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Class Information
Number: 257/E23.035
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for conducting electric current to or from solid-state body in operation, e.g., leads, terminal arrangements (epo) > Consisting of soldered or bonded constructions (epo) > Lead frames or other flat leads (epo) > Additional leads (epo) > Additional leads being multilayer (epo)
Description: This subclass is indented under subclass E23.032. This subclass is substantially the same in scope as ECLA classification H01L23/495C6.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7608916 |
Aluminum leadframes for semiconductor QFN/SON devices |
Oct. 27, 2009 |
| 7368326 |
Methods and apparatus to reduce growth formations on plated conductive leads |
May. 6, 2008 |
| 7361976 |
Data carrier with a module with a reinforcement strip |
Apr. 22, 2008 |
| 7227240 |
Semiconductor device with wire bond inductor and method |
Jun. 5, 2007 |
| 6686651 |
Multi-layer leadframe structure |
Feb. 3, 2004 |
| 6620648 |
Multi-chip module with extension |
Sep. 16, 2003 |
| 6093957 |
Multilayer lead frame structure that reduces cross-talk and semiconductor package using same and fabrication method thereof |
Jul. 25, 2000 |
| 6002165 |
Multilayered lead frame for semiconductor packages |
Dec. 14, 1999 |
| 5977617 |
Semiconductor device having multilayer film carrier |
Nov. 2, 1999 |
| 5854094 |
Process for manufacturing metal plane support for multi-layer lead frames |
Dec. 29, 1998 |
| 5777265 |
Multilayer molded plastic package design |
Jul. 7, 1998 |
| 5726490 |
Semiconductor device |
Mar. 10, 1998 |
| 5704593 |
Film carrier tape for semiconductor package and semiconductor device employing the same |
Jan. 6, 1998 |
| RE35353 |
Process for manufacturing a multi-layer lead frame |
Oct. 22, 1996 |
| 5559369 |
Ground plane for plastic encapsulated integrated circuit die packages |
Sep. 24, 1996 |
| 5410180 |
Metal plane support for multi-layer lead frames and a process for manufacturing such frames |
Apr. 25, 1995 |
| 5399809 |
Multi-layer lead frame for a semiconductor device |
Mar. 21, 1995 |
| 5309024 |
Multilayer package |
May. 3, 1994 |
| 5309021 |
Semiconductor device having particular power distribution interconnection arrangement |
May. 3, 1994 |
| 5304844 |
Semiconductor device and method of producing the same |
Apr. 19, 1994 |
| 5281556 |
Process for manufacturing a multi-layer lead frame having a ground plane and a power supply plane |
Jan. 25, 1994 |
| 5250844 |
Multiple power/ground planes for tab |
Oct. 5, 1993 |
| 5250839 |
Multi-layer leadframes, electrically conductive plates used therefor and production of such conductive plates |
Oct. 5, 1993 |
| 5243496 |
Molded case integrated circuit with a dynamic impedance reducing device |
Sep. 7, 1993 |
| 5237205 |
Ground plane for plastic encapsulated integrated circuit die packages |
Aug. 17, 1993 |
| 5235209 |
Multi-layer lead frame for a semiconductor device with contact geometry |
Aug. 10, 1993 |
| 5231756 |
Process for manufacturing a multi-layer lead frame |
Aug. 3, 1993 |
| 5227662 |
Composite lead frame and semiconductor device using the same |
Jul. 13, 1993 |
| 5212405 |
Composite lead frame |
May. 18, 1993 |
| 5208188 |
Process for making a multilayer lead frame assembly for an integrated circuit structure and multilayer integrated circuit die package formed by such process |
May. 4, 1993 |
| 5196725 |
High pin count and multi-layer wiring lead frame |
Mar. 23, 1993 |
| 5105257 |
Packaged semiconductor device and semiconductor device packaging element |
Apr. 14, 1992 |
| 5068708 |
Ground plane for plastic encapsulated integrated circuit die packages |
Nov. 26, 1991 |
| 5032895 |
Semiconductor device and method of producing the same |
Jul. 16, 1991 |
| 5025114 |
Multi-layer lead frames for integrated circuit packages |
Jun. 18, 1991 |
| 4994936 |
Molded integrated circuit package incorporating decoupling capacitor |
Feb. 19, 1991 |
| 4975761 |
High performance plastic encapsulated package for integrated circuit die |
Dec. 4, 1990 |
| 4891687 |
Multi-layer molded plastic IC package |
Jan. 2, 1990 |
| 4835120 |
Method of making a multilayer molded plastic IC package |
May. 30, 1989 |
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