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Class Information
Number: 257/E23.036
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for conducting electric current to or from solid-state body in operation, e.g., leads, terminal arrangements (epo) > Consisting of soldered or bonded constructions (epo) > Lead frames or other flat leads (epo) > Additional leads (epo) > Additional leads being wiring board (epo)
Description: This subclass is indented under subclass E23.032. This subclass is substantially the same in scope as ECLA classification H01L23/495C8.










Patents under this class:
1 2 3 4

Patent Number Title Of Patent Date Issued
8546922 Wiring board Oct. 1, 2013
8502398 Wiring board, semiconductor apparatus and method of manufacturing them Aug. 6, 2013
8471392 Semiconductor apparatus and endoscope apparatus Jun. 25, 2013
8390105 Lead frame substrate, manufacturing method thereof, and semiconductor apparatus Mar. 5, 2013
8293547 Hybrid integrated circuit device Oct. 23, 2012
8258608 Lead frame and intermediate product of semiconductor device Sep. 4, 2012
8232634 Semiconductor device having a pin mounted heat sink Jul. 31, 2012
8198714 Method and system for configuring a transformer embedded in a multi-layer integrated circuit (IC) package Jun. 12, 2012
8115285 Advanced quad flat no lead chip package having a protective layer to enhance surface mounting and manufacturing methods thereof Feb. 14, 2012
8072052 Trench substrate Dec. 6, 2011
8049314 Integrated circuit package system with insulator over circuitry Nov. 1, 2011
8030743 Semiconductor package with an embedded printed circuit board and stacked die Oct. 4, 2011
8008759 Pre-molded clip structure Aug. 30, 2011
7936059 Lead frame packaging technique with reduced noise and cross-talk May. 3, 2011
7911038 Wiring board, semiconductor device using wiring board and their manufacturing methods Mar. 22, 2011
7851896 Quad flat non-leaded chip package Dec. 14, 2010
7795071 Semiconductor package for fine pitch miniaturization and manufacturing method thereof Sep. 14, 2010
7786563 Stacking multiple devices using single-piece interconnecting element Aug. 31, 2010
7768105 Pre-molded clip structure Aug. 3, 2010
7656032 Semiconductor chip mounting wiring board, manufacturing method for same, and semiconductor module Feb. 2, 2010
7626255 Device, system and electric element Dec. 1, 2009
7615853 Chip-stacked package structure having leadframe with multi-piece bus bar Nov. 10, 2009
7514796 Semiconductor chip capable of being laminated and a semiconductor device including the lamination of a plurality of semiconductor chips Apr. 7, 2009
7511369 BGA-scale stacks comprised of layers containing integrated circuit die and a method for making the same Mar. 31, 2009
7479691 Power semiconductor module having surface-mountable flat external contacts and method for producing the same Jan. 20, 2009
7473988 Wiring board construction including embedded ceramic capacitors(s) Jan. 6, 2009
7459776 Stacked die assembly having semiconductor die projecting beyond support Dec. 2, 2008
7345357 High density chip scale leadframe package and method of manufacturing the package Mar. 18, 2008
7323769 High performance chip scale leadframe package with thermal dissipating structure and annular element and method of manufacturing package Jan. 29, 2008
7230320 Electronic circuit device with reduced breaking and cracking Jun. 12, 2007
7217998 Semiconductor device having a heat-dissipation member May. 15, 2007
7199458 Stacked offset semiconductor package and method for fabricating Apr. 3, 2007
7132752 Semiconductor chip and semiconductor device including lamination of semiconductor chips Nov. 7, 2006
7132753 Stacked die assembly having semiconductor die overhanging support Nov. 7, 2006
7075173 Interposer including adhesive tape Jul. 11, 2006
7041537 Method for fabricating semiconductor component with on board capacitor May. 9, 2006
7019404 Multilayered circuit substrate, semiconductor device and method of producing same Mar. 28, 2006
7002248 Semiconductor components having multiple on board capacitors Feb. 21, 2006
6975024 Hybrid integrated circuit device and manufacturing method thereof Dec. 13, 2005
6949410 Flip chip in leaded molded package and method of manufacture thereof Sep. 27, 2005
6909167 Coupling spaced bond pads to a contact Jun. 21, 2005
6891248 Semiconductor component with on board capacitor May. 10, 2005
6879034 Semiconductor package including low temperature co-fired ceramic substrate Apr. 12, 2005
6836010 Semiconductor device include relay chip connecting semiconductor chip pads to external pads Dec. 28, 2004
6831352 Semiconductor package for high frequency performance Dec. 14, 2004
6812556 Multi-chip package semiconductor device having plural level interconnections Nov. 2, 2004
6796024 Method for making semiconductor device Sep. 28, 2004
6727575 Semiconductor device Apr. 27, 2004
6720642 Flip chip in leaded molded package and method of manufacture thereof Apr. 13, 2004
6710463 Electrically isolated power semiconductor package Mar. 23, 2004

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