| |
 |
|
Class Information
Number: 257/E23.033
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for conducting electric current to or from solid-state body in operation, e.g., leads, terminal arrangements (epo) > Consisting of soldered or bonded constructions (epo) > Lead frames or other flat leads (epo) > Additional leads (epo) > Additional leads being bump or wire (epo)
Description: This subclass is indented under subclass E23.032. This subclass is substantially the same in scope as ECLA classification H01L23/495C2.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7557454 |
Assemblies with bond pads of two or more semiconductor devices electrically connected to the same surface of a plurality of leads |
Jul. 7, 2009 |
| 7535014 |
Integrally gated carbon nanotube field ionizer device and method of manufacture therefor |
May. 19, 2009 |
| 7525179 |
Lead frame structure with aperture or groove for flip chip in a leaded molded package |
Apr. 28, 2009 |
| 7495320 |
System and method for providing a power bus in a wirebond leadframe package |
Feb. 24, 2009 |
| 7470581 |
Electromagnetic waveguide |
Dec. 30, 2008 |
| 7462887 |
Semiconductor connection component |
Dec. 9, 2008 |
| 7439612 |
Integrated circuit package structure with gap through lead bar between a die edge and an attachment point corresponding to a conductive connector |
Oct. 21, 2008 |
| 7394147 |
Semiconductor package |
Jul. 1, 2008 |
| 7391112 |
Capping copper bumps |
Jun. 24, 2008 |
| 7375417 |
NANO IC packaging |
May. 20, 2008 |
| 7371675 |
Method and apparatus for bonding a wire |
May. 13, 2008 |
| 7368806 |
Flip chip package with anti-floating structure |
May. 6, 2008 |
| 7274093 |
Semiconductor device connector, semiconductor device carrier, semiconductor device socket using the same and probe card |
Sep. 25, 2007 |
| 7247942 |
Techniques for joining an opto-electronic module to a semiconductor package |
Jul. 24, 2007 |
| 7190060 |
Three-dimensional stacked semiconductor package device with bent and flat leads and method of making same |
Mar. 13, 2007 |
| 7141869 |
Electronic package for image sensor, and the packaging method thereof |
Nov. 28, 2006 |
| 7138707 |
Semiconductor package including leads and conductive posts for providing increased functionality |
Nov. 21, 2006 |
| 7081666 |
Lead frame structure with aperture or groove for flip chip in a leaded molded package |
Jul. 25, 2006 |
| 7067904 |
Flip-chip type quad flat package and leadframe |
Jun. 27, 2006 |
| 7057281 |
Microelectronic component assemblies employing lead frames having reduced-thickness inner lengths |
Jun. 6, 2006 |
| 7053469 |
Leadless semiconductor package and manufacturing method thereof |
May. 30, 2006 |
| 7045903 |
Integrated power circuits with distributed bonding and current flow |
May. 16, 2006 |
| 7038315 |
Semiconductor chip package |
May. 2, 2006 |
| 7030469 |
Method of forming a semiconductor package and structure thereof |
Apr. 18, 2006 |
| 7002249 |
Microelectronic component with reduced parasitic inductance and method of fabricating |
Feb. 21, 2006 |
| 6991147 |
Insulated bonding wire tool for microelectronic packaging |
Jan. 31, 2006 |
| 6977211 |
Selective consolidation processes for electrically connecting contacts of semiconductor device components |
Dec. 20, 2005 |
| 6955949 |
System and method for reducing or eliminating semiconductor device wire sweep |
Oct. 18, 2005 |
| 6955941 |
Methods and apparatus for packaging semiconductor devices |
Oct. 18, 2005 |
| 6949814 |
Mounting material, semiconductor device and method of manufacturing semiconductor device |
Sep. 27, 2005 |
| 6940165 |
Impedance matched electrical interconnect using dielectric compounds |
Sep. 6, 2005 |
| 6936495 |
Method of making an optoelectronic semiconductor package device |
Aug. 30, 2005 |
| 6930380 |
Semiconductor device |
Aug. 16, 2005 |
| 6930377 |
Using adhesive materials as insulation coatings for leadless lead frame semiconductor packages |
Aug. 16, 2005 |
| 6908794 |
Method of making a semiconductor package device that includes a conductive trace with recessed and non-recessed portions |
Jun. 21, 2005 |
| 6903448 |
High performance leadframe in electronic package |
Jun. 7, 2005 |
| 6903440 |
Electronic component of a high frequency current suppression type and bonding wire for the same |
Jun. 7, 2005 |
| 6891276 |
Semiconductor package device |
May. 10, 2005 |
| 6867072 |
Flipchip QFN package and method therefor |
Mar. 15, 2005 |
| 6822340 |
Low capacitance coupling wire bonded semiconductor device |
Nov. 23, 2004 |
| 6815253 |
Stereolithographically fabricated conductive elements, semiconductor device components and assemblies including such conductive elements, and methods |
Nov. 9, 2004 |
| 6803651 |
Optoelectronic semiconductor package device |
Oct. 12, 2004 |
| 6787927 |
Semiconductor device and wire bonding apparatus |
Sep. 7, 2004 |
| 6780744 |
Stereolithographic methods for securing conductive elements to contacts of semiconductor device components |
Aug. 24, 2004 |
| 6774494 |
Semiconductor device and manufacturing method thereof |
Aug. 10, 2004 |
| 6774659 |
Method of testing a semiconductor package device |
Aug. 10, 2004 |
| 6767815 |
Stereolithographically fabricated conductive elements, semiconductor device components and assemblies including such conductive elements, and methods |
Jul. 27, 2004 |
| 6764933 |
Stereolithographically fabricated conductive elements, semiconductor device components and assemblies including such conductive elements, and methods |
Jul. 20, 2004 |
| 6764935 |
Stereolithographic methods for fabricating conductive elements |
Jul. 20, 2004 |
| 6744126 |
Multichip semiconductor package device |
Jun. 1, 2004 |
|
|
|
