead frame Nov. 26, 2002
6486004 Method and apparatus for application of spray adhesive to a leadframe for chip bonding Nov. 26, 2002
6486539 Compression layer on the leadframe to reduce stress defects Nov. 26, 2002
6482680 Flip-chip on lead frame Nov. 19, 2002
6483044 Interconnecting substrates for electrical coupling of microelectronic components Nov. 19, 2002
6479322 Semiconductor device with two stacked chips in one resin body and method of producing Nov. 12, 2002
6474532 Apparatus for forming wire bonds from circuitry on a substrate to a semiconductor chip, and methods of forming semiconductor chip assemblies Nov. 5, 2002
6476468 Transverse hybrid LOC package Nov. 5, 2002
6476507 Resin sealing method and resin sealing apparatus Nov. 5, 2002
6472725 Technique for attaching die to leads Oct. 29, 2002
6472731 Solder clad lead frame for assembly of semiconductor devices and method Oct. 29, 2002

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