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Class Information
Number: 257/E23.031
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for conducting electric current to or from solid-state body in operation, e.g., leads, terminal arrangements (epo) > Consisting of soldered or bonded constructions (epo) > Lead frames or other flat leads (epo)
Description: This subclass is indented under subclass E23.023. This subclass is substantially the same in scope as ECLA classification H01L23/495.

Sub-classes under this class:

Class Number Class Name Patents
257/E23.032 Additional leads (epo) 88
257/E23.052 Assembly of semiconductor devices on lead frame (epo) 663
257/E23.058 Battery in combination with lead frame (epo) 26
257/E23.057 Capacitor integral with or on lead frame (epo) 117
257/E23.037 Characterized by die pad (epo) 557
257/E23.053 Characterized by materials of lead frames or layers thereon (epo) 123
257/E23.055 Consisting of thin flexible metallic tape with or without film carrier (epo) 539
257/E23.043 Geometry of lead frame (epo) 719
257/E23.056 Insulating layers on lead frames (epo) 86
257/E23.041 Multilayer (epo) 94
257/E23.059 Oscillators in combination with lead frame (epo) 25
257/E23.042 Plurality of lead frames mounted in one device (epo) 213
257/E23.051 Specifically adapted to facilitate heat dissipation (epo) 320

Patents under this class:
1 2 3 4 5 6 7 8 9 10 11

Patent Number Title Of Patent Date Issued
8710645 Area reduction for surface mount package chips Apr. 29, 2014
8704345 Semiconductor package and lead frame thereof Apr. 22, 2014
8686547 Stack die structure for stress reduction and facilitation of electromagnetic shielding Apr. 1, 2014
8680668 Device including a semiconductor chip and metal foils Mar. 25, 2014
8673687 Etched hybrid die package Mar. 18, 2014
8674488 Light emitting diode (LED) packages Mar. 18, 2014
8659131 Structure for multi-row lead frame and semiconductor package capable of minimizing an under-cut Feb. 25, 2014
8653647 Plastic package and method of fabricating the same Feb. 18, 2014
8648451 Semiconductor package, test socket and related methods Feb. 11, 2014
8648452 Resin molded semiconductor device and manufacturing method thereof Feb. 11, 2014
8643153 Semiconductor device with staggered leads Feb. 4, 2014
8643156 Lead frame for assembling semiconductor device Feb. 4, 2014
8643158 Semiconductor package and lead frame therefor Feb. 4, 2014
8637974 Integrated circuit packaging system with tiebar-less design and method of manufacture thereof Jan. 28, 2014
8617933 Integrated circuit packaging system with interlock and method of manufacture thereof Dec. 31, 2013
8610237 Semiconductor apparatus Dec. 17, 2013
8592944 Semiconductor electronic device with an integrated device with an integrated galvanic isolator element and related assembly process Nov. 26, 2013
8592962 Semiconductor device packages with protective layer and related methods Nov. 26, 2013
8592967 Semiconductor apparatus and power supply circuit Nov. 26, 2013
8587101 Multi-chip module (MCM) power quad flat no-lead (PQFN) semiconductor package utilizing a leadframe for electrical interconnections Nov. 19, 2013
8581375 Leadframe-based mold array package heat spreader and fabrication method therefor Nov. 12, 2013
8581378 Semiconductor device and method of manufacturing the same Nov. 12, 2013
8571229 Semiconductor device Oct. 29, 2013
8558363 Lead frame substrate and method of manufacturing the same, and semiconductor device Oct. 15, 2013
8558358 Lead frame Oct. 15, 2013
8558357 Ultra thin image sensor package structure and method for fabrication Oct. 15, 2013
8557638 Integrated circuit packaging system with pad connection and method of manufacture thereof Oct. 15, 2013
8551820 Routable single layer substrate and semiconductor package including same Oct. 8, 2013
8536686 Semiconductor device Sep. 17, 2013
8525313 Chip assembly with frequency extending device Sep. 3, 2013
8525312 Area array quad flat no-lead (QFN) package Sep. 3, 2013
8525309 Flip-chip QFN structure using etched lead frame Sep. 3, 2013
8525305 Lead carrier with print-formed package components Sep. 3, 2013
8519517 Semiconductor system with fine pitch lead fingers and method of manufacturing thereof Aug. 27, 2013
8519521 Electronic device including a packaging substrate having a trench Aug. 27, 2013
8519526 Semiconductor package and fabrication method thereof Aug. 27, 2013
8502360 Resin sealing type semiconductor device and method of manufacturing the same, and resin sealing type electronic device Aug. 6, 2013
8502363 Semiconductor device packages with solder joint enhancement element and related methods Aug. 6, 2013
8497574 High power semiconductor package with conductive clips and flip chip driver IC Jul. 30, 2013
8497573 High power semiconductor package with conductive clip on multiple transistors Jul. 30, 2013
8492786 Light emitting device package and lighting system Jul. 23, 2013
8492884 Stacked interposer leadframes Jul. 23, 2013
8492885 Semiconductor storage device and manufacturing method thereof Jul. 23, 2013
8487417 Package for a power semiconductor device Jul. 16, 2013
8487322 Luminous body with LED dies and production thereof Jul. 16, 2013
8476747 Leadframe, leadframe type package and lead lane Jul. 2, 2013
8476772 Semiconductor device and method of forming base substrate with recesses for capturing bumped semiconductor die Jul. 2, 2013
8471381 Complete power management system implemented in a single surface mount package Jun. 25, 2013
8471373 Resin-sealed semiconductor device and method for fabricating the same Jun. 25, 2013
8471371 Semiconductor wiring assembly, semiconductor composite wiring assembly, and resin-sealed semiconductor device Jun. 25, 2013

1 2 3 4 5 6 7 8 9 10 11

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