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Class Information
Number: 257/E23.039
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for conducting electric current to or from solid-state body in operation, e.g., leads, terminal arrangements (epo) > Consisting of soldered or bonded constructions (epo) > Lead frames or other flat leads (epo) > Characterized by die pad (epo) > Chip-on-leads or leads-on-chip techniques, i.e., inner lead fingers being used as die pad (epo)
Description: This subclass is indented under subclass E23.037. This subclass is substantially the same in scope as ECLA classification H01L23/495A4.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7453159 |
Semiconductor chip having bond pads |
Nov. 18, 2008 |
| 7446400 |
Chip package structure and fabricating method thereof |
Nov. 4, 2008 |
| 7446403 |
Carrier structure stacking system and method |
Nov. 4, 2008 |
| 7439611 |
Circuit board with auxiliary wiring configuration to suppress breakage during bonding process |
Oct. 21, 2008 |
| 7436049 |
Lead frame, semiconductor chip package using the lead frame, and method of manufacturing the semiconductor chip package |
Oct. 14, 2008 |
| 7414319 |
Semiconductor chip assembly with metal containment wall and solder terminal |
Aug. 19, 2008 |
| 7414303 |
Lead on chip semiconductor package |
Aug. 19, 2008 |
| 7413933 |
Integrated circuit package with leadframe locked encapsulation and method of manufacture therefor |
Aug. 19, 2008 |
| 7408243 |
High temperature package flip-chip bonding to ceramic |
Aug. 5, 2008 |
| 7408244 |
Semiconductor package and stack arrangement thereof |
Aug. 5, 2008 |
| 7405104 |
Lead frame and method of producing the same, and resin-encapsulated semiconductor device and method of producing the same |
Jul. 29, 2008 |
| 7400002 |
MOSFET package |
Jul. 15, 2008 |
| 7391102 |
Semiconductor apparatus configured with a lead frame having sufficient strenght to protect against external forces |
Jun. 24, 2008 |
| 7368806 |
Flip chip package with anti-floating structure |
May. 6, 2008 |
| 7368810 |
Invertible microfeature device packages |
May. 6, 2008 |
| 7339257 |
Semiconductor device in which semiconductor chip is mounted on lead frame |
Mar. 4, 2008 |
| 7332806 |
Thin, thermally enhanced molded package with leadframe having protruding region |
Feb. 19, 2008 |
| 7323361 |
Packaging system for semiconductor devices |
Jan. 29, 2008 |
| 7323769 |
High performance chip scale leadframe package with thermal dissipating structure and annular element and method of manufacturing package |
Jan. 29, 2008 |
| 7315086 |
Chip-on-board package having flip chip assembly structure and manufacturing method thereof |
Jan. 1, 2008 |
| 7282786 |
Semiconductor package and process for making the same |
Oct. 16, 2007 |
| 7274089 |
Integrated circuit package system with adhesive restraint |
Sep. 25, 2007 |
| 7259451 |
Invertible microfeature device packages |
Aug. 21, 2007 |
| 7247944 |
Connector assembly |
Jul. 24, 2007 |
| 7247937 |
Mounting pad structure for wire-bonding type lead frame packages |
Jul. 24, 2007 |
| 7247520 |
Microelectronic component assemblies and microelectronic component lead frame structures |
Jul. 24, 2007 |
| 7227198 |
Half-bridge package |
Jun. 5, 2007 |
| 7227251 |
Semiconductor device and a memory system including a plurality of IC chips in a common package |
Jun. 5, 2007 |
| 7227249 |
Three-dimensional stacked semiconductor package with chips on opposite sides of lead |
Jun. 5, 2007 |
| 7217599 |
Integrated circuit package with leadframe locked encapsulation and method of manufacture therefor |
May. 15, 2007 |
| 7199407 |
Semiconductor device |
Apr. 3, 2007 |
| 7196404 |
Motion detector and method of producing the same |
Mar. 27, 2007 |
| 7193303 |
Supporting frame for surface-mount diode package |
Mar. 20, 2007 |
| 7190060 |
Three-dimensional stacked semiconductor package device with bent and flat leads and method of making same |
Mar. 13, 2007 |
| 7183632 |
Surface-mountable light-emitting diode structural element |
Feb. 27, 2007 |
| 7180161 |
Lead frame for improving molding reliability and semiconductor package with the lead frame |
Feb. 20, 2007 |
| 7176568 |
Semiconductor device and its manufacturing method, electronic module, and electronic unit |
Feb. 13, 2007 |
| 7170161 |
In-process semiconductor packages with leadframe grid arrays |
Jan. 30, 2007 |
| 7161232 |
Apparatus and method for miniature semiconductor packages |
Jan. 9, 2007 |
| 7148578 |
Semiconductor multi-chip package |
Dec. 12, 2006 |
| 7138707 |
Semiconductor package including leads and conductive posts for providing increased functionality |
Nov. 21, 2006 |
| 7115978 |
Package Structure |
Oct. 3, 2006 |
| 7091588 |
Semiconductor device including primary and secondary side circuits on first and second substrates with capacitive insulation |
Aug. 15, 2006 |
| 7075173 |
Interposer including adhesive tape |
Jul. 11, 2006 |
| 7074651 |
Packaging method for integrated circuits |
Jul. 11, 2006 |
| 7067904 |
Flip-chip type quad flat package and leadframe |
Jun. 27, 2006 |
| 7061119 |
Tape attachment chip-on-board assemblies |
Jun. 13, 2006 |
| 7055241 |
Method of fabricating an integrated circuit package |
Jun. 6, 2006 |
| 7057280 |
Leadframe having lead locks to secure leads to encapsulant |
Jun. 6, 2006 |
| 7057281 |
Microelectronic component assemblies employing lead frames having reduced-thickness inner lengths |
Jun. 6, 2006 |
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