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Class Information
Number: 257/E23.034
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for conducting electric current to or from solid-state body in operation, e.g., leads, terminal arrangements (epo) > Consisting of soldered or bonded constructions (epo) > Lead frames or other flat leads (epo) > Additional leads (epo) > Additional leads being tape carrier or flat leads (epo)
Description: This subclass is indented under subclass E23.032. This subclass is substantially the same in scope as ECLA classification H01L23/495C4.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7612457 |
Semiconductor device including a stress buffer |
Nov. 3, 2009 |
| 7598123 |
Semiconductor component and method of manufacture |
Oct. 6, 2009 |
| 7569920 |
Electronic component having at least one vertical semiconductor power transistor |
Aug. 4, 2009 |
| 7525181 |
Tape wiring substrate and tape package using the same |
Apr. 28, 2009 |
| 7525183 |
Surface mount multichip devices |
Apr. 28, 2009 |
| 7462887 |
Semiconductor connection component |
Dec. 9, 2008 |
| 7372142 |
Vertical conduction power electronic device package and corresponding assembling method |
May. 13, 2008 |
| 7341889 |
Lead frame for semiconductor package and method of fabricating semiconductor package |
Mar. 11, 2008 |
| 7332806 |
Thin, thermally enhanced molded package with leadframe having protruding region |
Feb. 19, 2008 |
| 7323364 |
Stacked module systems and method |
Jan. 29, 2008 |
| 7304371 |
Lead frame having a lead with a non-uniform width |
Dec. 4, 2007 |
| 7279778 |
Semiconductor package having a high-speed signal input/output terminal |
Oct. 9, 2007 |
| 7242078 |
Surface mount multichip devices |
Jul. 10, 2007 |
| 7224053 |
Semiconductor device responsive to different levels of input and output signals and signal processing system using the same |
May. 29, 2007 |
| 7091595 |
Semiconductor device with semiconductor chip and rewiring layer and method for producing the same |
Aug. 15, 2006 |
| 6919625 |
Surface mount multichip devices |
Jul. 19, 2005 |
| 6903447 |
Apparatus, methods and articles of manufacture for packaging an integrated circuit with internal matching |
Jun. 7, 2005 |
| 6903450 |
Semiconductor device and method of manufacturing the same |
Jun. 7, 2005 |
| 6873041 |
Power semiconductor package with strap |
Mar. 29, 2005 |
| 6857459 |
Wirefilm bonding for electronic component interconnection |
Feb. 22, 2005 |
| 6849930 |
Semiconductor device with uneven metal plate to improve adhesion to molding compound |
Feb. 1, 2005 |
| 6828658 |
Package for integrated circuit with internal matching |
Dec. 7, 2004 |
| 6800932 |
Package for semiconductor die containing symmetrical lead and heat sink |
Oct. 5, 2004 |
| 6777800 |
Semiconductor die package including drain clip |
Aug. 17, 2004 |
| 6768188 |
Semiconductor device |
Jul. 27, 2004 |
| 6747360 |
Conductive hardening resin for a semiconductor device and semiconductor device using the same |
Jun. 8, 2004 |
| 6723582 |
Method of making a semiconductor package having exposed metal strap |
Apr. 20, 2004 |
| 6709967 |
Laser wire bonding for wire embedded dielectrics to integrated circuits |
Mar. 23, 2004 |
| 6707138 |
Semiconductor device including metal strap electrically coupled between semiconductor die and metal leadframe |
Mar. 16, 2004 |
| 6692991 |
Resin-encapsulated semiconductor device and method for manufacturing the same |
Feb. 17, 2004 |
| 6633080 |
Semiconductor device |
Oct. 14, 2003 |
| 6630726 |
Power semiconductor package with strap |
Oct. 7, 2003 |
| 6613829 |
Conductive hardening resin for a semiconductor device and semiconductor device using the same |
Sep. 2, 2003 |
| 6608373 |
Support structure for power element |
Aug. 19, 2003 |
| 6569712 |
Structure of a ball-grid array package substrate and processes for producing thereof |
May. 27, 2003 |
| 6566739 |
Dual chip package |
May. 20, 2003 |
| 6566164 |
Exposed copper strap in a semiconductor package |
May. 20, 2003 |
| 6521982 |
Packaging high power integrated circuit devices |
Feb. 18, 2003 |
| 6498389 |
Ultra-thin semiconductor package device using a support tape |
Dec. 24, 2002 |
| 6475834 |
Method of manufacturing a semiconductor component and semiconductor component thereof |
Nov. 5, 2002 |
| 6459147 |
Attaching semiconductor dies to substrates with conductive straps |
Oct. 1, 2002 |
| 6455778 |
Micro-flex technology in semiconductor packages |
Sep. 24, 2002 |
| 6452802 |
Symmetrical package for semiconductor die |
Sep. 17, 2002 |
| 6444490 |
Micro-flex technology in semiconductor packages |
Sep. 3, 2002 |
| 6423580 |
Method for manufacturing a dual chip package |
Jul. 23, 2002 |
| 6414362 |
Power semiconductor device |
Jul. 2, 2002 |
| 6403402 |
Semiconductor chip having an underplate metal layer |
Jun. 11, 2002 |
| 6390853 |
Laser wire bonding for wire embedded dielectrics to integrated circuits |
May. 21, 2002 |
| 6369441 |
Method of producing a semiconductor chip having an underplate metal layer |
Apr. 9, 2002 |
| 6351025 |
Semiconductor chip having an underplate metal layer |
Feb. 26, 2002 |
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