Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Browse by Category: Main > Physics
Class Information
Number: 257/E23.039
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for conducting electric current to or from solid-state body in operation, e.g., leads, terminal arrangements (epo) > Consisting of soldered or bonded constructions (epo) > Lead frames or other flat leads (epo) > Characterized by die pad (epo) > Chip-on-leads or leads-on-chip techniques, i.e., inner lead fingers being used as die pad (epo)
Description: This subclass is indented under subclass E23.037. This subclass is substantially the same in scope as ECLA classification H01L23/495A4.


Patents under this class:
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20

Patent Number Title Of Patent Date Issued
7626249 Flex clip connector for semiconductor device Dec. 1, 2009
7622804 Semiconductor device and method of manufacturing the same Nov. 24, 2009
7619303 Integrated circuit package Nov. 17, 2009
7615851 Integrated circuit package system Nov. 10, 2009
7612457 Semiconductor device including a stress buffer Nov. 3, 2009
7586179 Wireless semiconductor package for efficient heat dissipation Sep. 8, 2009
7579680 Packaging system for semiconductor devices Aug. 25, 2009
7576416 Chip package having with asymmetric molding and turbulent plate downset design Aug. 18, 2009
7576440 Semiconductor chip having bond pads and multi-chip package Aug. 18, 2009
7563647 Integrated circuit package system with interconnect support Jul. 21, 2009
7554179 Multi-leadframe semiconductor package and method of manufacture Jun. 30, 2009
7547960 Structure of a lead-frame matrix of photoelectron devices Jun. 16, 2009
7547977 Semiconductor chip having bond pads Jun. 16, 2009
7545026 Electronic device comprising an integrated circuit Jun. 9, 2009
7541682 Semiconductor chip having bond pads Jun. 2, 2009
7541221 Integrated circuit package system with leadfinger support Jun. 2, 2009
7535085 Semiconductor package having improved adhesiveness and ground bonding May. 19, 2009
7531441 Method of manufacturing semiconductor device May. 12, 2009
7504733 Semiconductor die package Mar. 17, 2009
7479409 Integrated circuit package with elevated edge leadframe Jan. 20, 2009
7473996 Signal transfer film, display apparatus having the same and method of manufacturing the same Jan. 6, 2009
7466013 Semiconductor die structure featuring a triple pad organization Dec. 16, 2008
7466015 Supporting frame for surface-mount diode package Dec. 16, 2008
7453159 Semiconductor chip having bond pads Nov. 18, 2008
7446400 Chip package structure and fabricating method thereof Nov. 4, 2008
7446403 Carrier structure stacking system and method Nov. 4, 2008
7439611 Circuit board with auxiliary wiring configuration to suppress breakage during bonding process Oct. 21, 2008
7436049 Lead frame, semiconductor chip package using the lead frame, and method of manufacturing the semiconductor chip package Oct. 14, 2008
7414319 Semiconductor chip assembly with metal containment wall and solder terminal Aug. 19, 2008
7414303 Lead on chip semiconductor package Aug. 19, 2008
7413933 Integrated circuit package with leadframe locked encapsulation and method of manufacture therefor Aug. 19, 2008
7408244 Semiconductor package and stack arrangement thereof Aug. 5, 2008
7408243 High temperature package flip-chip bonding to ceramic Aug. 5, 2008
7405104 Lead frame and method of producing the same, and resin-encapsulated semiconductor device and method of producing the same Jul. 29, 2008
7400002 MOSFET package Jul. 15, 2008
7391102 Semiconductor apparatus configured with a lead frame having sufficient strenght to protect against external forces Jun. 24, 2008
7368806 Flip chip package with anti-floating structure May. 6, 2008
7368810 Invertible microfeature device packages May. 6, 2008
7339257 Semiconductor device in which semiconductor chip is mounted on lead frame Mar. 4, 2008
7332806 Thin, thermally enhanced molded package with leadframe having protruding region Feb. 19, 2008
7323769 High performance chip scale leadframe package with thermal dissipating structure and annular element and method of manufacturing package Jan. 29, 2008
7323361 Packaging system for semiconductor devices Jan. 29, 2008
7315086 Chip-on-board package having flip chip assembly structure and manufacturing method thereof Jan. 1, 2008
7282786 Semiconductor package and process for making the same Oct. 16, 2007
7274089 Integrated circuit package system with adhesive restraint Sep. 25, 2007
7259451 Invertible microfeature device packages Aug. 21, 2007
7247520 Microelectronic component assemblies and microelectronic component lead frame structures Jul. 24, 2007
7247937 Mounting pad structure for wire-bonding type lead frame packages Jul. 24, 2007
7247944 Connector assembly Jul. 24, 2007
7227249 Three-dimensional stacked semiconductor package with chips on opposite sides of lead Jun. 5, 2007

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20


 
 
  Recently Added Patents
Method for manufacturing liquid-trapping bag for use in vacuum packaging
Method for computing patient radiation dose in computed tomography
Embedded NV memory and method of manufacturing the same
Apparatus and method of manufacture for paper framed reading glasses
Bearing structure
Content transfer system, content transfer method, content transmitting apparatus, content transmission method, content receiving apparatus, content reception method, and computer program
Method of operating memory cell providing internal power switching
  Randomly Featured Patents
7-acyl-3-(substituted carbamoyloxy) cephem compound
Fingered capacitor in an integrated circuit
Method of manufacturing display screen
Soft drink dispenser
Pneumatic thread and fiber feeding devices
Adjustable dumbbell holder stand
Electrical component package and packaged electrical component
Flexible, inline, point-of-use air/gas filter/dryer
Method for determination and control of the amounts of nitrogen dissolved in metallic liquid phases and device for its realization
Machine to make E-Z open pouch with flap and bulge