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Class Information
Number: 257/E23.039
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for conducting electric current to or from solid-state body in operation, e.g., leads, terminal arrangements (epo) > Consisting of soldered or bonded constructions (epo) > Lead frames or other flat leads (epo) > Characterized by die pad (epo) > Chip-on-leads or leads-on-chip techniques, i.e., inner lead fingers being used as die pad (epo)
Description: This subclass is indented under subclass E23.037. This subclass is substantially the same in scope as ECLA classification H01L23/495A4.










Patents under this class:
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Patent Number Title Of Patent Date Issued
6372080 Process for fabricating a crack resistant resin encapsulated semiconductor chip package Apr. 16, 2002
6372859 Thermoresistance adhesive and semiconductor device using the same Apr. 16, 2002
6373127 Integrated capacitor on the back of a chip Apr. 16, 2002
6362426 Radiused leadframe Mar. 26, 2002
6358775 Multi-die semiconductor encapsulation method Mar. 19, 2002
6359221 Resin sealed semiconductor device, circuit member for use therein Mar. 19, 2002
6355507 Method of forming overmolded chip scale package and resulting product Mar. 12, 2002
6352422 Method and apparatus for epoxy loc die attachment Mar. 5, 2002
6346152 Method and apparatus for applying adhesives to a lead frame Feb. 12, 2002
RE37539 Sealed stacked arrangement of semiconductor devices Feb. 5, 2002
6344976 Interdigitated leads-over-chip lead frame device and method for supporting an integrated circuit die Feb. 5, 2002
6342412 Semiconductor integrated circuit device, process for fabricating the same, and apparatus for fabricating the same Jan. 29, 2002
6336973 Apparatus and method for modifying the configuration of an exposed surface of a viscous fluid Jan. 8, 2002
6336974 Apparatus and method for controlling the depth of immersion of a semiconductor element in an exposed surface of a viscous fluid Jan. 8, 2002
6337510 Stackable QFN semiconductor package Jan. 8, 2002
6337511 LOC semiconductor assembled with room temperature adhesive Jan. 8, 2002
6337521 Semiconductor device and a method of manufacturing the same Jan. 8, 2002
6335225 High density direct connect LOC assembly Jan. 1, 2002
6335227 Method of fabricating a lead-on-chip (LOC) semiconductor device Jan. 1, 2002
6331738 Semiconductor device having a BGA structure Dec. 18, 2001
6330158 Semiconductor package having heat sinks and method of fabrication Dec. 11, 2001
6325275 Bondhead lead clamp apparatus and method Dec. 4, 2001
6323545 Semiconductor device Nov. 27, 2001
6323551 Resin sealed-type semiconductor device and method of manufacturing the same Nov. 27, 2001
6320248 Lead frame and method of fabricating semiconductor device including the lead frame Nov. 20, 2001
6320251 Stackable package for an integrated circuit Nov. 20, 2001
6320259 Semiconductor device, and a manufacturing apparatus for a method of manufacturing the semiconductor device Nov. 20, 2001
6316292 Adhesion enhanced semiconductor die for mold compound packaging Nov. 13, 2001
6316823 LOC semiconductor assembled with room temperature adhesive Nov. 13, 2001
6312977 Method of attaching a leadframe to singulated semiconductor dice Nov. 6, 2001
6310288 Underfill coating for loc package Oct. 30, 2001
6310389 Semiconductor package Oct. 30, 2001
6310390 BGA package and method of fabrication Oct. 30, 2001
6310395 Electronic component with anodically bonded contact Oct. 30, 2001
6307254 Technique for attaching die to leads Oct. 23, 2001
6307257 Dual-chip integrated circuit package with a chip-die pad formed from leadframe leads Oct. 23, 2001
RE37413 Semiconductor package for a semiconductor chip having centrally located bottom bond pads Oct. 16, 2001
6302991 Method of producing a lead frame with composite film attached, and use of the lead frame Oct. 16, 2001
6303948 Pad layout and lead layout in semiconductor device Oct. 16, 2001
6303981 Semiconductor package having stacked dice and leadframes and method of fabrication Oct. 16, 2001
6303997 Thin, stackable semiconductor packages Oct. 16, 2001
6299057 Apparatus and method of clamping semiconductor devices using sliding finger supports Oct. 9, 2001
6300165 Ball grid substrate for lead-on-chip semiconductor package Oct. 9, 2001
6297076 Process for preparing a semiconductor wafer Oct. 2, 2001
6297544 Semiconductor device and method for manufacturing the same Oct. 2, 2001
6297545 Semiconductor device Oct. 2, 2001
6297546 Underfill coating for LOC package Oct. 2, 2001
6297547 Mounting multiple semiconductor dies in a package Oct. 2, 2001
6294824 Bonding support for leads-over-chip process Sep. 25, 2001
6290116 Bondhead lead clamp apparatus and method Sep. 18, 2001

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