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Class Information
Number: 257/E23.037
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for conducting electric current to or from solid-state body in operation, e.g., leads, terminal arrangements (epo) > Consisting of soldered or bonded constructions (epo) > Lead frames or other flat leads (epo) > Characterized by die pad (epo)
Description: This subclass is indented under subclass E23.031. This subclass is substantially the same in scope as ECLA classification H01L23/495A.










Sub-classes under this class:

Class Number Class Name Patents
257/E23.039 Chip-on-leads or leads-on-chip techniques, i.e., inner lead fingers being used as die pad (epo) 1,086
257/E23.04 Having bonding material between chip and die pad (epo) 227
257/E23.038 Insulative substrate being used as die pad, e.g., ceramic, plastic (epo) 76


Patents under this class:
1 2 3 4 5 6 7 8 9 10 11 12

Patent Number Title Of Patent Date Issued
8709875 Power device and method of packaging same Apr. 29, 2014
8680661 Direct contact package for power transistors Mar. 25, 2014
8674487 Semiconductor packages with lead extensions and related methods Mar. 18, 2014
8669654 Integrated circuit packaging system with die paddle and method of manufacture thereof Mar. 11, 2014
8669646 Apparatus and method for grounding an IC package lid for EMI reduction Mar. 11, 2014
8664752 Semiconductor die package and method for making the same Mar. 4, 2014
8647974 Method of fabricating a semiconductor chip with supportive terminal pad Feb. 11, 2014
8648474 Lead frame land grid array Feb. 11, 2014
8643158 Semiconductor package and lead frame therefor Feb. 4, 2014
8624368 Quad flat non-leaded semiconductor package Jan. 7, 2014
8618641 Leadframe-based semiconductor package Dec. 31, 2013
8592961 Method of manufacturing a semiconductor device Nov. 26, 2013
8586414 Top exposed package and assembly method Nov. 19, 2013
8587112 Underbump metallurgy employing an electrolytic Cu / electorlytic Ni / electrolytic Cu stack Nov. 19, 2013
8575732 Leadframe based multi terminal IC package Nov. 5, 2013
8575736 Direct contact flip chip package with power transistors Nov. 5, 2013
8575737 Direct contact semiconductor package with power transistor Nov. 5, 2013
8569112 Integrated circuit packaging system with encapsulation and leadframe etching and method of manufacture thereof Oct. 29, 2013
8564110 Power device with bottom source electrode Oct. 22, 2013
8536688 Integrated circuit leadframe and fabrication method therefor Sep. 17, 2013
8536686 Semiconductor device Sep. 17, 2013
8536689 Integrated circuit package system with multi-surface die attach pad Sep. 17, 2013
8519533 Semiconductor device including a DC-DC converter with schottky barrier diode Aug. 27, 2013
8519525 Semiconductor encapsulation and method thereof Aug. 27, 2013
8519520 Semiconductor package of small footprint with a stack of lead frame die paddle sandwich between high-side and low-side MOSFETs and manufacturing method Aug. 27, 2013
8513785 Method of manufacturing a semiconductor device Aug. 20, 2013
8513787 Multi-die semiconductor package with one or more embedded die pads Aug. 20, 2013
8502393 Chip package and method for forming the same Aug. 6, 2013
8502362 Semiconductor package containing silicon-on-insulator die mounted in bump-on-leadframe manner to provide low thermal resistance Aug. 6, 2013
8492883 Semiconductor package having a cavity structure Jul. 23, 2013
8492906 Lead frame ball grid array with traces under die Jul. 23, 2013
8487451 Lead frame land grid array with routing connector trace under unit Jul. 16, 2013
8461694 Lead frame ball grid array with traces under die having interlocking features Jun. 11, 2013
8455988 Integrated circuit package system with bumped lead and nonbumped lead Jun. 4, 2013
8450837 Circuit device having an improved heat dissipitation, and the method of manufacturing the same May. 28, 2013
8445999 Direct contact leadless package May. 21, 2013
8421199 Semiconductor package structure Apr. 16, 2013
8399970 Semiconductor device attached to island having protrusion Mar. 19, 2013
8390105 Lead frame substrate, manufacturing method thereof, and semiconductor apparatus Mar. 5, 2013
8373258 Semiconductor device and production method thereof Feb. 12, 2013
8368192 Multi-chip memory package with a small substrate Feb. 5, 2013
8358001 Semiconductor device packages, redistribution structures, and manufacturing methods thereof Jan. 22, 2013
8334584 Integrated circuit packaging system with quad flat no-lead package and method of manufacture thereof Dec. 18, 2012
8319321 Leadless package for high current devices Nov. 27, 2012
8310060 Lead frame land grid array Nov. 13, 2012
8304890 Semiconductor device Nov. 6, 2012
8304871 Exposed die package for direct surface mounting Nov. 6, 2012
8304857 Semiconductor device Nov. 6, 2012
8299587 Lead frame package structure for side-by-side disposed chips Oct. 30, 2012
8294275 Chip package and method for forming the same Oct. 23, 2012

1 2 3 4 5 6 7 8 9 10 11 12










 
 
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