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Class Information
Number: 257/E23.039
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for conducting electric current to or from solid-state body in operation, e.g., leads, terminal arrangements (epo) > Consisting of soldered or bonded constructions (epo) > Lead frames or other flat leads (epo) > Characterized by die pad (epo) > Chip-on-leads or leads-on-chip techniques, i.e., inner lead fingers being used as die pad (epo)
Description: This subclass is indented under subclass E23.037. This subclass is substantially the same in scope as ECLA classification H01L23/495A4.

Patents under this class:

Patent Number Title Of Patent Date Issued
5373188 Packaged semiconductor device including multiple semiconductor chips and cross-over lead Dec. 13, 1994
5371044 Method of uniformly encapsulating a semiconductor device in resin Dec. 6, 1994
5369056 Warp-resistent ultra-thin integrated circuit package fabrication method Nov. 29, 1994
5369058 Warp-resistent ultra-thin integrated circuit package fabrication method Nov. 29, 1994
5367124 Compliant lead for surface mounting a chip package to a substrate Nov. 22, 1994
5365113 Semiconductor device Nov. 15, 1994
5363279 Semiconductor package for a semiconductor chip having centrally located bottom bond pads Nov. 8, 1994
5358598 Folded bus bar leadframe and method of making Oct. 25, 1994
5358904 Semiconductor device Oct. 25, 1994
5358906 Method of making integrated circuit package containing inner leads with knurled surfaces Oct. 25, 1994
5359224 Insulated lead frame for integrated circuits and method of manufacture thereof Oct. 25, 1994
5357139 Plastic encapsulated semiconductor device and lead frame Oct. 18, 1994
5352851 Edge-mounted, surface-mount integrated circuit device Oct. 4, 1994
5347429 Plastic-molded-type semiconductor device Sep. 13, 1994
5334802 Method and configuration for reducing electrical noise in integrated circuit devices Aug. 2, 1994
5334803 Semiconductor device and method of producing the same Aug. 2, 1994
5334873 Semiconductor packages with centrally located electrode pads Aug. 2, 1994
5332922 Multi-chip semiconductor package Jul. 26, 1994
5331191 Semiconductor integrated circuit device, process for fabricating the same, and apparatus for fabricating the same Jul. 19, 1994
5331200 Lead-on-chip inner lead bonding lead frame method and apparatus Jul. 19, 1994
5331201 Semiconductor device having inner lead arrangement with enhanced stability Jul. 19, 1994
5327009 Miniaturized integrated circuit package Jul. 5, 1994
5319241 Lead frame without power buses for lead on chip package, and a semiconductor device with conductive tape power distribution Jun. 7, 1994
5313102 Integrated circuit device having a polyimide moisture barrier coating May. 17, 1994
5311057 Lead-on-chip semiconductor device and method for making the same May. 10, 1994
5308797 Leads for semiconductor chip assembly and method May. 3, 1994
5304737 Semiconductor package Apr. 19, 1994
5302849 Plastic and grid array semiconductor device and method for making the same Apr. 12, 1994
5303120 Method of manufacturing inversion type IC's and IC module using same Apr. 12, 1994
5299091 Packaged semiconductor device having heat dissipation/electrical connection bumps and method of manufacturing same Mar. 29, 1994
5299092 Plastic sealed type semiconductor apparatus Mar. 29, 1994
5295045 Plastic-molded-type semiconductor device and producing method therefor Mar. 15, 1994
5293065 Lead frame having an outlet with a larger cross sectional area than the inlet Mar. 8, 1994
5286679 Method for attaching a semiconductor die to a leadframe using a patterned adhesive layer Feb. 15, 1994
5286999 Folded bus bar leadframe Feb. 15, 1994
5287000 Resin-encapsulated semiconductor memory device useful for single in-line packages Feb. 15, 1994
5278101 Semiconductor device and method for manufacturing the same Jan. 11, 1994
5266834 Semiconductor device and an electronic device with the semiconductor devices mounted thereon Nov. 30, 1993
5256598 Shrink accommodating lead frame Oct. 26, 1993
5256903 Plastic encapsulated semiconductor device Oct. 26, 1993
5252853 Packaged semiconductor device having tab tape and particular power distribution lead structure Oct. 12, 1993
5252854 Semiconductor device having stacked lead structure Oct. 12, 1993
5250840 Semiconductor lead frame with a chip having bonding pads in a cross arrangement Oct. 5, 1993
5250841 Semiconductor device with test-only leads Oct. 5, 1993
5251168 Boundary cells for improving retention time in memory devices Oct. 5, 1993
5239199 Vertical lead-on-chip package Aug. 24, 1993
5234866 Semiconductor device and process for producing the same, and lead frame used in said process Aug. 10, 1993
5235207 Semiconductor device Aug. 10, 1993
5233220 Balanced capacitance lead frame for integrated circuits and integrated circuit device with separate conductive layer Aug. 3, 1993
5229329 Method of manufacturing insulated lead frame for integrated circuits Jul. 20, 1993

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