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Class Information
Number: 257/E23.03
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for conducting electric current to or from solid-state body in operation, e.g., leads, terminal arrangements (epo) > Consisting of soldered or bonded constructions (epo) > Bases or plates or solder therefor (epo) > Characterized by material (epo) > Carbon (epo)
Description: This subclass is indented under subclass E23.028. This subclass is substantially the same in scope as ECLA classification H01L23/492M3.

Patents under this class:

Patent Number Title Of Patent Date Issued
8614473 Flash memory with recessed floating gate Dec. 24, 2013
8569777 Lead frame unit, package structure and light emitting diode device having the same Oct. 29, 2013
8482050 Flash memory with recessed floating gate Jul. 9, 2013
8461645 Power semiconductor device Jun. 11, 2013
8455366 Use of an organic planarizing mask for cutting a plurality of gate lines Jun. 4, 2013
8420521 Method for fabricating stack structure of semiconductor packages Apr. 16, 2013
8391016 Carbon nanotube-reinforced solder caps, and chip packages and systems containing same Mar. 5, 2013
8367556 Use of an organic planarizing mask for cutting a plurality of gate lines Feb. 5, 2013
8138576 Production method and production apparatus of tin or solder alloy for electronic components, and solder alloy Mar. 20, 2012
7999365 Package for monolithic compound semiconductor (CSC) devices for DC to DC converters Aug. 16, 2011
7902662 Power core devices and methods of making thereof Mar. 8, 2011
7732912 Semiconductor chip packages and assemblies with chip carrier units Jun. 8, 2010
7713858 Carbon nanotube-solder composite structures for interconnects, process of making same, packages containing same, and systems containing same May. 11, 2010
7679178 Semiconductor package on which a semiconductor device can be stacked and fabrication method thereof Mar. 16, 2010
7598605 Semiconductor device having capacitive insulation means and communication terminal using the device Oct. 6, 2009
7573135 Electronic parts packaging structure in which a semiconductor chip is mounted on a wiring substrate and buried in an insulation film Aug. 11, 2009
7560372 Process for making a semiconductor device having a roughened surface Jul. 14, 2009
7372153 Integrated circuit package bond pad having plurality of conductive members May. 13, 2008
7314826 Semiconductor device and method of fabricating the same Jan. 1, 2008
7285862 Electronic parts packaging structure in which a semiconductor chip is mounted on a wiring substrate and buried in an insulation film Oct. 23, 2007
7268423 Flexible rewiring plate for semiconductor components, and process for producing it Sep. 11, 2007
6981090 Multiple use of microcontroller pad Dec. 27, 2005
5786633 Semiconductor module having high insulating power and high thermal conductivity Jul. 28, 1998
5675122 Sealable electronics packages Oct. 7, 1997
5506452 Power semiconductor component with pressure contact Apr. 9, 1996
5433260 Sealable electronics packages and methods of producing and sealing such packages Jul. 18, 1995
4500904 Semiconductor device Feb. 19, 1985
4470063 Copper matrix electrode having carbon fibers therein Sep. 4, 1984
4403242 Semiconductor device having a metal-fiber composite material electrode Sep. 6, 1983
4254548 Method of fabricating electrode plate for supporting semiconductor device Mar. 10, 1981
4226917 Composite joint system including composite structure of carbon fibers embedded in copper matrix Oct. 7, 1980
4213801 Ohmic contact of N-GaAs to electrical conductive substrates by controlled growth of N-GaAs polycrystalline layers Jul. 22, 1980
4196442 Semiconductor device Apr. 1, 1980

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