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Class Information
Number: 257/E23.032
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for conducting electric current to or from solid-state body in operation, e.g., leads, terminal arrangements (epo) > Consisting of soldered or bonded constructions (epo) > Lead frames or other flat leads (epo) > Additional leads (epo)
Description: This subclass is indented under subclass E23.031. This subclass is substantially the same in scope as ECLA classification H01L23/495C.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7619307 |
Leadframe-based semiconductor package having arched bend in a supporting bar and leadframe for the package |
Nov. 17, 2009 |
| 7598599 |
Semiconductor package system with substrate having different bondable heights at lead finger tips |
Oct. 6, 2009 |
| 7436053 |
Optical device and method for fabricating the same |
Oct. 14, 2008 |
| 7332803 |
Circuit device |
Feb. 19, 2008 |
| 7061079 |
Chip package structure and manufacturing method thereof |
Jun. 13, 2006 |
| 6903447 |
Apparatus, methods and articles of manufacture for packaging an integrated circuit with internal matching |
Jun. 7, 2005 |
| 6882032 |
Technique for attaching die to leads |
Apr. 19, 2005 |
| 6774479 |
Electronic device having a semiconductor chip on a semiconductor chip connection plate and a method for producing the electronic device |
Aug. 10, 2004 |
| 6768212 |
Semiconductor packages and methods for manufacturing such semiconductor packages |
Jul. 27, 2004 |
| 6555897 |
Assembly for attaching die to leads |
Apr. 29, 2003 |
| 6472725 |
Technique for attaching die to leads |
Oct. 29, 2002 |
| 6310389 |
Semiconductor package |
Oct. 30, 2001 |
| 6307254 |
Technique for attaching die to leads |
Oct. 23, 2001 |
| 6232213 |
Method of making a semiconductor chip package |
May. 15, 2001 |
| 6111308 |
Ground plane for plastic encapsulated integrated circuit die packages |
Aug. 29, 2000 |
| 6008541 |
Packaged integrated circuit device |
Dec. 28, 1999 |
| 5982026 |
Inexpensive resin molded semiconductor device |
Nov. 9, 1999 |
| 5945729 |
Technique for attaching die to leads |
Aug. 31, 1999 |
| 5844315 |
Low-profile microelectronic package |
Dec. 1, 1998 |
| 5807767 |
Technique for attaching die to leads |
Sep. 15, 1998 |
| 5804871 |
Lead on chip semiconductor device having bus bars and crossing leads |
Sep. 8, 1998 |
| 5773322 |
Molded encapsulated electronic component |
Jun. 30, 1998 |
| 5760464 |
Semiconductor device |
Jun. 2, 1998 |
| 5750421 |
Semiconductor device, carrier for carrying semiconductor device, and method of testing and producing semiconductor device |
May. 12, 1998 |
| 5736428 |
Process for manufacturing a semiconductor device having a stepped encapsulated package |
Apr. 7, 1998 |
| 5677566 |
Semiconductor chip package |
Oct. 14, 1997 |
| 5594626 |
Partially-molded, PCB chip carrier package for certain non-square die shapes |
Jan. 14, 1997 |
| 5569955 |
High density integrated circuit assembly combining leadframe leads with conductive traces |
Oct. 29, 1996 |
| 5559369 |
Ground plane for plastic encapsulated integrated circuit die packages |
Sep. 24, 1996 |
| 5557150 |
Overmolded semiconductor package |
Sep. 17, 1996 |
| 5550401 |
Lead on chip semiconductor device having bus bars and crossing leads |
Aug. 27, 1996 |
| 5508556 |
Leaded semiconductor device having accessible power supply pad terminals |
Apr. 16, 1996 |
| 5475259 |
Semiconductor device and carrier for carrying semiconductor device |
Dec. 12, 1995 |
| 5451812 |
Leadframe for semiconductor devices |
Sep. 19, 1995 |
| 5434750 |
Partially-molded, PCB chip carrier package for certain non-square die shapes |
Jul. 18, 1995 |
| 5430250 |
Wire support and guide |
Jul. 4, 1995 |
| 5403776 |
Process of using a jig to align and mount terminal conductors to a semiconductor plastic package |
Apr. 4, 1995 |
| 5376756 |
Wire support and guide |
Dec. 27, 1994 |
| 5369220 |
Wiring board having laminated wiring patterns |
Nov. 29, 1994 |
| 5360992 |
Two piece assembly for the selection of pinouts and bond options on a semiconductor device |
Nov. 1, 1994 |
| 5343074 |
Semiconductor device having voltage distribution ring(s) and method for making the same |
Aug. 30, 1994 |
| 5309021 |
Semiconductor device having particular power distribution interconnection arrangement |
May. 3, 1994 |
| 5300459 |
Method for reducing thermal stress in an encapsulated integrated circuit package |
Apr. 5, 1994 |
| 5293072 |
Semiconductor device having spherical terminals attached to the lead frame embedded within the package body |
Mar. 8, 1994 |
| 5281759 |
Semiconductor package |
Jan. 25, 1994 |
| 5262927 |
Partially-molded, PCB chip carrier package |
Nov. 16, 1993 |
| 5196725 |
High pin count and multi-layer wiring lead frame |
Mar. 23, 1993 |
| 5168368 |
Lead frame-chip package with improved configuration |
Dec. 1, 1992 |
| 5157480 |
Semiconductor device having dual electrical contact sites |
Oct. 20, 1992 |
| 5155660 |
Semiconductor device |
Oct. 13, 1992 |
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