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Class Information
Number: 257/E23.039
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for conducting electric current to or from solid-state body in operation, e.g., leads, terminal arrangements (epo) > Consisting of soldered or bonded constructions (epo) > Lead frames or other flat leads (epo) > Characterized by die pad (epo) > Chip-on-leads or leads-on-chip techniques, i.e., inner lead fingers being used as die pad (epo)
Description: This subclass is indented under subclass E23.037. This subclass is substantially the same in scope as ECLA classification H01L23/495A4.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7626249 |
Flex clip connector for semiconductor device |
Dec. 1, 2009 |
| 7622804 |
Semiconductor device and method of manufacturing the same |
Nov. 24, 2009 |
| 7619303 |
Integrated circuit package |
Nov. 17, 2009 |
| 7615851 |
Integrated circuit package system |
Nov. 10, 2009 |
| 7612457 |
Semiconductor device including a stress buffer |
Nov. 3, 2009 |
| 7586179 |
Wireless semiconductor package for efficient heat dissipation |
Sep. 8, 2009 |
| 7579680 |
Packaging system for semiconductor devices |
Aug. 25, 2009 |
| 7576416 |
Chip package having with asymmetric molding and turbulent plate downset design |
Aug. 18, 2009 |
| 7576440 |
Semiconductor chip having bond pads and multi-chip package |
Aug. 18, 2009 |
| 7563647 |
Integrated circuit package system with interconnect support |
Jul. 21, 2009 |
| 7554179 |
Multi-leadframe semiconductor package and method of manufacture |
Jun. 30, 2009 |
| 7547960 |
Structure of a lead-frame matrix of photoelectron devices |
Jun. 16, 2009 |
| 7547977 |
Semiconductor chip having bond pads |
Jun. 16, 2009 |
| 7545026 |
Electronic device comprising an integrated circuit |
Jun. 9, 2009 |
| 7541682 |
Semiconductor chip having bond pads |
Jun. 2, 2009 |
| 7541221 |
Integrated circuit package system with leadfinger support |
Jun. 2, 2009 |
| 7535085 |
Semiconductor package having improved adhesiveness and ground bonding |
May. 19, 2009 |
| 7531441 |
Method of manufacturing semiconductor device |
May. 12, 2009 |
| 7504733 |
Semiconductor die package |
Mar. 17, 2009 |
| 7479409 |
Integrated circuit package with elevated edge leadframe |
Jan. 20, 2009 |
| 7473996 |
Signal transfer film, display apparatus having the same and method of manufacturing the same |
Jan. 6, 2009 |
| 7466013 |
Semiconductor die structure featuring a triple pad organization |
Dec. 16, 2008 |
| 7466015 |
Supporting frame for surface-mount diode package |
Dec. 16, 2008 |
| 7453159 |
Semiconductor chip having bond pads |
Nov. 18, 2008 |
| 7446400 |
Chip package structure and fabricating method thereof |
Nov. 4, 2008 |
| 7446403 |
Carrier structure stacking system and method |
Nov. 4, 2008 |
| 7439611 |
Circuit board with auxiliary wiring configuration to suppress breakage during bonding process |
Oct. 21, 2008 |
| 7436049 |
Lead frame, semiconductor chip package using the lead frame, and method of manufacturing the semiconductor chip package |
Oct. 14, 2008 |
| 7414319 |
Semiconductor chip assembly with metal containment wall and solder terminal |
Aug. 19, 2008 |
| 7414303 |
Lead on chip semiconductor package |
Aug. 19, 2008 |
| 7413933 |
Integrated circuit package with leadframe locked encapsulation and method of manufacture therefor |
Aug. 19, 2008 |
| 7408244 |
Semiconductor package and stack arrangement thereof |
Aug. 5, 2008 |
| 7408243 |
High temperature package flip-chip bonding to ceramic |
Aug. 5, 2008 |
| 7405104 |
Lead frame and method of producing the same, and resin-encapsulated semiconductor device and method of producing the same |
Jul. 29, 2008 |
| 7400002 |
MOSFET package |
Jul. 15, 2008 |
| 7391102 |
Semiconductor apparatus configured with a lead frame having sufficient strenght to protect against external forces |
Jun. 24, 2008 |
| 7368806 |
Flip chip package with anti-floating structure |
May. 6, 2008 |
| 7368810 |
Invertible microfeature device packages |
May. 6, 2008 |
| 7339257 |
Semiconductor device in which semiconductor chip is mounted on lead frame |
Mar. 4, 2008 |
| 7332806 |
Thin, thermally enhanced molded package with leadframe having protruding region |
Feb. 19, 2008 |
| 7323769 |
High performance chip scale leadframe package with thermal dissipating structure and annular element and method of manufacturing package |
Jan. 29, 2008 |
| 7323361 |
Packaging system for semiconductor devices |
Jan. 29, 2008 |
| 7315086 |
Chip-on-board package having flip chip assembly structure and manufacturing method thereof |
Jan. 1, 2008 |
| 7282786 |
Semiconductor package and process for making the same |
Oct. 16, 2007 |
| 7274089 |
Integrated circuit package system with adhesive restraint |
Sep. 25, 2007 |
| 7259451 |
Invertible microfeature device packages |
Aug. 21, 2007 |
| 7247520 |
Microelectronic component assemblies and microelectronic component lead frame structures |
Jul. 24, 2007 |
| 7247937 |
Mounting pad structure for wire-bonding type lead frame packages |
Jul. 24, 2007 |
| 7247944 |
Connector assembly |
Jul. 24, 2007 |
| 7227249 |
Three-dimensional stacked semiconductor package with chips on opposite sides of lead |
Jun. 5, 2007 |
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