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Class Information
Number: 257/E23.038
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for conducting electric current to or from solid-state body in operation, e.g., leads, terminal arrangements (epo) > Consisting of soldered or bonded constructions (epo) > Lead frames or other flat leads (epo) > Characterized by die pad (epo) > Insulative substrate being used as die pad, e.g., ceramic, plastic (epo)
Description: This subclass is indented under subclass E23.037. This subclass is substantially the same in scope as ECLA classification H01L23/495A2.










Patents under this class:
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Patent Number Title Of Patent Date Issued
8648458 Leadframe circuit and method therefor Feb. 11, 2014
8598034 Package-on-package system with through vias and method of manufacture thereof Dec. 3, 2013
8581372 Semiconductor storage device and a method of manufacturing the semiconductor storage device Nov. 12, 2013
8410587 Integrated circuit package system Apr. 2, 2013
8378470 Semiconductor device that performs signal transmission using induction coupling, method of said manufacturing semiconductor device, and lead frame thereof Feb. 19, 2013
8334601 Package-on-package system with through vias and method of manufacture thereof Dec. 18, 2012
8174105 Stacked semiconductor package having discrete components May. 8, 2012
8115286 Integrated sensor including sensing and processing die mounted on opposite sides of package substrate Feb. 14, 2012
8022517 Semiconductor chip package Sep. 20, 2011
8008786 Dynamic pad size to reduce solder fatigue Aug. 30, 2011
7986048 Package-on-package system with through vias and method of manufacture thereof Jul. 26, 2011
7964946 Semiconductor package having discrete components and system containing the package Jun. 21, 2011
7911039 Component arrangement comprising a carrier Mar. 22, 2011
7906377 Fabrication method of circuit board Mar. 15, 2011
7893527 Semiconductor plastic package and fabricating method thereof Feb. 22, 2011
7871863 Integrated circuit package system with multiple molding Jan. 18, 2011
7772104 Dynamic pad size to reduce solder fatigue Aug. 10, 2010
7745917 Compliant integrated circuit package substrate Jun. 29, 2010
7723831 Semiconductor package having die with recess and discrete component embedded within the recess May. 25, 2010
7649198 Nano-array and fabrication method thereof Jan. 19, 2010
7608917 Power semiconductor module Oct. 27, 2009
7408244 Semiconductor package and stack arrangement thereof Aug. 5, 2008
7230279 Memory card Jun. 12, 2007
7091595 Semiconductor device with semiconductor chip and rewiring layer and method for producing the same Aug. 15, 2006
6981585 Surface package type semiconductor package and method of producing semiconductor memory Jan. 3, 2006
6979596 Method of fabricating a tape having apertures under a lead frame for conventional IC packages Dec. 27, 2005
6967390 Electronic component and method of manufacturing same Nov. 22, 2005
6962836 Method of manufacturing a semiconductor device having leads stabilized during die mounting Nov. 8, 2005
6956282 Stabilizer/spacer for semiconductor device Oct. 18, 2005
6921966 Tape under frame for lead frame IC package assembly Jul. 26, 2005
6894372 Tape under frame for lead frame IC package assembly May. 17, 2005
6809405 Semiconductor device and method of manufacturing the same Oct. 26, 2004
6798060 Power device and direct aluminum bonded substrate thereof Sep. 28, 2004
6670216 Method for manufacturing a power semiconductor device and direct bonded substrate thereof Dec. 30, 2003
6661081 Semiconductor device and its manufacturing method Dec. 9, 2003
6630733 Integrated circuit package electrical enhancement Oct. 7, 2003
6518650 Tape under frame for lead frame IC package assembly Feb. 11, 2003
6498389 Ultra-thin semiconductor package device using a support tape Dec. 24, 2002
6443298 Surface package type semiconductor package and method of producing semiconductor memory Sep. 3, 2002
6329710 Integrated circuit package electrical enhancement Dec. 11, 2001
6306687 Tape under frame for conventional-type IC package assembly Oct. 23, 2001
6223893 Surface package type semiconductor package and method of producing semiconductor memory May. 1, 2001
6215177 Tape under frame for conventional-type IC package assembly Apr. 10, 2001
6143589 Tape under frame for conventional-type IC package assembly Nov. 7, 2000
6091133 Assembly of a semiconductor device and paddleless lead frame having tape extending between the lead fingers Jul. 18, 2000
6087720 Integrated circuit package electrical enhancement Jul. 11, 2000
6025651 Semiconductor package structures using epoxy molding compound pads and a method for fabricating the epoxy molding compound pads Feb. 15, 2000
5915166 Tape under frame for conventional-type IC package assembly Jun. 22, 1999
5907184 Integrated circuit package electrical enhancement May. 25, 1999
5780772 Solution to mold wire sweep in fine pitch devices Jul. 14, 1998

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