Resources Contact Us Home
Browse by Category: Main > Physics
Class Information
Number: 257/E23.039
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for conducting electric current to or from solid-state body in operation, e.g., leads, terminal arrangements (epo) > Consisting of soldered or bonded constructions (epo) > Lead frames or other flat leads (epo) > Characterized by die pad (epo) > Chip-on-leads or leads-on-chip techniques, i.e., inner lead fingers being used as die pad (epo)
Description: This subclass is indented under subclass E23.037. This subclass is substantially the same in scope as ECLA classification H01L23/495A4.

Patents under this class:

Patent Number Title Of Patent Date Issued
8022514 Integrated circuit package system with leadfinger support Sep. 20, 2011
8018041 Integrated circuit package system with offset stacked die Sep. 13, 2011
8008784 Package including a lead frame, a chip and a sealant Aug. 30, 2011
7989932 Semiconductor device Aug. 2, 2011
7985991 MOSFET package Jul. 26, 2011
7977775 Semiconductor device and manufacturing method of the same Jul. 12, 2011
7968996 Integrated circuit package system with supported stacked die Jun. 28, 2011
7960211 Semiconductor system-in-package and method for making the same Jun. 14, 2011
7952204 Semiconductor die packages with multiple integrated substrates, systems using the same, and methods using the same May. 31, 2011
7952198 BGA package with leads on chip May. 31, 2011
7944026 Semiconductor device May. 17, 2011
7939920 Multiple die integrated circuit package May. 10, 2011
7939918 Chip packages with covers May. 10, 2011
7932549 Carbon nanotube conductor for trench capacitors Apr. 26, 2011
7901988 Method for forming a package-on-package structure Mar. 8, 2011
7888185 Semiconductor device assemblies and systems including at least one conductive pathway extending around a side of at least one semiconductor device Feb. 15, 2011
7884454 Use of discrete conductive layer in semiconductor device to re-route bonding wires for semiconductor device package Feb. 8, 2011
7880313 Semiconductor flip chip package having substantially non-collapsible spacer Feb. 1, 2011
7879655 Semiconductor device and a manufacturing method of the same Feb. 1, 2011
7875964 Multi-chip semiconductor connector and method Jan. 25, 2011
7859089 Copper straps Dec. 28, 2010
7851896 Quad flat non-leaded chip package Dec. 14, 2010
7825523 Semiconductor chip having bond pads Nov. 2, 2010
7821124 Thin, thermally enhanced flip chip in a leaded molded package Oct. 26, 2010
7807502 Method for fabricating semiconductor packages with discrete components Oct. 5, 2010
7795710 Lead frame routed chip pads for semiconductor packages Sep. 14, 2010
7781900 Semiconductor device comprising a housing and a semiconductor chip partly embedded in a plastic housing composition, and method for producing the same Aug. 24, 2010
7768102 Semiconductor device Aug. 3, 2010
7755199 Flexible lead surface-mount semiconductor package Jul. 13, 2010
7755175 Multi-stack chip package with wired bonded chips Jul. 13, 2010
7745930 Semiconductor device packages with substrates for redistributing semiconductor device electrodes Jun. 29, 2010
7728422 Semiconductor package, integrated circuit cards incorporating the semiconductor package, and method of manufacturing the same Jun. 1, 2010
7728420 High current lead electrode for semiconductor device Jun. 1, 2010
7723831 Semiconductor package having die with recess and discrete component embedded within the recess May. 25, 2010
7714419 Integrated circuit package system with shielding May. 11, 2010
7705476 Integrated circuit package Apr. 27, 2010
7705469 Lead frame, semiconductor device using same and manufacturing method thereof Apr. 27, 2010
7675170 Removable wafer expander for die bonding equipment Mar. 9, 2010
7671453 Semiconductor device and method for producing the same Mar. 2, 2010
7662666 Method of processing wafer Feb. 16, 2010
7652357 Quad flat no-lead (QFN) packages Jan. 26, 2010
7638880 Chip package Dec. 29, 2009
7635910 Semiconductor package and method Dec. 22, 2009
7626249 Flex clip connector for semiconductor device Dec. 1, 2009
7622804 Semiconductor device and method of manufacturing the same Nov. 24, 2009
7619303 Integrated circuit package Nov. 17, 2009
7615851 Integrated circuit package system Nov. 10, 2009
7612457 Semiconductor device including a stress buffer Nov. 3, 2009
7586179 Wireless semiconductor package for efficient heat dissipation Sep. 8, 2009
7579680 Packaging system for semiconductor devices Aug. 25, 2009

  Recently Added Patents
Method and structure for forming ETSOI capacitors, diodes, resistors and back gate contacts
System, method and computer program product for efficient caching of hierarchical items
Image capture system and method
Circuit device for preventing radiation emission in portable terminal with two cameras
Flat panel crystal display employing simultaneous charging of main and subsidiary pixel electrodes
Compositions for inhibiting NADPH oxidase activity
Radio communication devices, information providers, methods for controlling a radio communication device and methods for controlling an information provider
  Randomly Featured Patents
Container for electrical components
Liquid junction photoelectrodes using amorphous silicon-based thin film semiconductor
Semiconductor component and method for the manufacture thereof
Bidirectional brush pressure source for magnetic read/write heads
Thermoplastic vulcanizates of carboxylated nitrile rubber and polyester thermoplastics
Token ring access control protocol circuit
System for minimizing the depolarization of a laser beam due to thermally induced birefringence
Ash tray with smoke filter
Recording and/or reproducing apparatus in which the position of head means relative to the record bearing medium is controlled between two positions
Human Sef isoforms and methods of using same for cancer diagnosis and gene therapy