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Class Information
Number: 257/E23.036
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for conducting electric current to or from solid-state body in operation, e.g., leads, terminal arrangements (epo) > Consisting of soldered or bonded constructions (epo) > Lead frames or other flat leads (epo) > Additional leads (epo) > Additional leads being wiring board (epo)
Description: This subclass is indented under subclass E23.032. This subclass is substantially the same in scope as ECLA classification H01L23/495C8.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7626255 |
Device, system and electric element |
Dec. 1, 2009 |
| 7615853 |
Chip-stacked package structure having leadframe with multi-piece bus bar |
Nov. 10, 2009 |
| 7514796 |
Semiconductor chip capable of being laminated and a semiconductor device including the lamination of a plurality of semiconductor chips |
Apr. 7, 2009 |
| 7511369 |
BGA-scale stacks comprised of layers containing integrated circuit die and a method for making the same |
Mar. 31, 2009 |
| 7479691 |
Power semiconductor module having surface-mountable flat external contacts and method for producing the same |
Jan. 20, 2009 |
| 7473988 |
Wiring board construction including embedded ceramic capacitors(s) |
Jan. 6, 2009 |
| 7459776 |
Stacked die assembly having semiconductor die projecting beyond support |
Dec. 2, 2008 |
| 7345357 |
High density chip scale leadframe package and method of manufacturing the package |
Mar. 18, 2008 |
| 7323769 |
High performance chip scale leadframe package with thermal dissipating structure and annular element and method of manufacturing package |
Jan. 29, 2008 |
| 7230320 |
Electronic circuit device with reduced breaking and cracking |
Jun. 12, 2007 |
| 7217998 |
Semiconductor device having a heat-dissipation member |
May. 15, 2007 |
| 7199458 |
Stacked offset semiconductor package and method for fabricating |
Apr. 3, 2007 |
| 7132752 |
Semiconductor chip and semiconductor device including lamination of semiconductor chips |
Nov. 7, 2006 |
| 7132753 |
Stacked die assembly having semiconductor die overhanging support |
Nov. 7, 2006 |
| 7075173 |
Interposer including adhesive tape |
Jul. 11, 2006 |
| 7041537 |
Method for fabricating semiconductor component with on board capacitor |
May. 9, 2006 |
| 7019404 |
Multilayered circuit substrate, semiconductor device and method of producing same |
Mar. 28, 2006 |
| 7002248 |
Semiconductor components having multiple on board capacitors |
Feb. 21, 2006 |
| 6975024 |
Hybrid integrated circuit device and manufacturing method thereof |
Dec. 13, 2005 |
| 6949410 |
Flip chip in leaded molded package and method of manufacture thereof |
Sep. 27, 2005 |
| 6909167 |
Coupling spaced bond pads to a contact |
Jun. 21, 2005 |
| 6891248 |
Semiconductor component with on board capacitor |
May. 10, 2005 |
| 6879034 |
Semiconductor package including low temperature co-fired ceramic substrate |
Apr. 12, 2005 |
| 6836010 |
Semiconductor device include relay chip connecting semiconductor chip pads to external pads |
Dec. 28, 2004 |
| 6831352 |
Semiconductor package for high frequency performance |
Dec. 14, 2004 |
| 6812556 |
Multi-chip package semiconductor device having plural level interconnections |
Nov. 2, 2004 |
| 6796024 |
Method for making semiconductor device |
Sep. 28, 2004 |
| 6727575 |
Semiconductor device |
Apr. 27, 2004 |
| 6720642 |
Flip chip in leaded molded package and method of manufacture thereof |
Apr. 13, 2004 |
| 6710463 |
Electrically isolated power semiconductor package |
Mar. 23, 2004 |
| 6690089 |
Semiconductor device having multi-chip package |
Feb. 10, 2004 |
| 6686651 |
Multi-layer leadframe structure |
Feb. 3, 2004 |
| 6670707 |
Integrated circuit chip |
Dec. 30, 2003 |
| 6593169 |
Method of making hybrid integrated circuit device |
Jul. 15, 2003 |
| 6580160 |
Coupling spaced bond pads to a contact |
Jun. 17, 2003 |
| 6559536 |
Semiconductor device having a heat spreading plate |
May. 6, 2003 |
| 6534344 |
Integrated circuit chip and method for fabricating the same |
Mar. 18, 2003 |
| 6534343 |
Method of making electrically isolated power semiconductor package |
Mar. 18, 2003 |
| 6482674 |
Semiconductor package having metal foil die mounting plate |
Nov. 19, 2002 |
| 6455778 |
Micro-flex technology in semiconductor packages |
Sep. 24, 2002 |
| 6453547 |
Coupling spaced bond pads to a contact |
Sep. 24, 2002 |
| 6444490 |
Micro-flex technology in semiconductor packages |
Sep. 3, 2002 |
| 6429535 |
Integrated circuit chip and method for fabricating the same |
Aug. 6, 2002 |
| 6429514 |
Integrated circuit chip and method for fabricating the same |
Aug. 6, 2002 |
| 6404065 |
Electrically isolated power semiconductor package |
Jun. 11, 2002 |
| 6403402 |
Semiconductor chip having an underplate metal layer |
Jun. 11, 2002 |
| 6396132 |
Semiconductor device with improved interconnections between the chip and the terminals, and process for its manufacture |
May. 28, 2002 |
| 6369441 |
Method of producing a semiconductor chip having an underplate metal layer |
Apr. 9, 2002 |
| 6351025 |
Semiconductor chip having an underplate metal layer |
Feb. 26, 2002 |
| 6340839 |
Hybrid integrated circuit |
Jan. 22, 2002 |
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