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Class Information
Number: 257/E23.033
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for conducting electric current to or from solid-state body in operation, e.g., leads, terminal arrangements (epo) > Consisting of soldered or bonded constructions (epo) > Lead frames or other flat leads (epo) > Additional leads (epo) > Additional leads being bump or wire (epo)
Description: This subclass is indented under subclass E23.032. This subclass is substantially the same in scope as ECLA classification H01L23/495C2.










Patents under this class:
1 2 3 4

Patent Number Title Of Patent Date Issued
8710637 Semiconductor device and method of manufacturing the same Apr. 29, 2014
8692370 Semiconductor device with copper wire ball-bonded to electrode pad including buffer layer Apr. 8, 2014
8692387 Stacked die semiconductor package Apr. 8, 2014
8664760 Connector design for packaging integrated circuits Mar. 4, 2014
8648458 Leadframe circuit and method therefor Feb. 11, 2014
8604596 Integrated circuit packaging system with locking interconnects and method of manufacture thereof Dec. 10, 2013
8571229 Semiconductor device Oct. 29, 2013
8536717 Integrated circuit package and method of assembling an integrated circuit package Sep. 17, 2013
8525306 Semiconductor device and method of manufacturing the same Sep. 3, 2013
8525313 Chip assembly with frequency extending device Sep. 3, 2013
8508024 Chip package structure and package substrate Aug. 13, 2013
8497571 Thin flip chip package structure Jul. 30, 2013
8487322 Luminous body with LED dies and production thereof Jul. 16, 2013
8481367 Method of manufacturing circuit device Jul. 9, 2013
8471372 Thin flip chip package structure Jun. 25, 2013
8471271 Light emitting diode package and method of manufacturing the same Jun. 25, 2013
8466449 Nitride semiconductor device Jun. 18, 2013
8461669 Integrated power converter package with die stacking Jun. 11, 2013
8446005 Semiconductor device having a bus configuration which reduces electromigration May. 21, 2013
8368191 Semiconductor device and manufacturing method of the same Feb. 5, 2013
8319337 Conductive structure for a semiconductor integrated circuit and method for forming the same Nov. 27, 2012
8304337 Integrated circuit packaging system with bond wire pads and method of manufacture thereof Nov. 6, 2012
8269345 Bump I/O contact for semiconductor device Sep. 18, 2012
8222720 Semiconductor device and manufacturing method thereof Jul. 17, 2012
8193618 Semiconductor die package with clip interconnection Jun. 5, 2012
8173454 Light emitting diode package and method of manufacturing the same May. 8, 2012
8169067 Low profile ball grid array (BGA) package with exposed die and method of making same May. 1, 2012
8169089 Semiconductor device including semiconductor chip and sealing material May. 1, 2012
8154110 Double-faced electrode package and its manufacturing method Apr. 10, 2012
8138080 Integrated circuit package system having interconnect stack and external interconnect Mar. 20, 2012
8129741 Light emitting diode package Mar. 6, 2012
8115214 Light emitting diode package and method of manufacturing the same Feb. 14, 2012
8105932 Mixed wire semiconductor lead frame package Jan. 31, 2012
8097958 Flip chip connection structure having powder-like conductive substance and method of producing the same Jan. 17, 2012
8076165 Method of manufacturing p-type nitride semiconductor and semiconductor device fabricated by the method Dec. 13, 2011
8039385 IC devices having TSVS including protruding tips having IMC blocking tip ends Oct. 18, 2011
7999365 Package for monolithic compound semiconductor (CSC) devices for DC to DC converters Aug. 16, 2011
7952204 Semiconductor die packages with multiple integrated substrates, systems using the same, and methods using the same May. 31, 2011
7948078 Semiconductor device May. 24, 2011
7919353 Semiconductor device and manufacturing method thereof Apr. 5, 2011
7884466 Semiconductor device with double-sided electrode structure and its manufacturing method Feb. 8, 2011
7868440 Packaged microdevices and methods for manufacturing packaged microdevices Jan. 11, 2011
7859076 Edge termination for semiconductor device Dec. 28, 2010
7846775 Universal lead frame for micro-array packages Dec. 7, 2010
7838981 Component assembly Nov. 23, 2010
7825527 Return loss techniques in wirebond packages for high-speed data communications Nov. 2, 2010
7825524 QFN housing having optimized connecting surface geometry Nov. 2, 2010
7825512 Electronic package with compliant electrically-conductive ball interconnect Nov. 2, 2010
7791185 Pin grid array package substrate including pins having curved pin heads Sep. 7, 2010
7759775 High current semiconductor power device SOIC package Jul. 20, 2010

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