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Class Information
Number: 257/E23.031
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for conducting electric current to or from solid-state body in operation, e.g., leads, terminal arrangements (epo) > Consisting of soldered or bonded constructions (epo) > Lead frames or other flat leads (epo)
Description: This subclass is indented under subclass E23.023. This subclass is substantially the same in scope as ECLA classification H01L23/495.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7619307 |
Leadframe-based semiconductor package having arched bend in a supporting bar and leadframe for the package |
Nov. 17, 2009 |
| 7615851 |
Integrated circuit package system |
Nov. 10, 2009 |
| 7615852 |
Semiconductor component in a housing with mechanically inforcing flat conductor webs |
Nov. 10, 2009 |
| 7615853 |
Chip-stacked package structure having leadframe with multi-piece bus bar |
Nov. 10, 2009 |
| 7612457 |
Semiconductor device including a stress buffer |
Nov. 3, 2009 |
| 7612438 |
Active matrix substrate with height control member |
Nov. 3, 2009 |
| 7612437 |
Thermally enhanced single inline package (SIP) |
Nov. 3, 2009 |
| 7612435 |
Method of packaging integrated circuits |
Nov. 3, 2009 |
| 7605452 |
Semiconductor light-emitting device, semiconductor light-emitting module, and method of manufacturing the semiconductor light-emitting module |
Oct. 20, 2009 |
| 7598605 |
Semiconductor device having capacitive insulation means and communication terminal using the device |
Oct. 6, 2009 |
| 7598604 |
Low profile semiconductor package |
Oct. 6, 2009 |
| 7598599 |
Semiconductor package system with substrate having different bondable heights at lead finger tips |
Oct. 6, 2009 |
| 7598101 |
LED of side view type and the method for manufacturing the same |
Oct. 6, 2009 |
| 7598600 |
Stackable power semiconductor package system |
Oct. 6, 2009 |
| 7595549 |
Surface mount semiconductor device |
Sep. 29, 2009 |
| 7592699 |
Hidden plating traces |
Sep. 22, 2009 |
| 7586179 |
Wireless semiconductor package for efficient heat dissipation |
Sep. 8, 2009 |
| 7579680 |
Packaging system for semiconductor devices |
Aug. 25, 2009 |
| 7576437 |
Printed circuit board of semiconductor package and method for mounting semiconductor package using the same |
Aug. 18, 2009 |
| 7572678 |
Methods of making and using a floating lead finger on a lead frame |
Aug. 11, 2009 |
| 7563647 |
Integrated circuit package system with interconnect support |
Jul. 21, 2009 |
| 7556986 |
Tape supported memory card leadframe structure |
Jul. 7, 2009 |
| 7556987 |
Method of fabricating an integrated circuit with etched ring and die paddle |
Jul. 7, 2009 |
| 7550827 |
Conductor frame for an electronic component and method for the production thereof |
Jun. 23, 2009 |
| 7547581 |
Manufacturing method of a semiconductor device to suppress generation of whiskers |
Jun. 16, 2009 |
| 7547960 |
Structure of a lead-frame matrix of photoelectron devices |
Jun. 16, 2009 |
| 7541664 |
Lead frame and semiconductor device having the lead frame |
Jun. 2, 2009 |
| 7535084 |
Multi-chip package with a single die pad |
May. 19, 2009 |
| 7531893 |
Power semiconductor devices having integrated inductor |
May. 12, 2009 |
| 7525183 |
Surface mount multichip devices |
Apr. 28, 2009 |
| 7521289 |
Package having dummy package substrate and method of fabricating the same |
Apr. 21, 2009 |
| 7511361 |
DFN semiconductor package having reduced electrical resistance |
Mar. 31, 2009 |
| 7498665 |
Integrated circuit leadless package system |
Mar. 3, 2009 |
| 7495320 |
System and method for providing a power bus in a wirebond leadframe package |
Feb. 24, 2009 |
| 7495326 |
Stacked electronic structures including offset substrates |
Feb. 24, 2009 |
| 7495327 |
Chip stacking structure |
Feb. 24, 2009 |
| 7479691 |
Power semiconductor module having surface-mountable flat external contacts and method for producing the same |
Jan. 20, 2009 |
| 7462925 |
Method and apparatus for stacking electrical components using via to provide interconnection |
Dec. 9, 2008 |
| 7462932 |
Manufacture of mountable capped chips |
Dec. 9, 2008 |
| 7456494 |
Surface mount electronic component and process for manufacturing same |
Nov. 25, 2008 |
| 7452803 |
Method for fabricating chip structure |
Nov. 18, 2008 |
| 7446400 |
Chip package structure and fabricating method thereof |
Nov. 4, 2008 |
| 7443013 |
Flexible substrate for package of die |
Oct. 28, 2008 |
| 7432584 |
Leadframe for use in a semiconductor package |
Oct. 7, 2008 |
| 7425756 |
Semiconductor device and electronic device |
Sep. 16, 2008 |
| 7420265 |
Integrated circuit package system with integrated circuit support |
Sep. 2, 2008 |
| 7414307 |
Electronic device and pressure sensor |
Aug. 19, 2008 |
| 7408244 |
Semiconductor package and stack arrangement thereof |
Aug. 5, 2008 |
| 7405467 |
Power module package structure |
Jul. 29, 2008 |
| 7402462 |
Folded frame carrier for MOSFET BGA |
Jul. 22, 2008 |
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