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Class Information
Number: 257/E23.035
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for conducting electric current to or from solid-state body in operation, e.g., leads, terminal arrangements (epo) > Consisting of soldered or bonded constructions (epo) > Lead frames or other flat leads (epo) > Additional leads (epo) > Additional leads being multilayer (epo)
Description: This subclass is indented under subclass E23.032. This subclass is substantially the same in scope as ECLA classification H01L23/495C6.

Patents under this class:

Patent Number Title Of Patent Date Issued
8531030 IC device having electromigration resistant feed line structures Sep. 10, 2013
8525313 Chip assembly with frequency extending device Sep. 3, 2013
8039317 Aluminum leadframes for semiconductor QFN/SON devices Oct. 18, 2011
7952175 Lead frame, semiconductor package including the lead frame and method of forming the lead frame May. 31, 2011
7709937 Method of manufacturing semiconductor device May. 4, 2010
7656033 Semiconductor device with a semiconductor chip using lead technology and method of manufacturing the same Feb. 2, 2010
7608916 Aluminum leadframes for semiconductor QFN/SON devices Oct. 27, 2009
7368326 Methods and apparatus to reduce growth formations on plated conductive leads May. 6, 2008
7361976 Data carrier with a module with a reinforcement strip Apr. 22, 2008
7227240 Semiconductor device with wire bond inductor and method Jun. 5, 2007
6686651 Multi-layer leadframe structure Feb. 3, 2004
6620648 Multi-chip module with extension Sep. 16, 2003
6093957 Multilayer lead frame structure that reduces cross-talk and semiconductor package using same and fabrication method thereof Jul. 25, 2000
6002165 Multilayered lead frame for semiconductor packages Dec. 14, 1999
5977617 Semiconductor device having multilayer film carrier Nov. 2, 1999
5854094 Process for manufacturing metal plane support for multi-layer lead frames Dec. 29, 1998
5777265 Multilayer molded plastic package design Jul. 7, 1998
5726490 Semiconductor device Mar. 10, 1998
5704593 Film carrier tape for semiconductor package and semiconductor device employing the same Jan. 6, 1998
RE35353 Process for manufacturing a multi-layer lead frame Oct. 22, 1996
5559369 Ground plane for plastic encapsulated integrated circuit die packages Sep. 24, 1996
5410180 Metal plane support for multi-layer lead frames and a process for manufacturing such frames Apr. 25, 1995
5399809 Multi-layer lead frame for a semiconductor device Mar. 21, 1995
5309024 Multilayer package May. 3, 1994
5309021 Semiconductor device having particular power distribution interconnection arrangement May. 3, 1994
5304844 Semiconductor device and method of producing the same Apr. 19, 1994
5281556 Process for manufacturing a multi-layer lead frame having a ground plane and a power supply plane Jan. 25, 1994
5250839 Multi-layer leadframes, electrically conductive plates used therefor and production of such conductive plates Oct. 5, 1993
5250844 Multiple power/ground planes for tab Oct. 5, 1993
5243496 Molded case integrated circuit with a dynamic impedance reducing device Sep. 7, 1993
5237205 Ground plane for plastic encapsulated integrated circuit die packages Aug. 17, 1993
5235209 Multi-layer lead frame for a semiconductor device with contact geometry Aug. 10, 1993
5231756 Process for manufacturing a multi-layer lead frame Aug. 3, 1993
5227662 Composite lead frame and semiconductor device using the same Jul. 13, 1993
5212405 Composite lead frame May. 18, 1993
5208188 Process for making a multilayer lead frame assembly for an integrated circuit structure and multilayer integrated circuit die package formed by such process May. 4, 1993
5196725 High pin count and multi-layer wiring lead frame Mar. 23, 1993
5105257 Packaged semiconductor device and semiconductor device packaging element Apr. 14, 1992
5068708 Ground plane for plastic encapsulated integrated circuit die packages Nov. 26, 1991
5032895 Semiconductor device and method of producing the same Jul. 16, 1991
5025114 Multi-layer lead frames for integrated circuit packages Jun. 18, 1991
4994936 Molded integrated circuit package incorporating decoupling capacitor Feb. 19, 1991
4975761 High performance plastic encapsulated package for integrated circuit die Dec. 4, 1990
4891687 Multi-layer molded plastic IC package Jan. 2, 1990
4835120 Method of making a multilayer molded plastic IC package May. 30, 1989

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