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Class Information
Number: 257/E23.039
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for conducting electric current to or from solid-state body in operation, e.g., leads, terminal arrangements (epo) > Consisting of soldered or bonded constructions (epo) > Lead frames or other flat leads (epo) > Characterized by die pad (epo) > Chip-on-leads or leads-on-chip techniques, i.e., inner lead fingers being used as die pad (epo)
Description: This subclass is indented under subclass E23.037. This subclass is substantially the same in scope as ECLA classification H01L23/495A4.










Patents under this class:
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Patent Number Title Of Patent Date Issued
6225558 Chip size semiconductor package and fabrication method thereof May. 1, 2001
6225683 Die size-increasing integrated circuit leads and thermally enhanced leadframe May. 1, 2001
6221695 Method for fabricating a compression layer on the dead frame to reduce stress defects Apr. 24, 2001
6218202 Semiconductor device testing and burn-in methodology Apr. 17, 2001
6218216 Transverse hybrid LOC package Apr. 17, 2001
6213747 Package stack via bottom leaded plastic (BLP) packaging Apr. 10, 2001
6214641 Method of fabricating a multi-chip module Apr. 10, 2001
6215169 Semiconductor device with adhesive tape not overlapping an opening in the uppermost surface of the semiconductor element surface Apr. 10, 2001
6211053 Laser wire bonding for wire embedded dielectrics to integrated circuits Apr. 3, 2001
6211277 Encapsulating material and LOC structure semiconductor device using the same Apr. 3, 2001
6211573 Semiconductor device with an improved lead-chip adhesion structure and lead frame to be used therefor Apr. 3, 2001
6205654 Method of manufacturing a surface mount package Mar. 27, 2001
6208017 Semiconductor device with lead-on-chip structure Mar. 27, 2001
6208519 Thermally enhanced semiconductor package Mar. 27, 2001
6204552 Semiconductor device Mar. 20, 2001
6199743 Apparatuses for forming wire bonds from circuitry on a substrate to a semiconductor chip, and methods of forming semiconductor chip assemblies Mar. 13, 2001
6200831 Surface-protecting film and resin-sealed semiconductor device having said film Mar. 13, 2001
6200833 Method of attaching a leadframe to singulated semiconductor dice Mar. 13, 2001
6201186 Electronic component assembly and method of making the same Mar. 13, 2001
6201292 Resin-sealed semiconductor device, circuit member used therefor Mar. 13, 2001
6201297 Semiconductor device Mar. 13, 2001
6201304 Flip chip adaptor package for bare die Mar. 13, 2001
6198160 Surface mounted type semiconductor device with wrap-around external leads Mar. 6, 2001
6198162 Method and apparatus for a chip-on-board semiconductor module Mar. 6, 2001
6198171 Thermally enhanced quad flat non-lead package of semiconductor Mar. 6, 2001
6192956 Method and apparatus for application of spray adhesive to a leadframe for chip bonding Feb. 27, 2001
6194779 Plastic mold type semiconductor device Feb. 27, 2001
6189762 Apparatus and method of clamping semiconductor devices using sliding finger supports Feb. 20, 2001
6190939 Method of manufacturing a warp resistant thermally conductive circuit package Feb. 20, 2001
6190943 Chip scale packaging method Feb. 20, 2001
6190944 Stacked package for semiconductor device and fabrication method thereof, and apparatus for making the stacked package Feb. 20, 2001
6190945 Integrated heat sink Feb. 20, 2001
6188021 Package stack via bottom leaded plastic (BLP) packaging Feb. 13, 2001
6183589 Method for manufacturing lead-on-chip (LOC) semiconductor packages using liquid adhesive applied under the leads Feb. 6, 2001
6184067 Memory device with multiple input/output connections Feb. 6, 2001
6181000 Lead frame for ball grid array, semiconductor device having it, and process for producing it Jan. 30, 2001
6181003 Semiconductor device packaged in plastic package Jan. 30, 2001
6181009 Electronic component with a lead frame and insulating coating Jan. 30, 2001
6177719 Chip scale package of semiconductor Jan. 23, 2001
6177723 Integrated circuit package and flat plate molding process for integrated circuit package Jan. 23, 2001
6174752 Method and apparatus for epoxy loc die attachment Jan. 16, 2001
6175149 Mounting multiple semiconductor dies in a package Jan. 16, 2001
6168975 Method of forming extended lead package Jan. 2, 2001
6169324 Semiconductor integrated circuit device, process for fabricating the same, and apparatus for fabricating the same Jan. 2, 2001
6165819 Semiconductor device, method of producing semiconductor device and semiconductor device mounting structure Dec. 26, 2000
6166328 Package stack via bottom leaded plastic (BLP) packaging Dec. 26, 2000
6163068 Multi-chip semiconductor encapsulation method and its finished product Dec. 19, 2000
6153922 Semiconductor device Nov. 28, 2000
6153923 Semiconductor device Nov. 28, 2000
6148509 Method for supporting an integrated circuit die Nov. 21, 2000

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