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Class Information
Number: 257/E23.037
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for conducting electric current to or from solid-state body in operation, e.g., leads, terminal arrangements (epo) > Consisting of soldered or bonded constructions (epo) > Lead frames or other flat leads (epo) > Characterized by die pad (epo)
Description: This subclass is indented under subclass E23.031. This subclass is substantially the same in scope as ECLA classification H01L23/495A.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7612439 |
Semiconductor package having improved thermal performance |
Nov. 3, 2009 |
| 7598599 |
Semiconductor package system with substrate having different bondable heights at lead finger tips |
Oct. 6, 2009 |
| 7586179 |
Wireless semiconductor package for efficient heat dissipation |
Sep. 8, 2009 |
| 7582951 |
Methods and apparatus for improved thermal performance and electromagnetic interference (EMI) shielding in leadframe integrated circuit (IC) packages |
Sep. 1, 2009 |
| 7576418 |
Lead frame structure and applications thereof |
Aug. 18, 2009 |
| 7545026 |
Electronic device comprising an integrated circuit |
Jun. 9, 2009 |
| 7535085 |
Semiconductor package having improved adhesiveness and ground bonding |
May. 19, 2009 |
| 7535084 |
Multi-chip package with a single die pad |
May. 19, 2009 |
| 7518250 |
Semiconductor device and a method for manufacturing of the same |
Apr. 14, 2009 |
| 7501700 |
Semiconductor power module having an electrically insulating heat sink and method of manufacturing the same |
Mar. 10, 2009 |
| 7466015 |
Supporting frame for surface-mount diode package |
Dec. 16, 2008 |
| 7466024 |
Multi-chip semiconductor device package |
Dec. 16, 2008 |
| 7459770 |
Lead frame structure having blocking surfaces and semiconductor package integrated with the lead frame structure |
Dec. 2, 2008 |
| 7459765 |
Semiconductor apparatus with decoupling capacitor |
Dec. 2, 2008 |
| 7456494 |
Surface mount electronic component and process for manufacturing same |
Nov. 25, 2008 |
| 7449774 |
Semiconductor power module having an electrically insulating heat sink and method of manufacturing the same |
Nov. 11, 2008 |
| 7446397 |
Leadless semiconductor package |
Nov. 4, 2008 |
| 7436049 |
Lead frame, semiconductor chip package using the lead frame, and method of manufacturing the semiconductor chip package |
Oct. 14, 2008 |
| 7432588 |
Semiconductor device and method of fabricating the same |
Oct. 7, 2008 |
| 7420265 |
Integrated circuit package system with integrated circuit support |
Sep. 2, 2008 |
| 7414302 |
Flashless lead frame with horizontal singulation |
Aug. 19, 2008 |
| 7408241 |
Semiconductor device with a recessed bond pad |
Aug. 5, 2008 |
| 7391120 |
Increasing the adhesion of an adhesive connection in housings |
Jun. 24, 2008 |
| 7345357 |
High density chip scale leadframe package and method of manufacturing the package |
Mar. 18, 2008 |
| 7332806 |
Thin, thermally enhanced molded package with leadframe having protruding region |
Feb. 19, 2008 |
| 7323765 |
Die attach paddle for mounting integrated circuit die |
Jan. 29, 2008 |
| 7298026 |
Large die package and method for the fabrication thereof |
Nov. 20, 2007 |
| 7282786 |
Semiconductor package and process for making the same |
Oct. 16, 2007 |
| 7274089 |
Integrated circuit package system with adhesive restraint |
Sep. 25, 2007 |
| 7274092 |
Semiconductor component and method of assembling the same |
Sep. 25, 2007 |
| 7274091 |
Semiconductor device and method of manufacturing a semiconductor device |
Sep. 25, 2007 |
| 7262491 |
Die pad for semiconductor packages and methods of making and using same |
Aug. 28, 2007 |
| 7259460 |
Wire bonding on thinned portions of a lead-frame configured for use in a micro-array integrated circuit package |
Aug. 21, 2007 |
| 7253503 |
Integrated circuit device packages and substrates for making the packages |
Aug. 7, 2007 |
| 7253506 |
Micro lead frame package |
Aug. 7, 2007 |
| 7242077 |
Leadframe with die pad |
Jul. 10, 2007 |
| 7232755 |
Process for fabricating pad frame and integrated circuit package |
Jun. 19, 2007 |
| 7227198 |
Half-bridge package |
Jun. 5, 2007 |
| 7215010 |
Device for packing electronic components using injection molding technology |
May. 8, 2007 |
| 7215012 |
Space-efficient package for laterally conducting device |
May. 8, 2007 |
| 7208818 |
Power semiconductor package |
Apr. 24, 2007 |
| 7193303 |
Supporting frame for surface-mount diode package |
Mar. 20, 2007 |
| 7190055 |
Lead frame and semiconductor device |
Mar. 13, 2007 |
| 7183632 |
Surface-mountable light-emitting diode structural element |
Feb. 27, 2007 |
| 7170168 |
Flip-chip semiconductor package with lead frame and method for fabricating the same |
Jan. 30, 2007 |
| 7164192 |
Semiconductor die package with reduced inductance and reduced die attach flow out |
Jan. 16, 2007 |
| 7115978 |
Package Structure |
Oct. 3, 2006 |
| 7087986 |
Solder pad configuration for use in a micro-array integrated circuit package |
Aug. 8, 2006 |
| 7064420 |
Integrated circuit leadframe with ground plane |
Jun. 20, 2006 |
| 7034382 |
Leadframe-based chip scale package |
Apr. 25, 2006 |
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