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Class Information
Number: 257/E23.034
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for conducting electric current to or from solid-state body in operation, e.g., leads, terminal arrangements (epo) > Consisting of soldered or bonded constructions (epo) > Lead frames or other flat leads (epo) > Additional leads (epo) > Additional leads being tape carrier or flat leads (epo)
Description: This subclass is indented under subclass E23.032. This subclass is substantially the same in scope as ECLA classification H01L23/495C4.

Patents under this class:
1 2 3 4

Patent Number Title Of Patent Date Issued
8629537 Padless die support integrated circuit package system Jan. 14, 2014
8618642 Semiconductor device Dec. 31, 2013
8581378 Semiconductor device and method of manufacturing the same Nov. 12, 2013
8575735 Semiconductor chip and film and TAB package comprising the chip and film Nov. 5, 2013
8525313 Chip assembly with frequency extending device Sep. 3, 2013
8525305 Lead carrier with print-formed package components Sep. 3, 2013
8426980 Chip-to-chip multi-signaling communication system with common conductive layer Apr. 23, 2013
8269322 Tape wiring substrate and tape package using the same Sep. 18, 2012
8212342 Integrated circuit package system with removable backing element having plated terminal leads and method of manufacture thereof Jul. 3, 2012
8193622 Thermally enhanced thin semiconductor package Jun. 5, 2012
8188596 Multi-chip module May. 29, 2012
8063470 Method and apparatus for no lead semiconductor package Nov. 22, 2011
8030766 Semiconductor device Oct. 4, 2011
8022517 Semiconductor chip package Sep. 20, 2011
7928543 Tape wiring substrate and tape package using the same Apr. 19, 2011
7902647 TAB package connecting host device element Mar. 8, 2011
7880280 Electronic component and method for manufacturing an electronic component Feb. 1, 2011
7872345 Integrated circuit package system with rigid locking lead Jan. 18, 2011
7851896 Quad flat non-leaded chip package Dec. 14, 2010
7847380 Tape substrate and semiconductor module for smart card, method of fabricating the same, and smart card Dec. 7, 2010
7821124 Thin, thermally enhanced flip chip in a leaded molded package Oct. 26, 2010
7821115 Tape carrier package including a heat dissipation element Oct. 26, 2010
7804160 Ultrasonic bonding equipment for manufacturing semiconductor device, semiconductor device and its manufacturing method Sep. 28, 2010
7795071 Semiconductor package for fine pitch miniaturization and manufacturing method thereof Sep. 14, 2010
7786575 Stacked die semiconductor device having circuit tape Aug. 31, 2010
7745929 Semiconductor device and method for producing the same Jun. 29, 2010
7719027 Intergrated circuit utilizing down bond to define the function of the die and the implementing method thereof May. 18, 2010
7709947 Semiconductor device having semiconductor element with back electrode on insulating substrate May. 4, 2010
7696014 Method for breaking adhesive film mounted on back of wafer Apr. 13, 2010
7679173 Semiconductor device including a DC-DC converter Mar. 16, 2010
7663211 Dual side cooling integrated power device package and module with a clip attached to a leadframe in the package and the module and methods of manufacture Feb. 16, 2010
7659608 Stacked die semiconductor device having circuit tape Feb. 9, 2010
7649246 Tab package connecting host device element Jan. 19, 2010
7638863 Semiconductor package and method therefor Dec. 29, 2009
7626255 Device, system and electric element Dec. 1, 2009
7612457 Semiconductor device including a stress buffer Nov. 3, 2009
7598123 Semiconductor component and method of manufacture Oct. 6, 2009
7569920 Electronic component having at least one vertical semiconductor power transistor Aug. 4, 2009
7525183 Surface mount multichip devices Apr. 28, 2009
7525181 Tape wiring substrate and tape package using the same Apr. 28, 2009
7462887 Semiconductor connection component Dec. 9, 2008
7372142 Vertical conduction power electronic device package and corresponding assembling method May. 13, 2008
7341889 Lead frame for semiconductor package and method of fabricating semiconductor package Mar. 11, 2008
7332806 Thin, thermally enhanced molded package with leadframe having protruding region Feb. 19, 2008
7323364 Stacked module systems and method Jan. 29, 2008
7304371 Lead frame having a lead with a non-uniform width Dec. 4, 2007
7279778 Semiconductor package having a high-speed signal input/output terminal Oct. 9, 2007
7242078 Surface mount multichip devices Jul. 10, 2007
7224053 Semiconductor device responsive to different levels of input and output signals and signal processing system using the same May. 29, 2007
7091595 Semiconductor device with semiconductor chip and rewiring layer and method for producing the same Aug. 15, 2006

1 2 3 4

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