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Class Information
Number: 257/E23.03
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for conducting electric current to or from solid-state body in operation, e.g., leads, terminal arrangements (epo) > Consisting of soldered or bonded constructions (epo) > Bases or plates or solder therefor (epo) > Characterized by material (epo) > Carbon (epo)
Description: This subclass is indented under subclass E23.028. This subclass is substantially the same in scope as ECLA classification H01L23/492M3.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 8614473 |
Flash memory with recessed floating gate |
Dec. 24, 2013 |
| 8569777 |
Lead frame unit, package structure and light emitting diode device having the same |
Oct. 29, 2013 |
| 8482050 |
Flash memory with recessed floating gate |
Jul. 9, 2013 |
| 8461645 |
Power semiconductor device |
Jun. 11, 2013 |
| 8455366 |
Use of an organic planarizing mask for cutting a plurality of gate lines |
Jun. 4, 2013 |
| 8420521 |
Method for fabricating stack structure of semiconductor packages |
Apr. 16, 2013 |
| 8391016 |
Carbon nanotube-reinforced solder caps, and chip packages and systems containing same |
Mar. 5, 2013 |
| 8367556 |
Use of an organic planarizing mask for cutting a plurality of gate lines |
Feb. 5, 2013 |
| 8138576 |
Production method and production apparatus of tin or solder alloy for electronic components, and solder alloy |
Mar. 20, 2012 |
| 7999365 |
Package for monolithic compound semiconductor (CSC) devices for DC to DC converters |
Aug. 16, 2011 |
| 7902662 |
Power core devices and methods of making thereof |
Mar. 8, 2011 |
| 7732912 |
Semiconductor chip packages and assemblies with chip carrier units |
Jun. 8, 2010 |
| 7713858 |
Carbon nanotube-solder composite structures for interconnects, process of making same, packages containing same, and systems containing same |
May. 11, 2010 |
| 7679178 |
Semiconductor package on which a semiconductor device can be stacked and fabrication method thereof |
Mar. 16, 2010 |
| 7598605 |
Semiconductor device having capacitive insulation means and communication terminal using the device |
Oct. 6, 2009 |
| 7573135 |
Electronic parts packaging structure in which a semiconductor chip is mounted on a wiring substrate and buried in an insulation film |
Aug. 11, 2009 |
| 7560372 |
Process for making a semiconductor device having a roughened surface |
Jul. 14, 2009 |
| 7372153 |
Integrated circuit package bond pad having plurality of conductive members |
May. 13, 2008 |
| 7314826 |
Semiconductor device and method of fabricating the same |
Jan. 1, 2008 |
| 7285862 |
Electronic parts packaging structure in which a semiconductor chip is mounted on a wiring substrate and buried in an insulation film |
Oct. 23, 2007 |
| 7268423 |
Flexible rewiring plate for semiconductor components, and process for producing it |
Sep. 11, 2007 |
| 6981090 |
Multiple use of microcontroller pad |
Dec. 27, 2005 |
| 5786633 |
Semiconductor module having high insulating power and high thermal conductivity |
Jul. 28, 1998 |
| 5675122 |
Sealable electronics packages |
Oct. 7, 1997 |
| 5506452 |
Power semiconductor component with pressure contact |
Apr. 9, 1996 |
| 5433260 |
Sealable electronics packages and methods of producing and sealing such packages |
Jul. 18, 1995 |
| 4500904 |
Semiconductor device |
Feb. 19, 1985 |
| 4470063 |
Copper matrix electrode having carbon fibers therein |
Sep. 4, 1984 |
| 4403242 |
Semiconductor device having a metal-fiber composite material electrode |
Sep. 6, 1983 |
| 4254548 |
Method of fabricating electrode plate for supporting semiconductor device |
Mar. 10, 1981 |
| 4226917 |
Composite joint system including composite structure of carbon fibers embedded in copper matrix |
Oct. 7, 1980 |
| 4213801 |
Ohmic contact of N-GaAs to electrical conductive substrates by controlled growth of N-GaAs polycrystalline layers |
Jul. 22, 1980 |
| 4196442 |
Semiconductor device |
Apr. 1, 1980 |
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