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Class Information
Number: 257/E23.032
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for conducting electric current to or from solid-state body in operation, e.g., leads, terminal arrangements (epo) > Consisting of soldered or bonded constructions (epo) > Lead frames or other flat leads (epo) > Additional leads (epo)
Description: This subclass is indented under subclass E23.031. This subclass is substantially the same in scope as ECLA classification H01L23/495C.

Sub-classes under this class:

Class Number Class Name Patents
257/E23.033 Additional leads being bump or wire (epo) 163
257/E23.035 Additional leads being multilayer (epo) 45
257/E23.034 Additional leads being tape carrier or flat leads (epo) 159
257/E23.036 Additional leads being wiring board (epo) 199

Patents under this class:
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Patent Number Title Of Patent Date Issued
8686545 Semiconductor device and method for manufacturing the same Apr. 1, 2014
8575744 Semiconductor device and lead frame thereof Nov. 5, 2013
8571229 Semiconductor device Oct. 29, 2013
8531030 IC device having electromigration resistant feed line structures Sep. 10, 2013
8525313 Chip assembly with frequency extending device Sep. 3, 2013
8497160 Method for making solder-top enhanced semiconductor device of low parasitic packaging impedance Jul. 30, 2013
8487322 Luminous body with LED dies and production thereof Jul. 16, 2013
8471381 Complete power management system implemented in a single surface mount package Jun. 25, 2013
8471271 Light emitting diode package and method of manufacturing the same Jun. 25, 2013
8304339 Solder bump with inner core pillar in semiconductor package Nov. 6, 2012
8304294 Lead frame substrate and method of manufacturing the same Nov. 6, 2012
8269324 Integrated circuit package system with chip on lead Sep. 18, 2012
8237250 Advanced quad flat non-leaded package structure and manufacturing method thereof Aug. 7, 2012
8207597 Integrated circuit package system with flashless leads Jun. 26, 2012
8115214 Light emitting diode package and method of manufacturing the same Feb. 14, 2012
8039946 Chip package structure and fabricating method thereof Oct. 18, 2011
7999365 Package for monolithic compound semiconductor (CSC) devices for DC to DC converters Aug. 16, 2011
7986032 Semiconductor package system with substrate having different bondable heights at lead finger tips Jul. 26, 2011
7948078 Semiconductor device May. 24, 2011
7919848 Integrated circuit package system with multiple devices Apr. 5, 2011
7919838 Integrated circuit package system with encapsulation lock and method of manufacture thereof Apr. 5, 2011
7868460 Semiconductor package and method of manufacturing the same Jan. 11, 2011
7812447 Wafer level pre-packaged flip chip Oct. 12, 2010
7745908 Semiconductor component containing compound of aluminum, gallium, indium, arsenic, and antimony has mesa structure whose sides have passivation layer of compound of aluminum, gallium, arsenic, Jun. 29, 2010
7709937 Method of manufacturing semiconductor device May. 4, 2010
7662672 Manufacturing process of leadframe-based BGA packages Feb. 16, 2010
7619307 Leadframe-based semiconductor package having arched bend in a supporting bar and leadframe for the package Nov. 17, 2009
7598599 Semiconductor package system with substrate having different bondable heights at lead finger tips Oct. 6, 2009
7436053 Optical device and method for fabricating the same Oct. 14, 2008
7332803 Circuit device Feb. 19, 2008
7061079 Chip package structure and manufacturing method thereof Jun. 13, 2006
6903447 Apparatus, methods and articles of manufacture for packaging an integrated circuit with internal matching Jun. 7, 2005
6882032 Technique for attaching die to leads Apr. 19, 2005
6774479 Electronic device having a semiconductor chip on a semiconductor chip connection plate and a method for producing the electronic device Aug. 10, 2004
6768212 Semiconductor packages and methods for manufacturing such semiconductor packages Jul. 27, 2004
6555897 Assembly for attaching die to leads Apr. 29, 2003
6472725 Technique for attaching die to leads Oct. 29, 2002
6310389 Semiconductor package Oct. 30, 2001
6307254 Technique for attaching die to leads Oct. 23, 2001
6232213 Method of making a semiconductor chip package May. 15, 2001
6111308 Ground plane for plastic encapsulated integrated circuit die packages Aug. 29, 2000
6008541 Packaged integrated circuit device Dec. 28, 1999
5982026 Inexpensive resin molded semiconductor device Nov. 9, 1999
5945729 Technique for attaching die to leads Aug. 31, 1999
5844315 Low-profile microelectronic package Dec. 1, 1998
5807767 Technique for attaching die to leads Sep. 15, 1998
5804871 Lead on chip semiconductor device having bus bars and crossing leads Sep. 8, 1998
5773322 Molded encapsulated electronic component Jun. 30, 1998
5760464 Semiconductor device Jun. 2, 1998
5750421 Semiconductor device, carrier for carrying semiconductor device, and method of testing and producing semiconductor device May. 12, 1998

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