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Class Information
Number: 257/E23.039
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for conducting electric current to or from solid-state body in operation, e.g., leads, terminal arrangements (epo) > Consisting of soldered or bonded constructions (epo) > Lead frames or other flat leads (epo) > Characterized by die pad (epo) > Chip-on-leads or leads-on-chip techniques, i.e., inner lead fingers being used as die pad (epo)
Description: This subclass is indented under subclass E23.037. This subclass is substantially the same in scope as ECLA classification H01L23/495A4.










Patents under this class:
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Patent Number Title Of Patent Date Issued
6150709 Grid array type lead frame having lead ends in different planes Nov. 21, 2000
6150710 Transverse hybrid LOC package Nov. 21, 2000
6150728 Semiconductor memory device having a pad arrangement with reduced occupying area Nov. 21, 2000
6150730 Chip-scale semiconductor package Nov. 21, 2000
6146918 Method of fabricating a semiconductor package Nov. 14, 2000
6146919 Package stack via bottom leaded plastic (BLP) packaging Nov. 14, 2000
6146922 Hybrid frame with lead-lock tape Nov. 14, 2000
6144088 Leadframe for semiconductor chips and semiconductor module having the lead frame Nov. 7, 2000
6144089 Inner-digitized bond fingers on bus bars of semiconductor device package Nov. 7, 2000
6140695 Compression layer on the leadframe to reduce stress defects Oct. 31, 2000
6137159 Lead on chip semiconductor device and method of fabricating the same Oct. 24, 2000
6137166 Semiconductor device Oct. 24, 2000
6133069 Method of manufacturing the electronic using the anode junction method Oct. 17, 2000
6133624 Semiconductor device utilizing a lead on chip structure Oct. 17, 2000
6130114 Semiconductor device Oct. 10, 2000
6130115 Plastic encapsulated semiconductor device and method of manufacturing the same Oct. 10, 2000
6130474 Leads under chip IC package Oct. 10, 2000
6127255 Semiconductor integrated circuit device, process for fabricating the same, and apparatus for fabricating the same Oct. 3, 2000
6122822 Method for balancing mold flow in encapsulating devices Sep. 26, 2000
6124150 Transverse hybrid LOC package Sep. 26, 2000
6118176 Stacked chip assembly utilizing a lead frame Sep. 12, 2000
6114627 Underfill coating for LOC package Sep. 5, 2000
6114751 Semiconductor device and electronic device Sep. 5, 2000
6114753 Circuit tape having adhesive film, semiconductor device, and a method for manufacturing the same Sep. 5, 2000
6114756 Interdigitated capacitor design for integrated circuit leadframes Sep. 5, 2000
6110761 Methods for simultaneously electrically and mechanically attaching lead frames to semiconductor dice and the resulting elements Aug. 29, 2000
6107675 Lead frame Aug. 22, 2000
6107677 Interdigitated leads-over-chip lead frame, device, and method for supporting an integrated circuit die Aug. 22, 2000
6104083 Lead frame used for semiconductor chips of different bit configurations Aug. 15, 2000
6101078 Semiconductor device with protection circuit Aug. 8, 2000
6096165 Method and apparatus for application of adhesive tape to semiconductor devices Aug. 1, 2000
6097081 Semiconductor device having adhesive between lead and chip Aug. 1, 2000
6097083 Semiconductor device which is crack resistant Aug. 1, 2000
6097098 Die interconnections using intermediate connection elements secured to the die face Aug. 1, 2000
6097100 Resin sealed semiconductor devices and a process for manufacturing the same Aug. 1, 2000
6093958 Lead-on-chip type semiconductor device having thin plate and method for manufacturing the same Jul. 25, 2000
6093969 Face-to-face (FTF) stacked assembly of substrate-on-bare-chip (SOBC) modules Jul. 25, 2000
6090644 Underfill coating for LOC package Jul. 18, 2000
6087006 Surface-protecting film and resin-sealed semiconductor device having said film Jul. 11, 2000
6087201 Method of manufacturing ball grid array electronic component Jul. 11, 2000
6087586 Chip scale package Jul. 11, 2000
6087718 Stacking type semiconductor chip package Jul. 11, 2000
6087722 Multi-chip package Jul. 11, 2000
6083768 Gravitationally-assisted control of spread of viscous material applied to semiconductor assembly components Jul. 4, 2000
6083777 Reduced stress LOC assembly Jul. 4, 2000
6084309 Semiconductor device and semiconductor device mounting structure Jul. 4, 2000
6081023 Semiconductor device Jun. 27, 2000
6081027 Integrated heat sink Jun. 27, 2000
6077724 Multi-chips semiconductor package and fabrication method Jun. 20, 2000
6075284 Stack package Jun. 13, 2000

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