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Class Information
Number: 257/E23.038
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for conducting electric current to or from solid-state body in operation, e.g., leads, terminal arrangements (epo) > Consisting of soldered or bonded constructions (epo) > Lead frames or other flat leads (epo) > Characterized by die pad (epo) > Insulative substrate being used as die pad, e.g., ceramic, plastic (epo)
Description: This subclass is indented under subclass E23.037. This subclass is substantially the same in scope as ECLA classification H01L23/495A2.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7608917 |
Power semiconductor module |
Oct. 27, 2009 |
| 7408244 |
Semiconductor package and stack arrangement thereof |
Aug. 5, 2008 |
| 7230279 |
Memory card |
Jun. 12, 2007 |
| 7091595 |
Semiconductor device with semiconductor chip and rewiring layer and method for producing the same |
Aug. 15, 2006 |
| 6981585 |
Surface package type semiconductor package and method of producing semiconductor memory |
Jan. 3, 2006 |
| 6979596 |
Method of fabricating a tape having apertures under a lead frame for conventional IC packages |
Dec. 27, 2005 |
| 6967390 |
Electronic component and method of manufacturing same |
Nov. 22, 2005 |
| 6962836 |
Method of manufacturing a semiconductor device having leads stabilized during die mounting |
Nov. 8, 2005 |
| 6956282 |
Stabilizer/spacer for semiconductor device |
Oct. 18, 2005 |
| 6921966 |
Tape under frame for lead frame IC package assembly |
Jul. 26, 2005 |
| 6894372 |
Tape under frame for lead frame IC package assembly |
May. 17, 2005 |
| 6809405 |
Semiconductor device and method of manufacturing the same |
Oct. 26, 2004 |
| 6798060 |
Power device and direct aluminum bonded substrate thereof |
Sep. 28, 2004 |
| 6670216 |
Method for manufacturing a power semiconductor device and direct bonded substrate thereof |
Dec. 30, 2003 |
| 6661081 |
Semiconductor device and its manufacturing method |
Dec. 9, 2003 |
| 6630733 |
Integrated circuit package electrical enhancement |
Oct. 7, 2003 |
| 6518650 |
Tape under frame for lead frame IC package assembly |
Feb. 11, 2003 |
| 6498389 |
Ultra-thin semiconductor package device using a support tape |
Dec. 24, 2002 |
| 6443298 |
Surface package type semiconductor package and method of producing semiconductor memory |
Sep. 3, 2002 |
| 6329710 |
Integrated circuit package electrical enhancement |
Dec. 11, 2001 |
| 6306687 |
Tape under frame for conventional-type IC package assembly |
Oct. 23, 2001 |
| 6223893 |
Surface package type semiconductor package and method of producing semiconductor memory |
May. 1, 2001 |
| 6215177 |
Tape under frame for conventional-type IC package assembly |
Apr. 10, 2001 |
| 6143589 |
Tape under frame for conventional-type IC package assembly |
Nov. 7, 2000 |
| 6091133 |
Assembly of a semiconductor device and paddleless lead frame having tape extending between the lead fingers |
Jul. 18, 2000 |
| 6087720 |
Integrated circuit package electrical enhancement |
Jul. 11, 2000 |
| 6025651 |
Semiconductor package structures using epoxy molding compound pads and a method for fabricating the epoxy molding compound pads |
Feb. 15, 2000 |
| 5915166 |
Tape under frame for conventional-type IC package assembly |
Jun. 22, 1999 |
| 5907184 |
Integrated circuit package electrical enhancement |
May. 25, 1999 |
| 5780772 |
Solution to mold wire sweep in fine pitch devices |
Jul. 14, 1998 |
| 5729049 |
Tape under frame for conventional-type IC package assembly |
Mar. 17, 1998 |
| 5723903 |
Thin type semiconductor device, module structure using the device and method of mounting the device on board |
Mar. 3, 1998 |
| 5710457 |
Semiconductor integrated circuit |
Jan. 20, 1998 |
| 5633528 |
Lead frame structure for IC devices with strengthened encapsulation adhesion |
May. 27, 1997 |
| 5607059 |
Surface package type semiconductor package and method of producing semiconductor memory |
Mar. 4, 1997 |
| 5473192 |
Unitary silicon die module |
Dec. 5, 1995 |
| 5455454 |
Semiconductor lead frame having a down set support member formed by inwardly extending leads within a central aperture |
Oct. 3, 1995 |
| 5448105 |
Semiconductor device having a leadframe and metal substrate |
Sep. 5, 1995 |
| 5446313 |
Thin type semiconductor device and module structure using the device |
Aug. 29, 1995 |
| 5429992 |
Lead frame structure for IC devices with strengthened encapsulation adhesion |
Jul. 4, 1995 |
| 5403785 |
Process of fabrication IC chip package from an IC chip carrier substrate and a leadframe and the IC chip package fabricated thereby |
Apr. 4, 1995 |
| 5379187 |
Design for encapsulation of thermally enhanced integrated circuits |
Jan. 3, 1995 |
| 5365409 |
Integrated circuit package design having an intermediate die-attach substrate bonded to a leadframe |
Nov. 15, 1994 |
| 5357139 |
Plastic encapsulated semiconductor device and lead frame |
Oct. 18, 1994 |
| 5304842 |
Dissimilar adhesive die attach for semiconductor devices |
Apr. 19, 1994 |
| 5299097 |
Electronic part mounting board and semiconductor device using the same |
Mar. 29, 1994 |
| 5295297 |
Method of producing semiconductor memory |
Mar. 22, 1994 |
| 5274914 |
Method of producing surface package type semiconductor package |
Jan. 4, 1994 |
| 5256903 |
Plastic encapsulated semiconductor device |
Oct. 26, 1993 |
| 5252855 |
Lead frame having an anodic oxide film coating |
Oct. 12, 1993 |
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