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Class Information
Number: 257/E23.039
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for conducting electric current to or from solid-state body in operation, e.g., leads, terminal arrangements (epo) > Consisting of soldered or bonded constructions (epo) > Lead frames or other flat leads (epo) > Characterized by die pad (epo) > Chip-on-leads or leads-on-chip techniques, i.e., inner lead fingers being used as die pad (epo)
Description: This subclass is indented under subclass E23.037. This subclass is substantially the same in scope as ECLA classification H01L23/495A4.










Patents under this class:

Patent Number Title Of Patent Date Issued
8709875 Power device and method of packaging same Apr. 29, 2014
8680668 Device including a semiconductor chip and metal foils Mar. 25, 2014
8674521 Semiconductor device package including a paste member Mar. 18, 2014
8642395 Method of making chip-on-lead package Feb. 4, 2014
8629564 Semiconductor electronic component and semiconductor device using the same Jan. 14, 2014
8629540 Apparatus and methods for packaging integrated circuit chips with antennas formed from package lead wires Jan. 14, 2014
8629537 Padless die support integrated circuit package system Jan. 14, 2014
8618643 Semiconductor device and lead frame used for the same Dec. 31, 2013
8541870 Semiconductor package utilizing tape to reinforce fixing of leads to die pad Sep. 24, 2013
8536686 Semiconductor device Sep. 17, 2013
8525310 Leadframe package for high-speed data rate applications Sep. 3, 2013
8518752 Integrated circuit packaging system with stackable package and method of manufacture thereof Aug. 27, 2013
8513784 Multi-layer lead frame package and method of fabrication Aug. 20, 2013
8492882 Semiconductor device and method of manufacturing same Jul. 23, 2013
8487454 Leadframe, semiconductor device, and method of manufacturing the same Jul. 16, 2013
8471373 Resin-sealed semiconductor device and method for fabricating the same Jun. 25, 2013
8455986 Mosfet package Jun. 4, 2013
8415779 Lead frame for semiconductor package Apr. 9, 2013
8378469 Apparatus and methods for packaging antennas with integrated circuit chips for millimeter wave applications Feb. 19, 2013
8344499 Chip-exposed semiconductor device Jan. 1, 2013
8314489 Semiconductor module and method for production thereof Nov. 20, 2012
8304869 Fan-in interposer on lead frame for an integrated circuit package on package system Nov. 6, 2012
8294258 Power semiconductor module Oct. 23, 2012
8294248 Chip on leads Oct. 23, 2012
8283771 Multi-die integrated circuit device and method Oct. 9, 2012
8269324 Integrated circuit package system with chip on lead Sep. 18, 2012
8269321 Low cost lead frame package and method for forming same Sep. 18, 2012
8268671 Semiconductor system-in-package and methods for making the same Sep. 18, 2012
8253239 Multi-chip semiconductor connector Aug. 28, 2012
8253224 Semiconductor package with metal straps Aug. 28, 2012
8212341 Apparatus and methods for packaging integrated circuit chips with antennas formed from package lead wires Jul. 3, 2012
8188583 Semiconductor device and method of manufacturing same May. 29, 2012
8188579 Semiconductor device including leadframe having power bars and increased I/O May. 29, 2012
8183687 Interposer for die stacking in semiconductor packages and the method of making the same May. 22, 2012
8183607 Semiconductor device May. 22, 2012
8174105 Stacked semiconductor package having discrete components May. 8, 2012
8174099 Leadless package with internally extended package leads May. 8, 2012
8158458 Power semiconductor module and method of manufacturing the same Apr. 17, 2012
8154111 Near chip size semiconductor package Apr. 10, 2012
8153480 Air cavity package for flip-chip Apr. 10, 2012
8143707 Semiconductor device Mar. 27, 2012
8125063 COL package having small chip hidden between leads Feb. 28, 2012
8115286 Integrated sensor including sensing and processing die mounted on opposite sides of package substrate Feb. 14, 2012
8097933 Flexible semiconductor package and method for fabricating the same Jan. 17, 2012
8067271 Integrated circuit package system with encapsulation lock Nov. 29, 2011
8063481 High-speed memory package Nov. 22, 2011
8053281 Method of forming a wafer level package Nov. 8, 2011
8049312 Semiconductor device package and method of assembly thereof Nov. 1, 2011
8039946 Chip package structure and fabricating method thereof Oct. 18, 2011
8022516 Metal leadframe package with secure feature Sep. 20, 2011











 
 
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